TW200726291A - Capacitive microphone and method for making the same - Google Patents
Capacitive microphone and method for making the sameInfo
- Publication number
- TW200726291A TW200726291A TW094147532A TW94147532A TW200726291A TW 200726291 A TW200726291 A TW 200726291A TW 094147532 A TW094147532 A TW 094147532A TW 94147532 A TW94147532 A TW 94147532A TW 200726291 A TW200726291 A TW 200726291A
- Authority
- TW
- Taiwan
- Prior art keywords
- backplate
- diaphragm
- making
- distance
- same
- Prior art date
Links
- 239000012530 fluid Substances 0.000 abstract 1
- 239000003595 mist Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/4902—Electromagnet, transformer or inductor
- Y10T29/4908—Acoustic transducer
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094147532A TWI293851B (en) | 2005-12-30 | 2005-12-30 | Capacitive microphone and method for making the same |
US11/541,632 US7912235B2 (en) | 2005-12-30 | 2006-10-03 | Capacitive microphone and method for making the same |
US13/027,457 US8468665B2 (en) | 2005-12-30 | 2011-02-15 | Methods for making capacitive microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094147532A TWI293851B (en) | 2005-12-30 | 2005-12-30 | Capacitive microphone and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200726291A true TW200726291A (en) | 2007-07-01 |
TWI293851B TWI293851B (en) | 2008-02-21 |
Family
ID=38289919
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094147532A TWI293851B (en) | 2005-12-30 | 2005-12-30 | Capacitive microphone and method for making the same |
Country Status (2)
Country | Link |
---|---|
US (2) | US7912235B2 (zh) |
TW (1) | TWI293851B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425842B (zh) * | 2008-02-20 | 2014-02-01 | 無專用背板之矽麥克風 | |
TWI575963B (zh) * | 2014-02-27 | 2017-03-21 | 先技股份有限公司 | 微機電麥克風裝置 |
TWI607954B (zh) * | 2013-02-05 | 2017-12-11 | 羅伯特博斯奇股份有限公司 | 具有膜構造的微機械構件 |
CN108100988A (zh) * | 2017-12-19 | 2018-06-01 | 苏州工业园区纳米产业技术研究院有限公司 | 硅片背腔刻蚀方法及硅片器件 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102005004877A1 (de) * | 2005-02-03 | 2006-08-10 | Robert Bosch Gmbh | Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren |
US8644528B2 (en) * | 2007-02-20 | 2014-02-04 | Case Western Reserve University | Microfabricated microphone |
US8121315B2 (en) * | 2007-03-21 | 2012-02-21 | Goer Tek Inc. | Condenser microphone chip |
JP5029147B2 (ja) * | 2007-06-04 | 2012-09-19 | オムロン株式会社 | 音響センサ |
JP5034692B2 (ja) * | 2007-06-04 | 2012-09-26 | オムロン株式会社 | 音響センサ |
TW200919593A (en) * | 2007-10-18 | 2009-05-01 | Asia Pacific Microsystems Inc | Elements and modules with micro caps and wafer level packaging method thereof |
US8258591B2 (en) * | 2008-01-16 | 2012-09-04 | Solid State System Co., Ltd. | Micro-electro-mechanical systems (MEMS) device |
WO2009101757A1 (ja) * | 2008-02-14 | 2009-08-20 | Panasonic Corporation | コンデンサマイクロホン及びmemsデバイス |
JP2009231951A (ja) * | 2008-03-19 | 2009-10-08 | Panasonic Corp | マイクロホン装置 |
DE102008026886B4 (de) * | 2008-06-05 | 2016-04-28 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Strukturierung einer Nutzschicht eines Substrats |
US7951636B2 (en) * | 2008-09-22 | 2011-05-31 | Solid State System Co. Ltd. | Method for fabricating micro-electro-mechanical system (MEMS) device |
US8263426B2 (en) * | 2008-12-03 | 2012-09-11 | Electronics And Telecommunications Research Institute | High-sensitivity z-axis vibration sensor and method of fabricating the same |
CN101841756A (zh) * | 2010-03-29 | 2010-09-22 | 瑞声声学科技(深圳)有限公司 | 振膜及应用该振膜的硅电容麦克风 |
US8368153B2 (en) * | 2010-04-08 | 2013-02-05 | United Microelectronics Corp. | Wafer level package of MEMS microphone and manufacturing method thereof |
US8625823B2 (en) * | 2011-07-12 | 2014-01-07 | Robert Bosch Gmbh | MEMS microphone overtravel stop structure |
US9258652B2 (en) * | 2011-11-18 | 2016-02-09 | Chuan-Wei Wang | Microphone structure |
US8987842B2 (en) * | 2012-09-14 | 2015-03-24 | Solid State System Co., Ltd. | Microelectromechanical system (MEMS) device and fabrication method thereof |
US9338559B2 (en) * | 2013-04-16 | 2016-05-10 | Invensense, Inc. | Microphone system with a stop member |
DE102013224718A1 (de) * | 2013-12-03 | 2015-06-03 | Robert Bosch Gmbh | MEMS-Mikrofonbauelement und Vorrichtung mit einem solchen MEMS-Mikrofonbauelement |
JP6252767B2 (ja) * | 2014-03-14 | 2017-12-27 | オムロン株式会社 | 静電容量型トランスデューサ |
JP6311375B2 (ja) * | 2014-03-14 | 2018-04-18 | オムロン株式会社 | 静電容量型トランスデューサ |
US20150296306A1 (en) * | 2014-04-10 | 2015-10-15 | Knowles Electronics, Llc. | Mems motors having insulated substrates |
US9369804B2 (en) | 2014-07-28 | 2016-06-14 | Robert Bosch Gmbh | MEMS membrane overtravel stop |
CN105621346B (zh) * | 2014-11-04 | 2017-08-25 | 中芯国际集成电路制造(上海)有限公司 | Mems器件及其形成方法 |
KR101692717B1 (ko) * | 2015-12-01 | 2017-01-04 | 주식회사 비에스이센서스 | 정전용량형 멤스 마이크로폰 및 그 제조방법 |
CN106115602B (zh) * | 2016-07-01 | 2017-10-31 | 杭州士兰集成电路有限公司 | Mems器件及其制造方法 |
CN206341349U (zh) * | 2016-10-25 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | 麦克风 |
CN108124227B (zh) * | 2016-11-29 | 2020-04-28 | 中芯国际集成电路制造(北京)有限公司 | 麦克风及其制造方法 |
CN108313975B (zh) | 2017-01-16 | 2019-12-13 | 中芯国际集成电路制造(上海)有限公司 | 半导体装置及其制造方法 |
DE102017204006B3 (de) | 2017-03-10 | 2018-08-02 | Infineon Technologies Ag | MEMS-Schallwandler, MEMS-Mikrophon und Verfahren zum Bereitstellen eines MEMS-Schallwandlers |
DE102017209495B9 (de) | 2017-06-06 | 2022-11-10 | Infineon Technologies Ag | MEMS-Schallwandler, MEMS-Mikrofon und Verfahren zum Bereitstellen eines MEMS-Schallwandlers |
CN110012409A (zh) * | 2018-12-31 | 2019-07-12 | 瑞声科技(新加坡)有限公司 | Mems麦克风制造方法 |
CN111491244B (zh) * | 2020-03-16 | 2021-11-16 | 歌尔微电子有限公司 | 一种mems麦克风的加工方法和mems麦克风 |
CN112408312B (zh) * | 2021-01-20 | 2021-05-14 | 中芯集成电路制造(绍兴)有限公司 | Mems器件的制造方法及mems器件 |
CN216752082U (zh) * | 2021-12-20 | 2022-06-14 | 瑞声声学科技(深圳)有限公司 | Mems麦克风芯片 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5146435A (en) | 1989-12-04 | 1992-09-08 | The Charles Stark Draper Laboratory, Inc. | Acoustic transducer |
DE4329993A1 (de) | 1993-09-04 | 1995-03-09 | Sennheiser Electronic | Elektro-akustischer kapazitiver Wandler, insbesondere Elektret-Kondensator-Mikrofon |
US5889872A (en) | 1996-07-02 | 1999-03-30 | Motorola, Inc. | Capacitive microphone and method therefor |
JPH11127498A (ja) | 1997-08-13 | 1999-05-11 | Katsuro Matsumura | 静電容量型マイクロホン |
US6535460B2 (en) | 2000-08-11 | 2003-03-18 | Knowles Electronics, Llc | Miniature broadband acoustic transducer |
US6847090B2 (en) | 2001-01-24 | 2005-01-25 | Knowles Electronics, Llc | Silicon capacitive microphone |
US20060008098A1 (en) * | 2004-07-07 | 2006-01-12 | Tu Xiang Z | Single crystal silicon micromachined capacitive microphone |
CN100379324C (zh) | 2005-01-10 | 2008-04-02 | 安捷利(番禺)电子实业有限公司 | 挠性印制电路的湿法贴膜方法 |
US20060280319A1 (en) * | 2005-06-08 | 2006-12-14 | General Mems Corporation | Micromachined Capacitive Microphone |
-
2005
- 2005-12-30 TW TW094147532A patent/TWI293851B/zh active
-
2006
- 2006-10-03 US US11/541,632 patent/US7912235B2/en active Active
-
2011
- 2011-02-15 US US13/027,457 patent/US8468665B2/en active Active
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425842B (zh) * | 2008-02-20 | 2014-02-01 | 無專用背板之矽麥克風 | |
TWI607954B (zh) * | 2013-02-05 | 2017-12-11 | 羅伯特博斯奇股份有限公司 | 具有膜構造的微機械構件 |
TWI575963B (zh) * | 2014-02-27 | 2017-03-21 | 先技股份有限公司 | 微機電麥克風裝置 |
CN108100988A (zh) * | 2017-12-19 | 2018-06-01 | 苏州工业园区纳米产业技术研究院有限公司 | 硅片背腔刻蚀方法及硅片器件 |
Also Published As
Publication number | Publication date |
---|---|
US20070154040A1 (en) | 2007-07-05 |
US20110131794A1 (en) | 2011-06-09 |
US7912235B2 (en) | 2011-03-22 |
US8468665B2 (en) | 2013-06-25 |
TWI293851B (en) | 2008-02-21 |
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