TW200718663A - Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method - Google Patents

Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method

Info

Publication number
TW200718663A
TW200718663A TW095136802A TW95136802A TW200718663A TW 200718663 A TW200718663 A TW 200718663A TW 095136802 A TW095136802 A TW 095136802A TW 95136802 A TW95136802 A TW 95136802A TW 200718663 A TW200718663 A TW 200718663A
Authority
TW
Taiwan
Prior art keywords
radiation
carrying
cover glass
sensitive sensors
producing cover
Prior art date
Application number
TW095136802A
Other languages
English (en)
Inventor
Andreas Weber
Holger Wegener
Reinhard Kassner
Peter Brix
Original Assignee
Schott Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schott Ag filed Critical Schott Ag
Publication of TW200718663A publication Critical patent/TW200718663A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00—Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16—Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/42—Details of construction of furnace walls, e.g. to prevent corrosion; Use of materials for furnace walls
    • C03B5/43—Use of materials for furnace walls, e.g. fire-bricks
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B15/00—Drawing glass upwardly from the melt
    • C03B15/02—Drawing glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00—Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06—Forming glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B18/00—Shaping glass in contact with the surface of a liquid
    • C03B18/02—Forming sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/076—Glass compositions containing silica with 40% to 90% silica, by weight
    • C03C3/089—Glass compositions containing silica with 40% to 90% silica, by weight containing boron
    • C03C3/091—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium
    • C03C3/093—Glass compositions containing silica with 40% to 90% silica, by weight containing boron containing aluminium containing zinc or zirconium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Glass Compositions (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
TW095136802A 2005-11-03 2006-10-03 Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method TW200718663A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102005052421A DE102005052421A1 (de) 2005-11-03 2005-11-03 Verfahren zur Herstellung von Abdeckgläsern für strahlungsempfindliche Sensoren und Vorrichtung zur Durchführung des Verfahrens

Publications (1)

Publication Number Publication Date
TW200718663A true TW200718663A (en) 2007-05-16

Family

ID=37442071

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095136802A TW200718663A (en) 2005-11-03 2006-10-03 Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method

Country Status (6)

Country Link
US (1) US20090217706A1 (zh)
EP (1) EP1943195A1 (zh)
JP (1) JP2007126345A (zh)
DE (1) DE102005052421A1 (zh)
TW (1) TW200718663A (zh)
WO (1) WO2007051512A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102448901B (zh) * 2009-03-19 2015-11-25 日本电气硝子株式会社 无碱玻璃
JP5909937B2 (ja) * 2010-09-09 2016-04-27 日本電気硝子株式会社 半導体パッケージ用カバーガラス及びその製造方法
DE102014117640A1 (de) * 2014-12-01 2016-06-02 Schott Ag Elektrisches Speichersystem mit einem scheibenförmigen diskreten Element, diskretes Element, Verfahren zu dessen Herstellung sowie dessen Verwendung
WO2019093245A1 (ja) * 2017-11-09 2019-05-16 富士フイルム株式会社 装置、有機層形成用組成物

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3218745B2 (ja) * 1991-11-22 2001-10-15 ソニー株式会社 固体撮像装置
JP3288169B2 (ja) * 1994-02-23 2002-06-04 ホーヤ株式会社 パッケージ用ガラスの製造方法
JP3589421B2 (ja) * 1999-06-30 2004-11-17 Ｈｏｙａ株式会社 半導体パッケージ用窓材ガラス及びその製造方法
EP1157976A1 (en) * 1999-10-22 2001-11-28 Nippon Sheet Glass Co., Ltd. Glass panel and production method therefor
JP2000233939A (ja) * 1999-11-26 2000-08-29 Asahi Techno Glass Corp 固体撮像素子パッケージ用窓ガラス
JP2001177082A (ja) * 1999-12-21 2001-06-29 Nippon Sheet Glass Co Ltd 固体撮像管用カバーガラス及びそれを用いた固体撮像管
JP2002050716A (ja) * 2000-08-02 2002-02-15 Dainippon Printing Co Ltd 半導体装置及びその作製方法
JP3506237B2 (ja) * 2000-10-19 2004-03-15 日本電気硝子株式会社 固体撮像素子用カバーガラス
DE10128636C1 (de) * 2001-06-13 2002-08-01 Schott Glas Verfahren zur selektiven Beeinflussung der Glasdicke bei der Herstellung von Flachglas und Vorrichtung zur Durchführung des Verfahrens
JP3532178B2 (ja) * 2001-10-22 2004-05-31 Ｈｏｙａ株式会社 半導体パッケージ用窓材ガラス及びその製造方法
JP2002249340A (ja) * 2001-11-30 2002-09-06 Hoya Corp 半導体パッケージ用カバーガラス
JP3386058B2 (ja) * 2001-11-30 2003-03-10 Ｈｏｙａ株式会社 半導体パッケージ用カバーガラス及びその製造方法
JP2005126320A (ja) * 2003-10-01 2005-05-19 Nippon Electric Glass Co Ltd 固体撮像素子パッケージ用窓ガラス
JP4371841B2 (ja) * 2004-02-09 2009-11-25 Ｈｏｙａ株式会社 半導体パッケージ用窓材ガラス
DE102004007560B4 (de) * 2004-02-17 2006-02-09 Schott Ag Vorrichtung und Ziehtank zur Herstellung von dünnen Glasscheiben
JP2006096575A (ja) * 2004-09-28 2006-04-13 Nippon Electric Glass Co Ltd 半導体パッケージ用カバーガラスの製造方法
DE102005052420A1 (de) * 2005-11-03 2007-05-10 Schott Ag Strahlungsarme Abdeckgläser und deren Verwendung

Also Published As

Publication number Publication date
JP2007126345A (ja) 2007-05-24
DE102005052421A1 (de) 2007-05-16
WO2007051512A1 (de) 2007-05-10
EP1943195A1 (de) 2008-07-16
US20090217706A1 (en) 2009-09-03

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