TW200720413A - Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry - Google Patents

Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry

Info

Publication number
TW200720413A
TW200720413A TW095132342A TW95132342A TW200720413A TW 200720413 A TW200720413 A TW 200720413A TW 095132342 A TW095132342 A TW 095132342A TW 95132342 A TW95132342 A TW 95132342A TW 200720413 A TW200720413 A TW 200720413A
Authority
TW
Taiwan
Prior art keywords
cmp slurry
component cmp
cerium oxide
oxide powder
component
Prior art date
Application number
TW095132342A
Other languages
English (en)
Other versions
TWI338712B (en
Inventor
Seung-Beom Cho
Jun-Seok Nho
Dong-Mok Shin
Jong-Pil Kim
Myoung-Hwan Oh
Jang Yul Kim
Eun Mi Choi
Min Jin Ko
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200720413A publication Critical patent/TW200720413A/zh
Application granted granted Critical
Publication of TWI338712B publication Critical patent/TWI338712B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01FCOMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
    • C01F17/00Compounds of rare earth metals
    • C01F17/20Compounds containing only rare earth metals as the metal element
    • C01F17/206Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
    • C01F17/224Oxides or hydroxides of lanthanides
    • C01F17/235Cerium oxides or hydroxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B82NANOTECHNOLOGY
    • B82YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00Nanotechnology for materials or surface science, e.g. nanocomposites
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/60Compounds characterised by their crystallite size
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/70Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
    • C01P2002/72Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/01Particle morphology depicted by an image
    • C01P2004/03Particle morphology depicted by an image obtained by SEM
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/62Submicrometer sized, i.e. from 0.1-1 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/64Nanometer sized, i.e. from 1-100 nanometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/12Surface area
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/16Pore diameter
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/16Pore diameter
    • C01P2006/17Pore diameter distribution

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095132342A 2005-09-02 2006-09-01 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry TWI338712B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20050081734 2005-09-02
KR20050097157 2005-10-14

Publications (2)

Publication Number Publication Date
TW200720413A true TW200720413A (en) 2007-06-01
TWI338712B TWI338712B (en) 2011-03-11

Family

ID=37809102

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132342A TWI338712B (en) 2005-09-02 2006-09-01 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry

Country Status (7)

Country Link
US (1) US7524475B2 (zh)
EP (1) EP1931597B1 (zh)
JP (1) JP4851524B2 (zh)
KR (1) KR100725699B1 (zh)
CN (1) CN101258106B (zh)
TW (1) TWI338712B (zh)
WO (1) WO2007027068A1 (zh)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
TWI450952B (zh) * 2008-03-06 2014-09-01 Lg Chemical Ltd Cmp漿料以及使用其之研磨方法

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US6863825B2 (en) 2003-01-29 2005-03-08 Union Oil Company Of California Process for removing arsenic from aqueous streams
EP1943320B1 (en) * 2005-10-25 2009-04-15 Freescale Semiconductor, Inc. Method for testing a slurry used to form a semiconductor device
WO2007069735A1 (ja) * 2005-12-15 2007-06-21 Mitsui Mining & Smelting Co., Ltd. 脱酸素剤及び脱酸素剤の製造方法
US8066874B2 (en) 2006-12-28 2011-11-29 Molycorp Minerals, Llc Apparatus for treating a flow of an aqueous solution containing arsenic
JP5379351B2 (ja) * 2007-01-17 2013-12-25 三井金属鉱業株式会社 セリウム系研摩材
CN101641290A (zh) * 2007-03-16 2010-02-03 株式会社Lg化学 制备碳酸铈粉体的方法
US8303918B2 (en) * 2007-03-16 2012-11-06 Lg Chem, Ltd. Method for preparing cerium carbonate powder using urea
US8252087B2 (en) 2007-10-31 2012-08-28 Molycorp Minerals, Llc Process and apparatus for treating a gas containing a contaminant
US8349764B2 (en) 2007-10-31 2013-01-08 Molycorp Minerals, Llc Composition for treating a fluid
KR101279968B1 (ko) * 2008-12-31 2013-07-17 제일모직주식회사 Cmp 슬러리 조성물
KR101075491B1 (ko) * 2009-01-16 2011-10-21 주식회사 하이닉스반도체 반도체 소자의 제조방법
US9233863B2 (en) 2011-04-13 2016-01-12 Molycorp Minerals, Llc Rare earth removal of hydrated and hydroxyl species
US9633863B2 (en) * 2012-07-11 2017-04-25 Cabot Microelectronics Corporation Compositions and methods for selective polishing of silicon nitride materials
EP3113859A4 (en) 2014-03-07 2017-10-04 Secure Natural Resources LLC Cerium (iv) oxide with exceptional arsenic removal properties
CN103908933B (zh) * 2014-03-10 2016-01-20 苏州科技学院相城研究院 多孔中空亚微米级的氧化铈微胶囊的制备方法及其应用
US20150270159A1 (en) * 2014-03-20 2015-09-24 Globalfoundries Inc. Fabrication of semiconductor structures using oxidized polycrystalline silicon as conformal stop layers
KR20170032335A (ko) * 2014-07-09 2017-03-22 히타치가세이가부시끼가이샤 Cmp용 연마액 및 연마 방법
EP3020689A1 (en) * 2014-11-12 2016-05-18 Rhodia Operations Cerium oxide particles and method for production thereof
KR102463863B1 (ko) 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
CN106238033A (zh) * 2016-07-29 2016-12-21 北京大学 表面修饰氧化铈纳米管的活性半焦低温脱硝剂及其制备方法与应用
KR102453292B1 (ko) * 2020-07-07 2022-10-12 주식회사 나노신소재 산화세륨 복합분말의 분산 조성물
CN112724836B (zh) * 2020-12-24 2022-03-29 德米特(苏州)电子环保材料有限公司 一种铈锆掺杂抛光液及其制备方法和应用
CN112680115A (zh) * 2021-01-04 2021-04-20 上海晖研材料科技有限公司 一种氧化铈颗粒在抛光工艺中的应用
CN115895595A (zh) * 2021-08-30 2023-04-04 凯斯科技股份有限公司 氧化铈抛光粒子及抛光浆料组合物
CN114905048B (zh) * 2022-06-02 2023-06-16 兰州理工大学 一种增材制造用纳米钴粉的制备方法
CN117024701B (zh) * 2023-08-14 2024-04-09 旭川化学(苏州)有限公司 一种聚氨酯发泡抛光材料及其制备方法和应用

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EP1691401B1 (en) * 1999-06-18 2012-06-13 Hitachi Chemical Co., Ltd. Method for polishing a substrate using CMP abrasive
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI450952B (zh) * 2008-03-06 2014-09-01 Lg Chemical Ltd Cmp漿料以及使用其之研磨方法
US8969204B2 (en) 2008-03-06 2015-03-03 Lg Chem, Ltd. CMP slurry and a polishing method using the same

Also Published As

Publication number Publication date
TWI338712B (en) 2011-03-11
CN101258106B (zh) 2010-09-08
KR20070026145A (ko) 2007-03-08
CN101258106A (zh) 2008-09-03
EP1931597A4 (en) 2011-03-09
KR100725699B1 (ko) 2007-06-07
JP4851524B2 (ja) 2012-01-11
WO2007027068A1 (en) 2007-03-08
JP2009505436A (ja) 2009-02-05
US7524475B2 (en) 2009-04-28
EP1931597B1 (en) 2013-01-23
US20070081931A1 (en) 2007-04-12
EP1931597A1 (en) 2008-06-18

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