1271437 九、發明說明： 【發明所屬之技術領域】 本發明是關於-種無轉錫合金組成物，特別是 指—種適合作為電子零件的銲點，並含有錫、銀、銅 、稀土族兀素及鎵元素等之無鉛銲錫合金組成物。 【先前技術】1271437 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a non-transfer tin alloy composition, in particular to a solder joint suitable for use as an electronic component, and contains tin, silver, copper, and rare earth lanthanum. A lead-free solder alloy composition such as a gallium element or a gallium element. [Prior Art]
在已知的技藝中，錫，合金經常被用來作為電子 零件的銲料，，㈣於錯及其化合物對環境的污染嚴重 ，且近年來漸遭國際環境限用，因此，無錯銲锡合金 之應用曰益廣泛。而目前「無錯鲜料」可依基材不同 大致可區分為：錫-銀（Sn_Ag)合金、錫鋅（Sn_z啦金 ’=及錫，（Sn-Bi)合金三種，其中在錫_銀合金中加入 v里的銅孟屬，使其成為「錫_銀_銅（以下簡稱Sn_Ag_ 上，此處所謂的少量係指合計 物中，含有1重量份以下之銅金 CU)合金」系的銲料，更廣泛被運用在電子零件的構裝 100重量份之合金組成 屬。 惟隨著電子構裝元件微小化的趨勢，產業界對於 以錫金屬為主要材料之銲錫球的尺寸要求也愈來愈小 ，一般而言，球徑在〇.4mm左右的銲錫球稱為中等粒 徑，球控小於〇·lmm者稱為「小尺寸銲錫球」，而「小 尺寸銲錫球」之銲錫球表面凝固組織特性也逐漸被重 視。目前為止，Sn-Ag-Cu系合金製程上經常出現高粗 糙度皮膜組織，此種皮膜組織對於「小尺寸銲錫球」 的品質及可靠度有密切關係。亦即，當銲錫球的尺寸 5 1271437 越小時’其凝固速率命 柊声的描/ & 也越各易造成球體表面教 才把度的增加，當銲錫玻 阳⑷ 衣之表面較為粗糙時，在後續的 迴焊製程中容易因接合強度 只的 度差等等的情形。㊣度太低’而產生掉球、可靠 卜電子零件銲點常會因為機械運轉或電器產 品使用，使得由銲錫跋所 此 欠所構成之銲點經常處於振動狀 悲，因此，振動破壞對 Α 裘對知點可罪度所可能造成的影缒In the known art, tin, alloy is often used as a solder for electronic parts, (4) the fault and its compounds are seriously polluted by the environment, and in recent years, it has been restricted by the international environment, therefore, the error-free solder alloy The application has a wide range of benefits. At present, "no error fresh material" can be roughly divided into: tin-silver (Sn_Ag) alloy, tin-zinc (Sn_z lajin' = and tin, (Sn-Bi) alloy, among which tin-silver In the alloy, a genus of copper is added to the alloy, and it is made of "tin-silver-copper (hereinafter referred to as Sn_Ag_, a total of 1 part by weight or less of the total amount of the copper-gold CU). Solder is widely used in the assembly of electronic components in 100 parts by weight of alloy composition. However, with the trend of miniaturization of electronic components, the industry is increasingly demanding the size of solder balls using tin metal as the main material. The smaller, in general, the solder ball with a ball diameter of about 4 mm is called medium particle size, the ball control is less than 〇·lmm, which is called “small size solder ball”, and the solder ball surface of “small size solder ball”. The characteristics of solidification structure have also been paid more and more attention. So far, the high-roughness film structure often occurs in the Sn-Ag-Cu alloy process, and the film structure is closely related to the quality and reliability of the "small size solder ball". When the size of the solder ball is 5 1271437, the smaller At the time of 'the solidification rate, the sound of the sound is also easy to cause the surface of the sphere to increase. When the surface of the solder glass (4) is rough, it is easy to be bonded in the subsequent reflow process. Only the degree of difference, etc. The degree is too low' and the ball is dropped. The reliable soldering point of the electronic parts is often caused by the mechanical operation or the use of electrical products, so that the solder joints formed by the solder 经常 are often vibrating. Sadness, therefore, the impact of vibration damage on the guilty degree of knowing the point
亦逐漸受到矚目，但此領域 " 。明Α之相關貧料報告不多， 其热船鲜錫部份仍相者缺$ ^ 祁田缺乏。本發明即針對Sn-Ag-Cu 系合金之接合強度及耐振動疲勞特性作研究， 供-種適合運用在經常處於振動狀態之電子零件上的 合金組成物。 【發明内容】 本發明之目的係在提彳丘一猶呈 攸仏種具有較佳耐振動疲勞 特性及接合強度之無鉛銲錫合金組成物。 本發明之無鉛銲錫合金組成物包含以下成份： 0.01〜4.0重量份的銀（八§); 1·〇〜1.7重量份的銅（cu); 0·01〜1.0重量份之稀土族元素（RE); 0.01〜1.0重量份的鎵元素（Ga);以及 與前述元素合計1〇〇重量份的錫（Sn)。 其中所謂的稀土族（Rare Earth)元素係泛指··銳元 素（Sc)、釔元素（Y)及「鑭系元素」，上述「鑭系元素 包括··鑭（La)、鈽（Ce)、镨（pr)、鈥（Nd)、金^^)、釦 1271437 . * (Sm)、銪（Eu)、釓（Gd)、铽（Tb)、鏑、鈥⑽卜铒 : (Er)、铥（Tm)、鏡（Yb)及餾（Lu)，但在產業的利用上， # 土族it素通常係以混合物的形態存在，鮮少為純物 質，常見之稀土族元素混合物係由··鑭、鈽、镨、鈥 、釤以及極少量的鐵、磷、硫、矽組成。 在本發明中，當稀土族元素及鎵元素的含量低於 0·01重量份時，對於由合金組成物所構成之銲錫球的 表面粗糙度沒有顯著的改善效果，而當稀土族元素及 — 鎵元素的添加量高於L0重量份時，除了造成成本大量 增加外，也容易在組織中產生其他的化合物，進而影 響到銲點的通電特性。此外，本發明在組成物中添加 適當的銅金屬，其目的除了可以取代銀的含量，以降 低製造成本外，當銅金屬的使用量高於1·0重量份時， 亦Τ #疋咼&盃組成物之熱疲勞特性（thermauatigue)， 同時對於振動特性亦有很大的幫助。 • 藉該稀土族元素以及鎵元素之添加，可以改善小 尺寸鲜錫球之表面凝固組織的粗糙度，並使該合金組 成物應用在電子零件的構裝上時具有較佳的耐振動疲 勞阻抗。 【實施方式】 本發明之前述以及其他技術内容、特點與功效， 在以下配合實施例及比較例的說明，將可清楚的明白 〇 【比較例1〜4】 7 於表1中，古女竺 ^專比較例主要在於測試當人入έ 加入稀土族元辛的 σ孟、、且成物中 土卜主 I的^ ’在該等比較例中所〜 素是一種混合物，以總計i :加的稀 稀土族元素混合物中包含：31 知為例，該 重量份的鈽、4〜5重 1份的鍚1、45〜48 0·1〜0.5重量份的 里伤的敍、 磷、炉 及合計h5重量份以下的料 舛硫、石夕。由矣 r的鐵、 , 田表1的貫驗結果得知，备入入4 :加入稀土族元素時…得到不錯的二二且成物 日士 ’其中組成物中之銅金屬的使用量若高於15重！特 =組成物的初始偏移量（initiaide細iQn)會=置份 且：物的耐振動疲勞特性亦有明顯的增加。、且 4不可知，當組成物中加入〇·1重量份之稀土回的 (即比較.例7)，銲錫球的表面較為粗接元素時 :谷易產生脫落的現象，而由目3的 、 2而得’當組成物中稀土族元素的添加量為0:重： 伤打，銲錫球的表面粗糙度明顯獲得改善。 里 【實施例1〜6】 本發明各實施例的組成及比例關係載於表2，其中 稀土族元素的成份如比較例5所說明者，由比較例6 及實施例1之比對，以及比較例8及實施例4之比對 可知’本發明在合金組成物中加入〇 〇5重量份之蘇元 素時，對於組成物之振動頻率、初始偏移量以及对振 動疲勞特性等物性沒有顯著影響，但由圖4之實施例4 及圖3之比較例8的圖形比對可知，在合金組成物中 I271437 【圖式簡單說明】 圖1是一曲線圖，說明組成物+ ^ a p 乂物中鋼金屬含量與拉 伸強度間的對應關係； 圖2是本發明比較例7之實物揭口 只切像口口的局部照片； 圖3是本發明比較例8之實物樣品的局部照片； 圖4是本發明實施例4之實物樣品的照片；It has also gradually attracted attention, but this field ". There are not many reports on the related poor materials of Alum, and the hot tin of the hot boat is still missing. The present invention is directed to the joint strength and vibration fatigue resistance of the Sn-Ag-Cu alloy, and is an alloy composition suitable for use in electronic parts which are often in a vibrating state. SUMMARY OF THE INVENTION The object of the present invention is to provide a lead-free solder alloy composition having better vibration fatigue resistance and joint strength. The lead-free solder alloy composition of the present invention comprises the following components: 0.01 to 4.0 parts by weight of silver (eight §); 1·〇 to 1.7 parts by weight of copper (cu); 0·01 to 1.0 part by weight of rare earth elements (RE) 0.01 to 1.0 part by weight of gallium element (Ga); and 1 part by weight of tin (Sn) in total with the above elements. The rare earth element (Rare Earth) element refers to · sharp element (Sc), yttrium element (Y) and "lanthanide element", and the above "lanthanide elements include · 镧 (La), 钸 (Ce) , 镨 (pr), 鈥 (Nd), gold ^^), deduction 1271437. * (Sm), 铕 (Eu), 釓 (Gd), 铽 (Tb), 镝, 鈥 (10) 铒: (Er),铥 (Tm), mirror (Yb) and distillation (Lu), but in the industrial use, #土族素素 usually exists in the form of a mixture, rarely a pure substance, the common mixture of rare earth elements is ···镧, 钸, 镨, 鈥, 钐 and a very small amount of iron, phosphorus, sulfur, bismuth. In the present invention, when the content of the rare earth element and the gallium element is less than 0. 01 parts by weight, for the alloy composition The surface roughness of the solder ball formed has no significant improvement effect, and when the addition amount of the rare earth element and the gallium element is higher than the L0 parts by weight, in addition to causing a large increase in cost, it is easy to produce other compounds in the tissue. , in turn, affecting the energization characteristics of the solder joint. In addition, the present invention adds appropriate copper metal to the composition for the purpose It can replace the content of silver to reduce the manufacturing cost. When the amount of copper metal used is higher than 1.0 part by weight, the thermal fatigue characteristics (thermauatigue) of the #疋咼& cup composition, and the vibration characteristics are also It is very helpful. • By adding the rare earth element and the gallium element, the roughness of the surface solidification structure of the small-sized fresh tin ball can be improved, and the alloy composition can be applied to the electronic component assembly. The above-mentioned and other technical contents, features and effects of the present invention will be clearly understood from the following description of the examples and comparative examples. [Comparative Examples 1 to 4] In Table 1, the ancient female 竺^ special case is mainly used to test the σ 孟 孟 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The mixture, in total i: added rare earth element mixture contains: 31, for example, the parts by weight of bismuth, 4 to 5 parts by weight of 钖1, 45~48 0·1~0.5 parts by weight of the wound VII, phosphorus, furnace and total h5 weight The following materials are sulphur, Shi Xi. From the iron of 矣r, the results of the field 1 test, the preparation of 4: when adding rare earth elements... get a good 22nd and become a Japanese The amount of copper metal used in the composition is higher than 15 weights! The initial offset of the composition (initiaide fine iQn) will be set and the vibration fatigue resistance of the material will also increase significantly. It is not known that when the composition is added with 1 part by weight of rare earth back (ie, comparison. Example 7), when the surface of the solder ball is relatively thick, the grain tends to fall off, and the target is 2, 2 It is obtained that when the rare earth element is added in the composition, the amount of the rare earth element is 0: heavy: the surface roughness of the solder ball is remarkably improved. [Examples 1 to 6] The compositions and proportional relationships of the respective examples of the present invention are shown in Table 2, wherein the composition of the rare earth element is as described in Comparative Example 5, and the comparison between Comparative Example 6 and Example 1 is carried out, In comparison with Comparative Example 8 and Example 4, when the present invention adds 5 parts by weight of a threon element to the alloy composition, there is no significant difference in the vibration frequency, the initial offset amount, and the vibration fatigue property of the composition. Effect, but from the pattern comparison of Example 4 of FIG. 4 and Comparative Example 8 of FIG. 3, I271437 in the alloy composition [Simplified illustration of the drawing] FIG. 1 is a graph illustrating the composition + ^ ap Figure 2 is a partial photograph of the physical image of the comparative example 7 of the present invention; Figure 3 is a partial photograph of the physical sample of Comparative Example 8 of the present invention; 4 is a photograph of a physical sample of Example 4 of the present invention;
圖5是本發明實施例5之實物樣品的照片；及 圖ό是本發明實施例6之實物樣品的照片。 表1:本發明各比較例之成份、各成份使用量及物 性測試。 表2 :本發明各實施例之成份、各成份使用量及物 性測試。Figure 5 is a photograph of a physical sample of Example 5 of the present invention; and Figure 5 is a photograph of a physical sample of Example 6 of the present invention. Table 1: The components, the amounts of each component used, and the physical properties of the comparative examples of the present invention. Table 2: The components, the amounts of each component used, and the physical properties of the examples of the present invention.
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