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Electric Connection Of Electric Components To Printed Circuits
(AREA)
Conductive Materials
(AREA)
Abstract
A lead-free soldering composition is disclosed. It consists of 0.01 wt% to 4.0 wt% silver, 1.0 wt% to 1.7 wt% copper, 0.01 wt% to 1.0 wt% rare earth elements, 0.01 wt% to 1.0 wt% gallium and the balance of tin to form 100 wt% of the composition. A proper amount of copper in the composition may increase vibration fatigue resistance of the soldering compound while the addition of the rare earth elements and gallium may reduce roughness of the solidified surface structure of the micro sized solder ball. In this way, soldering spot formed from the soldering compound of this invention used for electronic hardwares will gives better adhesion strength and reliability.
TW94115221A2005-05-112005-05-11Lead-free soldering alloy composition resistant to vibration fatigue
TWI271437B
(en)
Lead-free solder alloy, solder ball and electronic member, and lead-free solder alloy, solder ball and electronic member for automobile-mounted electronic member
A prevention method of brittle fracture for a package fabricated by joining an electronic component finished with nickel and another electronic component finished with electroless ni(p) metallization