WO2010054623A3 - Verfahren zum positionieren und/oder führen mindestens eines beliebigen prozesskopfes für die metallisierung von dünnen substraten in einem definierten abstand über der substratoberfläche - Google Patents

Verfahren zum positionieren und/oder führen mindestens eines beliebigen prozesskopfes für die metallisierung von dünnen substraten in einem definierten abstand über der substratoberfläche Download PDF

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Publication number
WO2010054623A3
WO2010054623A3 PCT/DE2009/001553 DE2009001553W WO2010054623A3 WO 2010054623 A3 WO2010054623 A3 WO 2010054623A3 DE 2009001553 W DE2009001553 W DE 2009001553W WO 2010054623 A3 WO2010054623 A3 WO 2010054623A3
Authority
WO
WIPO (PCT)
Prior art keywords
plane
printing
print head
wafer
substrate
Prior art date
Application number
PCT/DE2009/001553
Other languages
English (en)
French (fr)
Other versions
WO2010054623A2 (de
Inventor
Stefan Jonas
Lutz Redmann
Michael Merscher
Claudio Uriarte
Original Assignee
Jonas & Redmann Automationstechnik Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jonas & Redmann Automationstechnik Gmbh filed Critical Jonas & Redmann Automationstechnik Gmbh
Publication of WO2010054623A2 publication Critical patent/WO2010054623A2/de
Publication of WO2010054623A3 publication Critical patent/WO2010054623A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00—Actions or mechanisms not otherwise provided for
    • B41J25/304—Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface
    • B41J25/308—Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface with print gap adjustment mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00—Actions or mechanisms not otherwise provided for
    • B41J25/304—Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface
    • B41J25/316—Bodily-movable mechanisms for print heads or carriages movable towards or from paper surface with tilting motion mechanisms relative to paper surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ink Jet (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes (Druckkopfes) oder einer Druckeinheit mit mindestens einer Druckdüse für die Metallisierung (Bedruckung) von dünnen Substraten wie Wafern in einem definierten Abstand über der Oberfläche des auf einer Auflage (Paddle; Drucktisch) vorzusehenden Substrats (Wafers). Um die Ebene der Öffnung der Druckdüse des Druckkopfes zur Oberfläche des auf dem Auflagetisch zu positionierenden Substrats (Wafers) planparallel einzustellen und die planparallele Einstellung während des Druckvorgangs aufrechtzuerhalten, werden am Druckkopf Abstandssensoren vorgesehen, über deren bei der Abstandsmessung zur Oberfläche des zu bedruckenden Substrats (Wafers) kontinuierlich gewonnene Messdaten mittels Prozessaktuatoren für eine Verstellung des Druckkopfes in bis zu 6 Freiheitsgraden derart gesorgt wird, dass die Ebene der Öffnung der Druckdüse des Druckkopfes planparallel zur Ebene der Oberfläche des zu bedruckenden Substrats (Wafers) eingestellt, aufrechterhalten und/oder nachgestellt werden kann.
PCT/DE2009/001553 2008-11-11 2009-11-04 Verfahren zum positionieren und/oder führen mindestens eines beliebigen prozesskopfes für die metallisierung von dünnen substraten in einem definierten abstand über der substratoberfläche WO2010054623A2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008057005A DE102008057005A1 (de) 2008-11-11 2008-11-11 Verfahren zum Positionieren und/oder Führen mindestens eines beliebigen Prozesskopfes für die Metallisierung von dünnen Substraten in einem definierten Abstand über der Substratoberfläche
DE102008057005.2 2008-11-11

Publications (2)

Publication Number Publication Date
WO2010054623A2 WO2010054623A2 (de) 2010-05-20
WO2010054623A3 true WO2010054623A3 (de) 2010-07-22

Family

ID=42096496

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2009/001553 WO2010054623A2 (de) 2008-11-11 2009-11-04 Verfahren zum positionieren und/oder führen mindestens eines beliebigen prozesskopfes für die metallisierung von dünnen substraten in einem definierten abstand über der substratoberfläche

Country Status (5)

Country Link
US (1) US7957829B2 (de)
CA (1) CA2656773A1 (de)
DE (1) DE102008057005A1 (de)
MY (1) MY148022A (de)
WO (1) WO2010054623A2 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2011346601A1 (en) * 2010-12-23 2013-07-18 Aluart Ip Pty Limited Process and apparatus for manufacturing of an etched metal substrate
GB2491868A (en) * 2011-06-15 2012-12-19 Inca Digital Printers Ltd Print gap compensation
WO2015017579A1 (en) * 2013-07-31 2015-02-05 Organovo, Inc. Automated devices, systems, and methods for the fabrication of tissue
US10196741B2 (en) * 2014-06-27 2019-02-05 Applied Materials, Inc. Wafer placement and gap control optimization through in situ feedback
US10079563B2 (en) 2014-08-28 2018-09-18 Hewlett-Packard Development Company, L.P. Support structure adjustment
JP6999873B2 (ja) * 2017-05-10 2022-01-19 セイコーエプソン株式会社 印刷装置、及び、制御方法
JP6848663B2 (ja) 2017-05-10 2021-03-24 セイコーエプソン株式会社 印刷装置、及び、制御方法
JP7219045B2 (ja) * 2018-10-12 2023-02-07 株式会社アドバンテスト 解析装置、解析方法および解析プログラム
WO2020232150A2 (en) 2019-05-13 2020-11-19 Board Of Regents, The University Of Texas System Roll-to-roll nanoimprint lithography tools processes

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3941318A1 (de) * 1988-12-16 1990-06-21 Juki Kk Direktschreibverfahren und vorrichtung dafuer
US6214692B1 (en) * 1998-01-13 2001-04-10 Erich Thallner Method and apparatus for the aligned joining of disk-shaped semiconductor substrates
US20020044163A1 (en) * 2000-05-23 2002-04-18 Yoshihiro Shigemura Head unit, display device panel manufacturing apparatus for manufacturing panel for display device using the head unit, manufacturing method thereof, manufacturing method of liquid crystal display device having color filter, and device having the liquid crystal display device
WO2002098576A1 (en) * 2001-06-01 2002-12-12 Litrex Corporation Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
JP2004175468A (ja) * 2002-11-25 2004-06-24 Noritsu Koki Co Ltd 位置検出装置および位置検出方法
US20040250760A1 (en) * 2001-09-28 2004-12-16 Makoto Goto Nozzle head, nozzle head holder, and droplet jet patterning device
US20050003283A1 (en) * 2000-12-21 2005-01-06 Seiko Epson Corporation Method and apparatus for producing color filter, method and apparatus for manufacturing liquid crystal device, method and apparatus for manufacturing EL device, method of discharging material, apparatus for controlling head and electronic apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9104705D0 (en) 1991-03-06 1991-04-17 Lowe John M Vision system
DE102006051558A1 (de) 2006-11-02 2008-05-08 Manz Automation Ag Siebdruckanlage

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3941318A1 (de) * 1988-12-16 1990-06-21 Juki Kk Direktschreibverfahren und vorrichtung dafuer
US6214692B1 (en) * 1998-01-13 2001-04-10 Erich Thallner Method and apparatus for the aligned joining of disk-shaped semiconductor substrates
US20020044163A1 (en) * 2000-05-23 2002-04-18 Yoshihiro Shigemura Head unit, display device panel manufacturing apparatus for manufacturing panel for display device using the head unit, manufacturing method thereof, manufacturing method of liquid crystal display device having color filter, and device having the liquid crystal display device
US20050003283A1 (en) * 2000-12-21 2005-01-06 Seiko Epson Corporation Method and apparatus for producing color filter, method and apparatus for manufacturing liquid crystal device, method and apparatus for manufacturing EL device, method of discharging material, apparatus for controlling head and electronic apparatus
WO2002098576A1 (en) * 2001-06-01 2002-12-12 Litrex Corporation Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
US20040250760A1 (en) * 2001-09-28 2004-12-16 Makoto Goto Nozzle head, nozzle head holder, and droplet jet patterning device
JP2004175468A (ja) * 2002-11-25 2004-06-24 Noritsu Koki Co Ltd 位置検出装置および位置検出方法

Also Published As

Publication number Publication date
US7957829B2 (en) 2011-06-07
WO2010054623A2 (de) 2010-05-20
CA2656773A1 (en) 2010-05-11
DE102008057005A1 (de) 2010-05-12
US20100121477A1 (en) 2010-05-13
MY148022A (en) 2013-02-28

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