TW200717630A - Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium - Google Patents

Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium

Info

Publication number
TW200717630A
TW200717630A TW095137187A TW95137187A TW200717630A TW 200717630 A TW200717630 A TW 200717630A TW 095137187 A TW095137187 A TW 095137187A TW 95137187 A TW95137187 A TW 95137187A TW 200717630 A TW200717630 A TW 200717630A
Authority
TW
Taiwan
Prior art keywords
substrate cleaning
cleaning apparatus
cleaning
level
program
Prior art date
Application number
TW095137187A
Other languages
English (en)
Other versions
TWI314756B (zh
Inventor
Yuji Takimoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200717630A publication Critical patent/TW200717630A/zh
Application granted granted Critical
Publication of TWI314756B publication Critical patent/TWI314756B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Liquid Crystal (AREA)
TW095137187A 2005-10-05 2006-10-05 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium TW200717630A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005292991A JP2007103741A (ja) 2005-10-05 2005-10-05 基板洗浄装置及び基板洗浄方法並びに基板洗浄プログラム

Publications (2)

Publication Number Publication Date
TW200717630A true TW200717630A (en) 2007-05-01
TWI314756B TWI314756B (zh) 2009-09-11

Family

ID=37906092

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095137187A TW200717630A (en) 2005-10-05 2006-10-05 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium

Country Status (8)

Country Link
US (1) US8043436B2 (zh)
EP (1) EP1933374B1 (zh)
JP (1) JP2007103741A (zh)
KR (1) KR100928879B1 (zh)
CN (1) CN100543942C (zh)
SG (1) SG165400A1 (zh)
TW (1) TW200717630A (zh)
WO (1) WO2007040049A1 (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2008340261C1 (en) * 2007-12-21 2015-12-10 Celgene Avilomics Research, Inc. HCV protease inhibitors and uses thereof
JP5199792B2 (ja) * 2008-08-28 2013-05-15 株式会社Ｓｏｋｕｄｏ 基板処理ユニット、基板処理装置および基板処理方法
JP5620530B2 (ja) * 2013-02-15 2014-11-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理ユニットおよび基板処理装置
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
TWI675905B (zh) 2015-11-14 2019-11-01 日商東京威力科創股份有限公司 使用稀釋的氫氧化四甲基銨處理微電子基板的方法
JP6868991B2 (ja) * 2016-09-26 2021-05-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN106449488A (zh) * 2016-11-23 2017-02-22 上海华力微电子有限公司 槽式湿法清洗设备的控制方法
CN110134027B (zh) * 2018-02-09 2021-12-10 富泰华精密电子（郑州）有限公司 表面处理控制系统、表面处理方法及存储设备
JP7494746B2 (ja) * 2021-01-28 2024-06-04 トヨタ自動車株式会社 自律移動システム、自律移動方法及び自律移動プログラム
CN113731907B (zh) * 2021-08-13 2022-05-31 江苏吉星新材料有限公司 蓝宝石产品清洗方法及清洗装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088324A (ja) * 1994-06-23 1996-01-12 Hitachi Ltd 自動搬送装置
JP3572113B2 (ja) 1995-03-24 2004-09-29 シチズン時計株式会社 Ｎｃ工作機械の制御方法
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP3782298B2 (ja) * 2000-10-25 2006-06-07 東京エレクトロン株式会社 洗浄処理装置
KR100877044B1 (ko) 2000-10-02 2008-12-31 도쿄엘렉트론가부시키가이샤 세정처리장치
ITBO20010161A1 (it) 2001-03-21 2002-09-21 Azionaria Costruzioni Automati Apparecchiatura per riempire contenitori con materiali, preferibilmente liquidi
US7094440B2 (en) * 2002-01-22 2006-08-22 Tokyo Electron Limited Substrate treatment method and substrate treatment apparatus
JP2005228961A (ja) 2004-02-13 2005-08-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4514224B2 (ja) * 2005-09-28 2010-07-28 東京エレクトロン株式会社 リンス処理方法、現像処理方法及び現像装置

Also Published As

Publication number Publication date
US8043436B2 (en) 2011-10-25
CN101283440A (zh) 2008-10-08
KR100928879B1 (ko) 2009-11-30
SG165400A1 (en) 2010-10-28
EP1933374B1 (en) 2012-04-11
US20090260655A1 (en) 2009-10-22
EP1933374A1 (en) 2008-06-18
KR20070088772A (ko) 2007-08-29
CN100543942C (zh) 2009-09-23
JP2007103741A (ja) 2007-04-19
WO2007040049A1 (ja) 2007-04-12
TWI314756B (zh) 2009-09-11
EP1933374A4 (en) 2011-01-05

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