TW200720851A - Dense OPC - Google Patents
Dense OPCInfo
- Publication number
- TW200720851A TW200720851A TW095135534A TW95135534A TW200720851A TW 200720851 A TW200720851 A TW 200720851A TW 095135534 A TW095135534 A TW 095135534A TW 95135534 A TW95135534 A TW 95135534A TW 200720851 A TW200720851 A TW 200720851A
- Authority
- TW
- Taiwan
- Prior art keywords
- opc
- process conditions
- layout
- features
- estimated
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Image Processing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/236,208 US7434199B2 (en) | 2005-09-27 | 2005-09-27 | Dense OPC |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200720851A true TW200720851A (en) | 2007-06-01 |
TWI370956B TWI370956B (en) | 2012-08-21 |
Family
ID=35695842
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095135534A TWI370956B (en) | 2005-09-27 | 2006-09-26 | Dense opc |
Country Status (5)
Country | Link |
---|---|
US (1) | US7434199B2 (zh) |
EP (1) | EP1929373A1 (zh) |
JP (3) | JP2009510517A (zh) |
TW (1) | TWI370956B (zh) |
WO (1) | WO2007040544A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108319113A (zh) * | 2018-01-31 | 2018-07-24 | 宁波大学 | 一种玻璃毛细管中加工微结构的变形矫正方法 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7293249B2 (en) * | 2002-01-31 | 2007-11-06 | Juan Andres Torres Robles | Contrast based resolution enhancement for photolithographic processing |
JP2007536581A (ja) * | 2004-05-07 | 2007-12-13 | メンター・グラフィクス・コーポレーション | プロセス変動バンドを用いた集積回路レイアウト設計法 |
US7240305B2 (en) * | 2004-06-02 | 2007-07-03 | Lippincott George P | OPC conflict identification and edge priority system |
US8037429B2 (en) * | 2005-03-02 | 2011-10-11 | Mentor Graphics Corporation | Model-based SRAF insertion |
US7712068B2 (en) * | 2006-02-17 | 2010-05-04 | Zhuoxiang Ren | Computation of electrical properties of an IC layout |
JP4832201B2 (ja) * | 2006-07-24 | 2011-12-07 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP4866683B2 (ja) * | 2006-08-25 | 2012-02-01 | 富士通セミコンダクター株式会社 | 半導体デバイスの製造方法、データ作成装置、データ作成方法、およびプログラム |
US8056022B2 (en) * | 2006-11-09 | 2011-11-08 | Mentor Graphics Corporation | Analysis optimizer |
US7966585B2 (en) | 2006-12-13 | 2011-06-21 | Mentor Graphics Corporation | Selective shielding for multiple exposure masks |
US7802226B2 (en) * | 2007-01-08 | 2010-09-21 | Mentor Graphics Corporation | Data preparation for multiple mask printing |
US7739650B2 (en) * | 2007-02-09 | 2010-06-15 | Juan Andres Torres Robles | Pre-bias optical proximity correction |
US7799487B2 (en) * | 2007-02-09 | 2010-09-21 | Ayman Yehia Hamouda | Dual metric OPC |
US8713483B2 (en) | 2007-06-05 | 2014-04-29 | Mentor Graphics Corporation | IC layout parsing for multiple masks |
US7805699B2 (en) * | 2007-10-11 | 2010-09-28 | Mentor Graphics Corporation | Shape-based photolithographic model calibration |
NL2003716A (en) | 2008-11-24 | 2010-05-26 | Brion Tech Inc | Harmonic resist model for use in a lithographic apparatus and a device manufacturing method. |
US8321818B2 (en) * | 2009-06-26 | 2012-11-27 | International Business Machines Corporation | Model-based retargeting of layout patterns for sub-wavelength photolithography |
US8146026B2 (en) * | 2009-11-17 | 2012-03-27 | International Business Machines Corporation | Simultaneous photolithographic mask and target optimization |
US8230372B2 (en) * | 2009-12-03 | 2012-07-24 | International Business Machines Corporation | Retargeting for electrical yield enhancement |
US8331646B2 (en) * | 2009-12-23 | 2012-12-11 | International Business Machines Corporation | Optical proximity correction for transistors using harmonic mean of gate length |
JP5460479B2 (ja) * | 2010-06-21 | 2014-04-02 | 株式会社日立ハイテクノロジーズ | パターン寸法測定装置及び輪郭線形成装置 |
US8415077B2 (en) | 2010-08-13 | 2013-04-09 | International Business Machines Corporation | Simultaneous optical proximity correction and decomposition for double exposure lithography |
JP5501161B2 (ja) * | 2010-08-31 | 2014-05-21 | 株式会社日立ハイテクノロジーズ | 画像処理装置、及びコンピュータプログラム |
CN102486606B (zh) * | 2010-12-03 | 2013-03-27 | 中芯国际集成电路制造(上海)有限公司 | 光刻方法 |
CN103105726B (zh) * | 2011-11-11 | 2015-04-01 | 中芯国际集成电路制造(上海)有限公司 | 布局图形校正方法 |
US8510687B1 (en) * | 2012-03-01 | 2013-08-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Error diffusion and grid shift in lithography |
US9646220B2 (en) * | 2013-11-25 | 2017-05-09 | GlobalFoundries, Inc. | Methods and media for averaging contours of wafer feature edges |
CN103605265B (zh) * | 2013-11-26 | 2015-11-18 | 上海宏盾防伪材料有限公司 | 一种基于矢量曲线路径的象元可变角度的曲线光刻加工系统及光刻方法 |
US8881070B1 (en) * | 2014-02-18 | 2014-11-04 | Mentor Graphics Corporation | Optical proximity correction based on edge fragment correlation |
CN106483758B (zh) * | 2015-09-02 | 2019-08-20 | 无锡华润上华科技有限公司 | 光学邻近效应修正方法和系统 |
KR102481295B1 (ko) | 2015-11-12 | 2022-12-27 | 삼성전자주식회사 | 광 근접 보정을 수행하여 마스크를 제작하는 방법 |
CN114631058A (zh) * | 2019-08-21 | 2022-06-14 | 西门子工业软件有限公司 | 用于分辨率增强技术操作的任务的高效调度 |
CN112433441A (zh) * | 2019-08-26 | 2021-03-02 | 长鑫存储技术有限公司 | Opc修正方法及opc修正装置 |
KR20210028326A (ko) | 2019-09-03 | 2021-03-12 | 삼성전자주식회사 | 마스크 레이아웃의 보정 방법 및 이를 이용한 반도체 장치의 제조방법 |
CN111367149B (zh) * | 2020-04-10 | 2021-04-20 | 联合微电子中心有限责任公司 | 曲线图形光学邻近修正方法 |
CN112015045B (zh) * | 2020-08-31 | 2023-11-17 | 东方晶源微电子科技(北京)有限公司 | 一种掩模优化方法及电子设备 |
Family Cites Families (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4532650A (en) * | 1983-05-12 | 1985-07-30 | Kla Instruments Corporation | Photomask inspection apparatus and method using corner comparator defect detection algorithm |
FR2590376A1 (fr) * | 1985-11-21 | 1987-05-22 | Dumant Jean Marc | Procede de masquage et masque utilise |
IL99823A0 (en) * | 1990-11-16 | 1992-08-18 | Orbot Instr Ltd | Optical inspection method and apparatus |
JP2531114B2 (ja) * | 1993-10-29 | 1996-09-04 | 日本電気株式会社 | 光強度分布解析方法 |
US5646870A (en) * | 1995-02-13 | 1997-07-08 | Advanced Micro Devices, Inc. | Method for setting and adjusting process parameters to maintain acceptable critical dimensions across each die of mass-produced semiconductor wafers |
US5682323A (en) * | 1995-03-06 | 1997-10-28 | Lsi Logic Corporation | System and method for performing optical proximity correction on macrocell libraries |
JP3409493B2 (ja) * | 1995-03-13 | 2003-05-26 | ソニー株式会社 | マスクパターンの補正方法および補正装置 |
JP3934719B2 (ja) * | 1995-12-22 | 2007-06-20 | 株式会社東芝 | 光近接効果補正方法 |
US5723233A (en) * | 1996-02-27 | 1998-03-03 | Lsi Logic Corporation | Optical proximity correction method and apparatus |
US6269472B1 (en) * | 1996-02-27 | 2001-07-31 | Lsi Logic Corporation | Optical proximity correction method and apparatus |
JP3551660B2 (ja) * | 1996-10-29 | 2004-08-11 | ソニー株式会社 | 露光パターンの補正方法および露光パターンの補正装置および露光方法 |
KR100257710B1 (ko) * | 1996-12-27 | 2000-06-01 | 김영환 | 리소그라피 공정의 시물레이션 방법 |
US6016357A (en) * | 1997-06-16 | 2000-01-18 | International Business Machines Corporation | Feedback method to repair phase shift masks |
US6453452B1 (en) * | 1997-12-12 | 2002-09-17 | Numerical Technologies, Inc. | Method and apparatus for data hierarchy maintenance in a system for mask description |
US6370679B1 (en) * | 1997-09-17 | 2002-04-09 | Numerical Technologies, Inc. | Data hierarchy layout correction and verification method and apparatus |
US6243855B1 (en) * | 1997-09-30 | 2001-06-05 | Kabushiki Kaisha Toshiba | Mask data design method |
US6499003B2 (en) * | 1998-03-03 | 2002-12-24 | Lsi Logic Corporation | Method and apparatus for application of proximity correction with unitary segmentation |
US6128067A (en) * | 1998-04-28 | 2000-10-03 | Kabushiki Kaisha Toshiba | Correcting method and correcting system for mask pattern |
US6120952A (en) * | 1998-10-01 | 2000-09-19 | Micron Technology, Inc. | Methods of reducing proximity effects in lithographic processes |
US6263299B1 (en) * | 1999-01-19 | 2001-07-17 | Lsi Logic Corporation | Geometric aerial image simulation |
US6301697B1 (en) * | 1999-04-30 | 2001-10-09 | Nicolas B. Cobb | Streamlined IC mask layout optical and process correction through correction reuse |
US6467076B1 (en) * | 1999-04-30 | 2002-10-15 | Nicolas Bailey Cobb | Method and apparatus for submicron IC design |
US6249904B1 (en) * | 1999-04-30 | 2001-06-19 | Nicolas Bailey Cobb | Method and apparatus for submicron IC design using edge fragment tagging to correct edge placement distortion |
US6187483B1 (en) * | 1999-05-28 | 2001-02-13 | Advanced Micro Devices, Inc. | Mask quality measurements by fourier space analysis |
US6317859B1 (en) * | 1999-06-09 | 2001-11-13 | International Business Machines Corporation | Method and system for determining critical area for circuit layouts |
US6643616B1 (en) * | 1999-12-07 | 2003-11-04 | Yuri Granik | Integrated device structure prediction based on model curvature |
US6792159B1 (en) * | 1999-12-29 | 2004-09-14 | Ge Medical Systems Global Technology Company, Llc | Correction of defective pixels in a detector using temporal gradients |
US6665845B1 (en) * | 2000-02-25 | 2003-12-16 | Sun Microsystems, Inc. | System and method for topology based noise estimation of submicron integrated circuit designs |
US6584609B1 (en) | 2000-02-28 | 2003-06-24 | Numerical Technologies, Inc. | Method and apparatus for mixed-mode optical proximity correction |
US6792590B1 (en) * | 2000-09-29 | 2004-09-14 | Numerical Technologies, Inc. | Dissection of edges with projection points in a fabrication layout for correcting proximity effects |
US6453457B1 (en) * | 2000-09-29 | 2002-09-17 | Numerical Technologies, Inc. | Selection of evaluation point locations based on proximity effects model amplitudes for correcting proximity effects in a fabrication layout |
US7013439B2 (en) * | 2002-01-31 | 2006-03-14 | Juan Andres Torres Robles | Contrast based resolution enhancing technology |
JP4152647B2 (ja) * | 2002-03-06 | 2008-09-17 | 富士通株式会社 | 近接効果補正方法及びプログラム |
-
2005
- 2005-09-27 US US11/236,208 patent/US7434199B2/en active Active
- 2005-10-13 WO PCT/US2005/037128 patent/WO2007040544A1/en active Application Filing
- 2005-10-13 EP EP05811822A patent/EP1929373A1/en not_active Withdrawn
- 2005-10-13 JP JP2008533315A patent/JP2009510517A/ja active Pending
-
2006
- 2006-09-26 TW TW095135534A patent/TWI370956B/zh not_active IP Right Cessation
-
2012
- 2012-02-06 JP JP2012022898A patent/JP2012088745A/ja not_active Withdrawn
-
2014
- 2014-11-10 JP JP2014228022A patent/JP2015028668A/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108319113A (zh) * | 2018-01-31 | 2018-07-24 | 宁波大学 | 一种玻璃毛细管中加工微结构的变形矫正方法 |
CN108319113B (zh) * | 2018-01-31 | 2021-01-08 | 宁波大学 | 一种玻璃毛细管中加工微结构的变形矫正方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2009510517A (ja) | 2009-03-12 |
TWI370956B (en) | 2012-08-21 |
JP2012088745A (ja) | 2012-05-10 |
US20070074143A1 (en) | 2007-03-29 |
US7434199B2 (en) | 2008-10-07 |
EP1929373A1 (en) | 2008-06-11 |
JP2015028668A (ja) | 2015-02-12 |
WO2007040544A1 (en) | 2007-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200720851A (en) | Dense OPC | |
EP1696269A3 (en) | Identifying a problem area in a layout using a process-sensitivity model | |
SG129366A1 (en) | Method of selecting a grid model for correcting a process recipe for grid deformations in a lithographic apparatus and lithographic assembly using thesame | |
EP1376422A3 (en) | System and apparatus for project risk management | |
TW200622509A (en) | A method for performing full-chip manufacturing reliability checking and correction | |
EP2863258A3 (en) | Photomask blank and method for manufacturing photomask blank | |
BRPI0821595A2 (pt) | Método de inspeção de uma parte da superfície de um pneumático e dispositivo de inspeção da superfície de um pneumático | |
WO2007019269A3 (en) | System and method for creating a focus-exposure model of a lithography process | |
BRPI0912521B8 (pt) | dispositivo oftálmico | |
TW200519526A (en) | Method and apparatus for performing model based placement of phase-balanced scattering bars for sub-wavelength optical lithography | |
SG129388A1 (en) | A system and method for repairing a gas turbine engine component | |
SG164325A1 (en) | Inspection apparatus, lithographic apparatus, lithographic processing cell and inspection method | |
MX2011008128A (es) | Metodo para producir una herramienta de dentista. | |
WO2006019919A3 (en) | Computer-implemented methods for generating input for a simulation program for generating a simulated image of a reticle | |
TW200625407A (en) | Method for foring a finely patterned resist | |
MX2012000781A (es) | Metodo para la produccion de un elemento de capas multiples, y elemento de capas multiples. | |
EP2237109A3 (en) | Method for inspecting and judging photomask blank or intermediate thereof | |
TW200615818A (en) | Comprehensive front end method and system for automatically generating and processing photomask orders | |
EP2738791A3 (en) | Method for correcting a photomask | |
SG141355A1 (en) | A method for performing pattern decomposition based on feature pitch | |
ATE534098T1 (de) | Verfahren und system zur anpassung eines geometrischen modells mit mehreren teil- transformationen | |
WO2008033879A3 (en) | Method for achieving compliant sub-resolution assist features | |
SG143183A1 (en) | A method , program product and apparatus for performing decomposition of a pattern for use in a dpt process | |
DE602005027884D1 (de) | Verfahren zur erzeugung eines zusammengesetzen bildes | |
ATE494984T1 (de) | Verfahren zur herstellung eines brillenglases |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |