TW200724389A - Micro-droplet injection apparatus and the injecting process using the same - Google Patents
Micro-droplet injection apparatus and the injecting process using the sameInfo
- Publication number
- TW200724389A TW200724389A TW094147327A TW94147327A TW200724389A TW 200724389 A TW200724389 A TW 200724389A TW 094147327 A TW094147327 A TW 094147327A TW 94147327 A TW94147327 A TW 94147327A TW 200724389 A TW200724389 A TW 200724389A
- Authority
- TW
- Taiwan
- Prior art keywords
- module
- micro
- substrate
- injecting process
- injection head
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094147327A TWI289108B (en) | 2005-12-29 | 2005-12-29 | Micro-droplet injection apparatus and the injecting process using the same |
US11/488,775 US7591517B2 (en) | 2005-12-29 | 2006-07-19 | Micro-droplet injection apparatus and injecting process using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094147327A TWI289108B (en) | 2005-12-29 | 2005-12-29 | Micro-droplet injection apparatus and the injecting process using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200724389A true TW200724389A (en) | 2007-07-01 |
TWI289108B TWI289108B (en) | 2007-11-01 |
Family
ID=38223889
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094147327A TWI289108B (en) | 2005-12-29 | 2005-12-29 | Micro-droplet injection apparatus and the injecting process using the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US7591517B2 (zh) |
TW (1) | TWI289108B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110571360A (zh) * | 2019-09-11 | 2019-12-13 | 昆山国显光电有限公司 | 喷墨打印系统和显示面板的制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5109376B2 (ja) * | 2007-01-22 | 2012-12-26 | 東京エレクトロン株式会社 | 加熱装置、加熱方法及び記憶媒体 |
US20120204577A1 (en) | 2011-02-16 | 2012-08-16 | Ludwig Lester F | Flexible modular hierarchical adaptively controlled electronic-system cooling and energy harvesting for IC chip packaging, printed circuit boards, subsystems, cages, racks, IT rooms, and data centers using quantum and classical thermoelectric materials |
WO2012158875A1 (en) * | 2011-05-17 | 2012-11-22 | Solidus Biosciences, Inc. | Micro droplet discharging apparatus |
KR102413208B1 (ko) * | 2017-09-11 | 2022-06-27 | 현대자동차주식회사 | 이종색상을 구비한 차량용 라디에이터 |
CN113873772B (zh) * | 2021-11-30 | 2022-04-05 | 江苏东方恒基通用航空有限公司 | 一种印刷电路喷头防滴溅装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3059678B2 (ja) * | 1995-07-14 | 2000-07-04 | キヤノン株式会社 | カラーフィルタの製造方法及び製造装置 |
US6582048B1 (en) * | 1996-09-30 | 2003-06-24 | Canon Kabushiki Kaisha | Ink-jet print method and apparatus, color filter, display device, apparatus having display device, ink-jet head unit adjusting device and method, and ink-jet head unit |
JP3880289B2 (ja) * | 2000-05-23 | 2007-02-14 | キヤノン株式会社 | ヘッドユニット、当該ヘッドユニットを用いるカラーフィルタの製造装置、カラーフィルタの製造方法、カラーフィルタを備えた液晶パネルの製造方法および液晶パネルを備えた情報処理装置の製造方法 |
CN1257799C (zh) | 2001-09-05 | 2006-05-31 | 财团法人工业技术研究院 | 滤色片喷涂制造法及设备 |
CN2592383Y (zh) | 2002-12-09 | 2003-12-17 | 铼宝科技股份有限公司 | 有机电激发光元件的色墨喷墨温度控制装置 |
JP4333226B2 (ja) * | 2003-06-13 | 2009-09-16 | セイコーエプソン株式会社 | キャッピング装置、キャッピング方法、及び液滴吐出装置 |
JP4131247B2 (ja) | 2004-03-03 | 2008-08-13 | ソニー株式会社 | ヘッドカートリッジ及び液体吐出装置 |
US20060093751A1 (en) * | 2004-11-04 | 2006-05-04 | Applied Materials, Inc. | System and methods for inkjet printing for flat panel displays |
US7433052B2 (en) * | 2005-07-07 | 2008-10-07 | Mitutoyo Corporation | Systems and methods for tilt and range measurement |
-
2005
- 2005-12-29 TW TW094147327A patent/TWI289108B/zh not_active IP Right Cessation
-
2006
- 2006-07-19 US US11/488,775 patent/US7591517B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110571360A (zh) * | 2019-09-11 | 2019-12-13 | 昆山国显光电有限公司 | 喷墨打印系统和显示面板的制备方法 |
CN110571360B (zh) * | 2019-09-11 | 2022-01-25 | 昆山国显光电有限公司 | 喷墨打印系统和显示面板的制备方法 |
Also Published As
Publication number | Publication date |
---|---|
US7591517B2 (en) | 2009-09-22 |
TWI289108B (en) | 2007-11-01 |
US20070153033A1 (en) | 2007-07-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200724389A (en) | Micro-droplet injection apparatus and the injecting process using the same | |
ATE450885T1 (de) | Flüssigkeitsverarbeitungsvorrichtung | |
EP2011897B8 (en) | Method for cleaning deposition chamber parts using selective spray etch | |
TW200603218A (en) | Proximity meniscus manifold | |
ATE431963T1 (de) | Vorrichtung und verfahren zur oberflächenbehandlung von substraten | |
EP1612845A3 (en) | Cleaning Apparatus | |
MY139627A (en) | Method and apparatus for processing wafer surfaces using thin, high velocity fluid layer | |
TW200644098A (en) | Enhanced wafer cleaning method | |
TW200725727A (en) | Substrate processing method and substrate processing apparatus | |
SG140469A1 (en) | System for substrate processing with meniscus, vacuum, ipa vapor, drying manifold | |
MY164303A (en) | Method and device for processing silicon substrates | |
TW200740536A (en) | Method and apparatus for cleaning a semiconductor substrate | |
WO2010054623A3 (de) | Verfahren zum positionieren und/oder führen mindestens eines beliebigen prozesskopfes für die metallisierung von dünnen substraten in einem definierten abstand über der substratoberfläche | |
ATE468602T1 (de) | Vorrichtung zum ätzen von wafern durch einzelwafer-verfahren und verfahren zum ätzen von einzelnen wafern | |
WO2009153160A9 (en) | Accurate conveyance system useful for screen printing | |
TW200703495A (en) | Method and apparatus for cleaning substrate | |
TW200631915A (en) | Apparatus of cleaning glass substrate and method of cleaning glass substrate | |
TW200735180A (en) | Manufacturing method of semiconductor device | |
TW200723379A (en) | Substrate processing apparatus and substrate processing method | |
GB2464841B (en) | Apparatus and method for moving a substrate | |
WO2006074106A3 (en) | A system capable of determining applied and anodized coating thickness of a coated-anodized product | |
TW200711749A (en) | Coating method and coating apparatus | |
MY161815A (en) | Carrier for reducing entrance and/or exit marks left by a substrate-processing meniscus | |
JP2008244099A (ja) | 半導体製造装置とそれを用いた半導体ウェハの製造方法およびそのプログラムを記録した記録媒体 | |
WO2011122354A3 (en) | Exposure apparatus, exchange method of object, exposure method, and device manufacturing method |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |