TW200711778A - Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same - Google Patents

Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same

Info

Publication number
TW200711778A
TW200711778A TW094131131A TW94131131A TW200711778A TW 200711778 A TW200711778 A TW 200711778A TW 094131131 A TW094131131 A TW 094131131A TW 94131131 A TW94131131 A TW 94131131A TW 200711778 A TW200711778 A TW 200711778A
Authority
TW
Taiwan
Prior art keywords
solder alloy
electronic substrate
producing
making use
same
Prior art date
Application number
TW094131131A
Other languages
English (en)
Inventor
Keiichi Yamamoto
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of TW200711778A publication Critical patent/TW200711778A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
  • Conductive Materials (AREA)
TW094131131A 2005-09-09 2005-09-09 Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same TW200711778A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/016580 WO2007029329A1 (ja) 2005-09-09 2005-09-09 はんだ合金、そのはんだ合金を用いた電子基板およびその製造方法

Publications (1)

Publication Number Publication Date
TW200711778A true TW200711778A (en) 2007-04-01

Family

ID=37835466

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131131A TW200711778A (en) 2005-09-09 2005-09-09 Solder alloy, and electronic substrate making use of the solder alloy and process for producing the same

Country Status (4)

Country Link
US (1) US20080142124A1 (zh)
JP (1) JPWO2007029329A1 (zh)
TW (1) TW200711778A (zh)
WO (1) WO2007029329A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112025095A (zh) * 2020-09-15 2020-12-04 王志兵 一种激光焊接装置

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51138561A (en) * 1975-05-27 1976-11-30 Asahi Glass Co Ltd Soldering method of oxidized metal surface
JPS5942197A (ja) * 1982-08-31 1984-03-08 Matsushita Electric Works Ltd 半田
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
JP3306007B2 (ja) * 1998-06-30 2002-07-24 株式会社東芝 ハンダ材
US6109506A (en) * 1998-12-23 2000-08-29 Ford Global Technologies, Inc. Method of enhancing a joined metal assembly
JP2000210788A (ja) * 1999-01-27 2000-08-02 Matsushita Electronics Industry Corp 無鉛半田合金およびその製造方法
US20030007885A1 (en) * 1999-03-16 2003-01-09 Shinjiro Domi Lead-free solder
JP4462721B2 (ja) * 2000-06-07 2010-05-12 清仁 石田 はんだ合金及びはんだボール
US6361626B1 (en) * 2000-10-24 2002-03-26 Fujitsu Limited Solder alloy and soldered bond
TW503146B (en) * 2001-11-12 2002-09-21 Taiwan Sunball Internat Techno Method for producing lead-free solder for encapsulation
US6837947B2 (en) * 2002-01-15 2005-01-04 National Cheng-Kung University Lead-free solder
EP1495830B1 (en) * 2002-01-21 2007-08-01 Fujitsu Limited Solder alloy and soldered joint
JP3578453B2 (ja) * 2002-08-23 2004-10-20 日本金属工業株式会社 錫−亜鉛系鉛フリーはんだ合金
US7282175B2 (en) * 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
JP4348212B2 (ja) * 2004-02-26 2009-10-21 ハリマ化成株式会社 Ｓｎ−Ｚｎ系はんだ合金
KR100756134B1 (ko) * 2004-04-21 2007-09-05 닛본 덴끼 가부시끼가이샤 솔더 및 그것을 사용한 실장품

Also Published As

Publication number Publication date
JPWO2007029329A1 (ja) 2009-03-26
US20080142124A1 (en) 2008-06-19
WO2007029329A1 (ja) 2007-03-15

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