TW200724275A - Device for switching a laser beam, laser machining device - Google Patents

Device for switching a laser beam, laser machining device

Info

Publication number
TW200724275A
TW200724275A TW094145443A TW94145443A TW200724275A TW 200724275 A TW200724275 A TW 200724275A TW 094145443 A TW094145443 A TW 094145443A TW 94145443 A TW94145443 A TW 94145443A TW 200724275 A TW200724275 A TW 200724275A
Authority
TW
Taiwan
Prior art keywords
laser beam
switch
polarization direction
ray
over
Prior art date
Application number
TW094145443A
Other languages
English (en)
Inventor
Hans Juergen Mayer
Original Assignee
Hitachi Via Mechanics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Via Mechanics Ltd filed Critical Hitachi Via Mechanics Ltd
Publication of TW200724275A publication Critical patent/TW200724275A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0673—Dividing the beam into multiple beams, e.g. multifocusing into independently operating sub-beams, e.g. beam multiplexing to provide laser beams for several stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Laser Beam Processing (AREA)
TW094145443A 2004-12-23 2005-12-21 Device for switching a laser beam, laser machining device TW200724275A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004062381A DE102004062381B4 (de) 2004-12-23 2004-12-23 Vorrichtung zum Umschalten eines Laserstrahls, Laserbearbeitungsvorrichtung

Publications (1)

Publication Number Publication Date
TW200724275A true TW200724275A (en) 2007-07-01

Family

ID=36590486

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094145443A TW200724275A (en) 2004-12-23 2005-12-21 Device for switching a laser beam, laser machining device

Country Status (6)

Country Link
US (1) US20060159151A1 (zh)
JP (1) JP2006175517A (zh)
KR (1) KR20060073511A (zh)
CN (1) CN1821859A (zh)
DE (1) DE102004062381B4 (zh)
TW (1) TW200724275A (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100678504B1 (ko) * 2006-11-20 2007-02-02 주식회사 루트로닉 펄스시간폭 변조 Ｑ-스위칭 Ｅｒ:ＹＡＧ 레이저
KR100945134B1 (ko) * 2008-02-29 2010-03-02 아이피지 포토닉스 코리아(주) 백업이 가능한 레이저 빔 스위치 장치
ATE477876T1 (de) * 2008-05-02 2010-09-15 Leister Process Tech Verfahren und laservorrichtung zum bearbeiten und/oder verbinden von werkstücken mittels laserstrahlung mit leistungswirk- und pilotlaser und mindestens einem diffraktiven optischen element
KR100978191B1 (ko) * 2008-05-07 2010-08-25 경북대학교 산학협력단 멀티 광원 스위칭 레이저
DE102010001036A1 (de) * 2010-01-20 2011-07-21 Robert Bosch GmbH, 70469 Verfahren und Vorrichtung zur mehrfachen Nutzung von Laserquellen
CN102101217A (zh) * 2011-02-28 2011-06-22 深圳市大族激光科技股份有限公司 一种激光切割装置
US20140312015A1 (en) * 2011-11-14 2014-10-23 Canon Kabushiki Kaisha Laser processing apparatus, method of laser processing, method of fabricating substrate, and method of fabricating inkjet head
DE102012009547A1 (de) 2012-05-12 2013-11-14 Hochschule Mittweida (Fh) Einrichtung zur schnellen Leistungsmodulation eines Laserstrahls
CN104785779B (zh) * 2015-03-20 2017-08-18 徐州奕创光电科技有限公司 一种激光扫描头、三维打印装置及打印方法
CN105397308B (zh) * 2015-12-18 2017-05-17 张飞 一种多功能打标机
CN106735876B (zh) * 2016-12-16 2019-03-01 武汉光谷航天三江激光产业技术研究院有限公司 一种激光分能装置
WO2019179604A1 (de) * 2018-03-20 2019-09-26 Robert Bosch Gmbh Vorrichtung und verfahren zur formung eines laserstrahls durch einen programmierbaren strahlformer
JP2021533996A (ja) * 2018-08-09 2021-12-09 コーニング インコーポレイテッド レーザービームの機械内プロファイリングのためのシステム、方法および装置
CN115070200B (zh) * 2022-04-26 2023-04-11 中国科学院西安光学精密机械研究所 一种用于异质材料的激光打孔光路系统及打孔方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5311217A (en) * 1991-12-23 1994-05-10 Xerox Corporation Variable attenuator for dual beams
JPH1110378A (ja) * 1997-06-24 1999-01-19 Nec Corp レーザ加工装置
JP3463281B2 (ja) * 2000-06-28 2003-11-05 住友重機械工業株式会社 多軸レーザ加工装置及びレーザ加工方法
JP2002208748A (ja) * 2001-01-11 2002-07-26 Nec Corp レーザ光の強度補正方法、レーザ光の強度補正機構及び該補正機構を備えた多分岐レーザ発振装置
US6580561B2 (en) * 2001-08-23 2003-06-17 Raytheon Company Quasi-optical variable beamsplitter
JP2003126982A (ja) * 2001-10-24 2003-05-08 Sumitomo Heavy Ind Ltd レーザ加工方法及び装置
CN1232380C (zh) * 2002-03-28 2005-12-21 三菱电机株式会社 激光加工装置
US7049544B2 (en) * 2004-03-26 2006-05-23 Ultratech, Inc. Beamsplitter for high-power radiation

Also Published As

Publication number Publication date
DE102004062381B4 (de) 2009-08-20
JP2006175517A (ja) 2006-07-06
KR20060073511A (ko) 2006-06-28
CN1821859A (zh) 2006-08-23
DE102004062381A1 (de) 2006-07-06
US20060159151A1 (en) 2006-07-20

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