TW200715512A - Semiconductor device, electronic module, and method of manufacturing electronic module - Google Patents

Semiconductor device, electronic module, and method of manufacturing electronic module

Info

Publication number
TW200715512A
TW200715512A TW095128148A TW95128148A TW200715512A TW 200715512 A TW200715512 A TW 200715512A TW 095128148 A TW095128148 A TW 095128148A TW 95128148 A TW95128148 A TW 95128148A TW 200715512 A TW200715512 A TW 200715512A
Authority
TW
Taiwan
Prior art keywords
electronic module
semiconductor device
electrode
manufacturing
semiconductor chip
Prior art date
Application number
TW095128148A
Other languages
English (en)
Inventor
Tatsuhiko Asakawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of TW200715512A publication Critical patent/TW200715512A/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
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TW095128148A 2005-08-01 2006-08-01 Semiconductor device, electronic module, and method of manufacturing electronic module TW200715512A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005222747A JP2007042736A (ja) 2005-08-01 2005-08-01 半導体装置及び電子モジュール、並びに、電子モジュールの製造方法

Publications (1)

Publication Number Publication Date
TW200715512A true TW200715512A (en) 2007-04-16

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128148A TW200715512A (en) 2005-08-01 2006-08-01 Semiconductor device, electronic module, and method of manufacturing electronic module

Country Status (4)

Country Link
US (1) US7582967B2 (zh)
JP (1) JP2007042736A (zh)
CN (1) CN1909224A (zh)
TW (1) TW200715512A (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007266111A (ja) * 2006-03-27 2007-10-11 Sharp Corp 半導体装置、それを用いた積層型半導体装置、ベース基板、および半導体装置の製造方法
JP4273356B2 (ja) 2007-02-21 2009-06-03 セイコーエプソン株式会社 半導体装置の製造方法
JP5003592B2 (ja) * 2008-05-21 2012-08-15 セイコーエプソン株式会社 サーマルヘッドおよびサーマルプリンタ
US8053336B2 (en) * 2008-11-12 2011-11-08 Taiwan Semiconductor Manufacturing Company, Ltd. Method for reducing chip warpage
CN103917254B (zh) * 2011-11-21 2016-08-24 凯希特许有限公司 用于识别伤口填充物遗留在组织部位处的部分的系统、装置以及方法
US10072975B2 (en) * 2015-09-04 2018-09-11 Stella Wearables, Inc. Wearable to monitor exposure to UV radiation

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02272737A (ja) 1989-04-14 1990-11-07 Citizen Watch Co Ltd 半導体の突起電極構造及び突起電極形成方法
JP3349058B2 (ja) * 1997-03-21 2002-11-20 ローム株式会社 複数のｉｃチップを備えた半導体装置の構造
US5936304A (en) * 1997-12-10 1999-08-10 Intel Corporation C4 package die backside coating
JP2004253544A (ja) 2003-02-19 2004-09-09 Matsushita Electric Ind Co Ltd 半導体装置の製造方法
JP4096774B2 (ja) * 2003-03-24 2008-06-04 セイコーエプソン株式会社 半導体装置、電子デバイス、電子機器、半導体装置の製造方法及び電子デバイスの製造方法
JP2004335660A (ja) 2003-05-06 2004-11-25 Sony Corp 半導体装置及びその製造方法、並びに配線基板及びその製造方法
JP2005101527A (ja) * 2003-08-21 2005-04-14 Seiko Epson Corp 電子部品の実装構造、電気光学装置、電子機器及び電子部品の実装方法
JP4218622B2 (ja) 2003-10-09 2009-02-04 セイコーエプソン株式会社 半導体装置の製造方法

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US20070023903A1 (en) 2007-02-01
JP2007042736A (ja) 2007-02-15
CN1909224A (zh) 2007-02-07
US7582967B2 (en) 2009-09-01

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