JP2012183558A - Lead-free solder alloy and solder joint using the same - Google Patents

Lead-free solder alloy and solder joint using the same Download PDF

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JP2012183558A
JP2012183558A JP2011048797A JP2011048797A JP2012183558A JP 2012183558 A JP2012183558 A JP 2012183558A JP 2011048797 A JP2011048797 A JP 2011048797A JP 2011048797 A JP2011048797 A JP 2011048797A JP 2012183558 A JP2012183558 A JP 2012183558A
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lead
solder alloy
free solder
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solder
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Tetsuro Nishimura
西村哲郎
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Nihon Superior Sha Co Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a lead-free solder alloy which accommodates high-temperature soldering which needs a liquidus-line temperature of about 250-400°C without containing lead, gold or the like, and secure high reliability of a solder joint portion, and to provide a solder joint which is soldered using the lead-free solder alloy at a low price.SOLUTION: The lead-free solder alloy includes: 1-10 wt.% of Al, one or more elements selected from 0.001-1 wt.% of Ga, 0.1-10 wt.% of In, 0.001-10 wt.% of Ge, 0.1-10 wt.% of Si and 0.1-10 wt.% of Sn as an additive component for improving wettability, and the balance of Zn and unavoidable impurities. Further, 0.0001-1 wt.% of Mn and/or Ti are added and mixed to the composition, whereby reliability of solder joining is improved due to suppression of surface oxidation of a solder joint portion and the like.

Description

本発明は、鉛フリーはんだ合金に関し、詳しくはＺｎ−Ａｌを基本組成とする高温鉛フリーはんだ合金及び当該はんだ合金を用いてはんだ付けを行ったはんだ継手に関する。 The present invention relates to a lead-free solder alloy, and more particularly to a high-temperature lead-free solder alloy having a basic composition of Zn-Al and a solder joint soldered using the solder alloy.

電子部品等のはんだ付けにおいて、人体や環境に有害な鉛を含まないはんだ合金が用いられており、液相線温度が２００℃〜２５０℃の温度域においてＳｎ−Ａｇ系及びＳｎ−Ｃｕ系はんだ合金等の実用化が進んでいる。一方、車載用電子部品やパワートランジスタ素子のダイボンディング等においては２５０℃〜４００℃のより高温の温度域でのはんだ接合に対応した高い液相線温度を有するはんだ合金が必要とされている。
しかしながら、係る高温はんだ合金は、鉛を高濃度に含有したはんだ合金や金を高濃度に配合したはんだ合金が依然として市場で多く用いられている。 In soldering electronic parts, a solder alloy that does not contain lead harmful to the human body and the environment is used, and Sn-Ag solder and Sn-Cu solder in a liquidus temperature range of 200 ° C to 250 ° C. Practical use of alloys and the like is progressing. On the other hand, a solder alloy having a high liquidus temperature corresponding to solder bonding in a higher temperature range of 250 ° C. to 400 ° C. is required for in-vehicle electronic components and die bonding of power transistor elements.
However, as such a high temperature solder alloy, a solder alloy containing lead in a high concentration and a solder alloy containing gold in a high concentration are still widely used in the market.

一方では、環境への配慮から、鉛や金を配合しない高温はんだ合金の検討がなされている。例えば、特許文献１及び特許文献２にはＳｎ-Ｚｎはんだ合金にＭｇやＧａ、Ｇｅを添加した鉛フリーはんだ合金が、特許文献３にはＳｎ-Ｓｂ鉛フリーはんだ合金が、特許文献４にはＳｎ-Ａｕ-Ａｇ鉛フリーはんだ合金が、特許文献５にはＳｎ-Ｓｂ-Ｃｕ鉛フリーはんだ合金がそれぞれ開示されている。 On the other hand, high temperature solder alloys not containing lead or gold have been studied for environmental considerations. For example, Patent Literature 1 and Patent Literature 2 include a lead-free solder alloy obtained by adding Mg, Ga, and Ge to a Sn—Zn solder alloy, Patent Literature 3 includes a Sn—Sb lead-free solder alloy, and Patent Literature 4 discloses An Sn—Au—Ag lead-free solder alloy is disclosed in Patent Document 5 and an Sn—Sb—Cu lead-free solder alloy is disclosed in Patent Document 5, respectively.

しかし、上記特許文献１〜５は、液相線温度こそ２５０℃以上を有し、高温域でのはんだ接合として提案されているものの、それぞれ問題点を有している。
例えば、特許文献１及び特許文献２の鉛フリーはんだ合金は、何れもＺｎ−Ａｌ基本組成として、特許文献１はＡｌの配合量を１〜７重量％として、これにＭｇ及びＧａを配合したものであり、特許文献２はＡｌの配合量を２〜９重量％として、これにＧｅ並びにＳｎ及び／又はＩｎを配合したものであり、従来のＳｎ−Ｚｎ系はんだ合金に比べ濡れ性が改善されているが満足するには至っていないのが現状である。
特許文献３の鉛フリーはんだ合金は、２５〜４４重量％のＳｂと残部がＳｎからなる鉛フリーはんだ合金で、機械的強度特性に優れているという半面、はんだ接合部の脆さとＳｂの人体への有害性が指摘されており、問題点を残している。
特許文献４の鉛フリーはんだ合金は、Ａｕが４０〜５５重量％、Ａｇが２〜１２重量％、残部をＳｎからなる鉛フリーはんだ合金であり、機械的強度特性や信頼性に優れているが、貴金属特にＡｕを多量に含有しているため高コストが問題として残されている。
特許文献５の鉛フリーはんだ合金は、Ｓｂが１０〜４０重量％、Ｃｕが０．５〜１０重量％、残部をＳｎからなる鉛フリーはんだ合金であり、特許文献３同様に機械的強度特性に優れているが、Ｓｂの高配合に伴う有害性やはんだ接合部の脆さの問題点が残されている。 However, although the above-mentioned Patent Documents 1 to 5 have a liquidus temperature of 250 ° C. or higher and have been proposed as solder joints in a high temperature region, they have respective problems.
For example, the lead-free solder alloys of Patent Document 1 and Patent Document 2 both have a Zn—Al basic composition, and Patent Document 1 has a blending amount of Al of 1 to 7% by weight, and this is blended with Mg and Ga. In Patent Document 2, the blending amount of Al is set to 2 to 9% by weight, and Ge and Sn and / or In are blended therein. The wettability is improved as compared with the conventional Sn-Zn solder alloy. However, the situation is not satisfactory.
The lead-free solder alloy of Patent Document 3 is a lead-free solder alloy consisting of 25 to 44% by weight of Sb and the balance of Sn, which is excellent in mechanical strength characteristics, and the brittleness of the solder joint and the human body of Sb. Has been pointed out and remains a problem.
The lead-free solder alloy of Patent Document 4 is a lead-free solder alloy composed of 40 to 55% by weight of Au, 2 to 12% by weight of Ag, and the balance of Sn, and has excellent mechanical strength characteristics and reliability. The high cost remains as a problem because it contains a large amount of noble metal, especially Au.
The lead-free solder alloy of Patent Document 5 is a lead-free solder alloy comprising 10 to 40% by weight of Sb, 0.5 to 10% by weight of Cu, and the balance being Sn. Although it is excellent, the problem of the harmfulness accompanying the high blending of Sb and the brittleness of the solder joint portion remains.

特開平１１−１７２３５２号公報JP-A-11-172352 特開平１１−１７２３５３号公報Japanese Patent Laid-Open No. 11-172353 特開平１１−１５１５９１号公報Japanese Patent Laid-Open No. 11-151591 国際公開ＷＯ２００６／０４９０２４号公報International Publication WO2006 / 049024 特開２００９−２５５１７６号公報JP 2009-255176 A

本発明は、前記事情に鑑み、鉛や金等を含有することなく、液相線温度が２５０℃〜４００℃程度必要となる高温はんだ付けに対応し、はんだ接合部の高信頼性を確保した鉛フリーはんだ合金及び当該鉛フリーはんだ合金を用いてはんだ付けを行ったはんだ継手を低価格で提供することである。 In view of the above circumstances, the present invention is compatible with high-temperature soldering that requires a liquidus temperature of about 250 ° C. to 400 ° C. without containing lead or gold, and ensures high reliability of the solder joint. A lead-free solder alloy and a solder joint soldered using the lead-free solder alloy are provided at a low price.

発明者は、本発明の課題を解決すべく鋭意検討した結果、Ａｌを１〜１０重量％、濡れ性を改善する添加成分を特定量配合し、残部をＺｎ及び不可避不純物からなる鉛フリーはんだ合金とすることにより、液相線温度が２５０℃〜４００℃となる高温域でのはんだ接合に対応し、しかも、優れたはんだ特性を有することを見出し、発明の完成に至った。
即ち、本発明は、Ａｌを１〜１０重量％、濡れ性を改善する添加成分として、Ｇａが０．００１〜１重量％、Ｉｎが０．１〜１０重量％、Ｇｅが０．００１〜１０重量％、Ｓｉが０．１〜１０重量％、及びＳｎが０．１〜１０重量％の中から選ばれる１種又は２種以上を配合し、残部をＺｎ及び不可避不純物からなる鉛フリーはんだ合金からなる。 As a result of intensive studies to solve the problems of the present invention, the inventor has mixed 1 to 10% by weight of Al, a specific amount of additive components that improve wettability, and the balance is a lead-free solder alloy composed of Zn and inevitable impurities As a result, the present inventors have found that the liquidus temperature corresponds to solder joining in a high temperature range of 250 ° C. to 400 ° C. and has excellent solder characteristics, and the invention has been completed.
That is, according to the present invention, Al is 1 to 10% by weight, Ga is 0.001 to 1% by weight, In is 0.1 to 10% by weight, and Ge is 0.001 to 10% as additive components for improving wettability. A lead-free solder alloy containing one or more selected from wt%, Si 0.1 to 10 wt%, and Sn 0.1 to 10 wt%, with the balance being Zn and inevitable impurities Consists of.

更に、前記組成に、Ｍｎ及び、又はＴｉを０．０００１〜１重量％を加えて配合することにより、はんだ接合部の表面酸化が抑制される等のはんだ接合の信頼性が向上する。 Further, by adding 0.0001 to 1% by weight of Mn and / or Ti to the above composition, the reliability of solder joint such as suppression of surface oxidation of the solder joint is improved.

本発明の鉛フリーはんだ合金は、鉛を含有しないはんだ合金であるため、環境に配慮したはんだ接合を可能とすることは勿論のこと、ＡｕやＡｇ等の高価な金属を含まずＺｎ及びＡｌを基本組成に、特定量のＧａ、Ｉｎ、Ｇｅ、Ｓｉ、及びＭｎの１種又は２種以上を添加した組成よりなるため、低価格でありながら高温はんだ接合に対応した高信頼性を有するはんだ接合に加え、アルミニウム部材に対しても高信頼性を有するはんだ接合を提供することが可能である。 Since the lead-free solder alloy of the present invention is a solder alloy that does not contain lead, it does not include expensive metals such as Au and Ag, as well as enabling environment-friendly solder bonding. Solder joint with high reliability corresponding to high-temperature solder joints at low cost because it consists of a basic composition with one or more of Ga, In, Ge, Si, and Mn added in a specific amount In addition, it is possible to provide solder joints having high reliability even for aluminum members.

図１は、Ｚｎ−Ａｌの２成分状態図。FIG. 1 is a two-component phase diagram of Zn—Al. 図２は、Ｚｎ−Ｇａの２成分状態図。FIG. 2 is a two-component state diagram of Zn—Ga. 図３は、Ｚｎ−Ｉｎの２成分状態図。FIG. 3 is a two-component state diagram of Zn—In. 図４は、Ｚｎ−Ｇｅの２成分状態図。FIG. 4 is a two-component state diagram of Zn—Ge. 図５は、Ｚｎ−Ｓｉの２成分状態図。FIG. 5 is a two-component state diagram of Zn—Si. 図６は、Ｚｎ−Ｓｎの２成分状態図。FIG. 6 is a two-component state diagram of Zn—Sn.

以下に、本発明の高温鉛フリーはんだ合金について詳細に説明する。
本発明の高温鉛フリーはんだ合金は、Ｚｎ−Ａｌを基本組成として、濡れ性を改善する添加成分、更に、Ｍｎを加えて配合した鉛フリーはんだ合金及び当該鉛フリーはんだ合金を用いてはんだ付けをしたはんだ継手である。
即ち、本発明の鉛フリーはんだ合金は、Ｚｎに１〜１０重量％のＡｌを配合した基本組成に、濡れ性を改善する添加成分であるＧａが０．００１〜１重量％、Ｉｎが０．１〜１０重量％、Ｇｅが０．００１〜１０重量％、Ｓｉが０．１〜１０重量％、及びＳｎが０．１〜１０重量％の中から選ばれる１種又は２種以上を配合した鉛フリー合金であり、更に、はんだ接合部の酸化を抑制する効果を有するＭｎ及び、又はＴｉを０．０００１〜１重量％を加えて配合したことを特徴とする鉛フリーはんだ合金である。 Hereinafter, the high-temperature lead-free solder alloy of the present invention will be described in detail.
The high-temperature lead-free solder alloy of the present invention has a basic composition of Zn-Al, an additive component that improves wettability, and a lead-free solder alloy containing Mn added and soldered using the lead-free solder alloy Solder joint.
That is, the lead-free solder alloy of the present invention has a basic composition in which 1 to 10% by weight of Al is added to Zn, 0.001 to 1% by weight of Ga which is an additive component for improving wettability, and 0.1% of In. 1 to 10% by weight, Ge is 0.001 to 10% by weight, Si is 0.1 to 10% by weight, and Sn is selected from one or more selected from 0.1 to 10% by weight It is a lead-free alloy, and further is a lead-free solder alloy characterized by adding 0.0001 to 1% by weight of Mn and / or Ti having an effect of suppressing oxidation of the solder joint.

本発明の鉛フリーはんだ合金は、従来のＺｎを多量に含有する鉛フリーはんだ合金の問題点であった濡れ性の悪さを改善し、また、車載用電子部品やパワートランジスタ素子のダイボンディング等において必要とされる高温でのはんだ接合にも対応した高い液相線温度を有することを特徴としている。
本発明の鉛フリーはんだ合金の特徴の一つである優れた濡れ性は、Ｚｎ-Ａｌ基本組成に、Ｇａ、Ｉｎ、Ｇｅ、Ｓｉ、及びＳｎを特定量配合することによって可能となる。
また、上記組成に追加して、Ｍｎ及び、又はＴｉを特定量添加することにより、飛躍的にはんだ接合部の酸化が抑制されて、はんだ接合の高い信頼性を有することを可能とした。
そして、本発明の鉛フリーはんだ合金の特徴として、従来の電子部品に多く用いられている銅及びニッケルメッキ部材は勿論のこと、アルミニウム材料に対しても良好な接合特性を有することである。 The lead-free solder alloy of the present invention improves the poor wettability, which is a problem of conventional lead-free solder alloys containing a large amount of Zn, and is suitable for die bonding of electronic components for vehicles and power transistor elements. It is characterized by having a high liquidus temperature corresponding to the required high-temperature solder joints.
The excellent wettability, which is one of the characteristics of the lead-free solder alloy of the present invention, can be achieved by adding specific amounts of Ga, In, Ge, Si, and Sn to the basic Zn-Al composition.
Further, by adding a specific amount of Mn and / or Ti in addition to the above composition, oxidation of the solder joint portion is remarkably suppressed, and it is possible to have high reliability of solder joint.
A feature of the lead-free solder alloy of the present invention is that it has a good bonding property not only with copper and nickel plating members that are often used in conventional electronic components, but also with aluminum materials.

本発明の鉛フリーはんだ合金の構成成分であるＡｌの配合量は、本発明の効果を有する範囲において制限はないが、１〜１０重量％が好ましく、６重量％付近が更に好ましい。これは、図１に示すＺｎ−Ａｌの２成分状態図からもわかるように共晶点であるＡｌが６重量％と合致し、液相線温度が最も低くなる配合量であり、はんだ付けの作業性に有利な点とも合致する。 The blending amount of Al, which is a constituent component of the lead-free solder alloy of the present invention, is not limited within the range having the effects of the present invention, but is preferably 1 to 10% by weight, and more preferably around 6% by weight. As can be seen from the two-component phase diagram of Zn—Al shown in FIG. 1, Al is the eutectic point, which is equal to 6% by weight, and the liquidus temperature is the lowest. It is also consistent with workability advantages.

本発明の鉛フリーはんだ合金の構成成分である濡れ性を改善する添加成分は、本発明の効果を有する範囲において種類と配合量に制限はないが、Ｇａ、Ｉｎ、Ｇｅ，Ｓｉ、及びＳｎが好ましく、前述の各成分は単独でも複数を組み合わせて配合しても構わない。また、それぞれの成分の配合量はＧａが０．００１〜１重量％、Ｉｎが０．１〜１０重量％、Ｇｅが０．００１〜１０重量％、Ｓｉが０．１〜１０重量％、及びＳｎが０．１〜１０重量％が好ましい。 The additive component for improving wettability, which is a constituent component of the lead-free solder alloy of the present invention, is not limited in type and amount in the range having the effect of the present invention, but Ga, In, Ge, Si, and Sn are not limited. Preferably, each of the aforementioned components may be blended alone or in combination. The blending amount of each component is 0.001 to 1% by weight for Ga, 0.1 to 10% by weight for In, 0.001 to 10% by weight for Ge, 0.1 to 10% by weight for Si, and Sn is preferably 0.1 to 10% by weight.

本発明の鉛フリーはんだ合金の構成成分であるＭｎ及びＴｉの配合量は、本発明の効果を有する範囲において、制限はないが、０．０００１〜１重量％が好ましい。その他元素を適量添加しても構わない。勿論、その他成分には不可避不純物は含まれる。
また、本発明の鉛フリーはんだ合金は、上記の構成成分に加え、本発明の効果を損なわない範囲において他の組成を配合しても構わない。
そして、本発明の鉛フリーはんだ合金は、その形態に制限はなく、インゴット・棒タイプ、ペーストタイプ、はんだ箔やワイヤー等への製品供給形態に応用が可能で、ディップタイプ及びリフロータイプのはんだ付けにも対応可能である。 The blending amount of Mn and Ti, which are constituent components of the lead-free solder alloy of the present invention, is not limited within the range having the effects of the present invention, but is preferably 0.0001 to 1% by weight. An appropriate amount of other elements may be added. Of course, other components contain inevitable impurities.
Further, the lead-free solder alloy of the present invention may contain other compositions in addition to the above-described constituent components as long as the effects of the present invention are not impaired.
The form of the lead-free solder alloy of the present invention is not limited, and can be applied to product supply forms such as ingot / bar type, paste type, solder foil or wire, and dip type and reflow type soldering. Can also be supported.

上述の如く、本発明の鉛フリーはんだ合金を用いることにより、濡れ性に優れ、高い信頼性を有するはんだ継手を得ることが可能である。
As described above, by using the lead-free solder alloy of the present invention, a solder joint having excellent wettability and high reliability can be obtained.

Claims (6)

Ａｌが１〜１０重量％、及び濡れ性を改善する添加成分を含み、残部がＺｎ及び不可避不純物からなることを特徴とする鉛フリーはんだ合金。 A lead-free solder alloy comprising 1 to 10% by weight of Al and an additive component for improving wettability, the balance being made of Zn and inevitable impurities. 濡れ性を改善する添加成分が、Ｇａが０．００１〜１重量％、Ｉｎが０．１〜１０重量％、Ｇｅが０．００１〜１０重量％、Ｓｉが０．１〜１０重量％、及びＳｎが０．１〜１０重量％の中から選ばれる１種又は２種以上であることを特徴とする請求項１記載の鉛フリーはんだ合金。 Additive components that improve wettability are 0.001 to 1% by weight of Ga, 0.1 to 10% by weight of In, 0.001 to 10% by weight of Ge, 0.1 to 10% by weight of Si, and The lead-free solder alloy according to claim 1, wherein Sn is one or more selected from 0.1 to 10% by weight. Ａｌが５〜７重量％であることを特徴とする請求項１乃至２記載の鉛フリーはんだ合金。 The lead-free solder alloy according to claim 1 or 2, wherein Al is 5 to 7% by weight. Ｍｎ及び、又はＴｉを０．０００１〜１重量％含有させたことを特徴とする請求項１乃至請求項３記載の鉛フリーはんだ合金。 4. The lead-free solder alloy according to claim 1, wherein 0.0001 to 1% by weight of Mn and / or Ti is contained. 濡れ性を改善する添加成分として、Ｇａを０．００１〜１重量％含有することを特徴とする請求項３乃至請求項４記載の鉛フリーはんだ合金。 The lead-free solder alloy according to any one of claims 3 to 4, wherein 0.001 to 1% by weight of Ga is contained as an additive component for improving wettability. 請求項１乃至請求項５記載の鉛フリーはんだ合金を用いてはんだ付けしたはんだ継手。
A solder joint soldered using the lead-free solder alloy according to claim 1.
JP2011048797A 2011-03-07 2011-03-07 Lead-free solder alloy and solder joint using the same Withdrawn JP2012183558A (en)

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JP2013081995A (en) * 2011-10-12 2013-05-09 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT
JP2014151364A (en) * 2013-02-13 2014-08-25 Toyota Industries Corp Solder and die bond structure
JP2014221484A (en) * 2013-05-13 2014-11-27 住友金属鉱山株式会社 Pb-FREE Zn-BASED SOLDER PASTE
WO2014203425A1 (en) * 2013-06-20 2014-12-24 三菱電機株式会社 Zn-based lead-free solder and semiconductor power module
JP2015098048A (en) * 2013-11-19 2015-05-28 住友金属鉱山株式会社 Zn-Ge-BASED SOLDER ALLOY WITHOUT Pb, AND ELECTRONIC COMPONENT USING THE SAME
US20150151387A1 (en) * 2013-12-04 2015-06-04 Honeywell International Inc. Zinc-based lead-free solder compositions
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
CN106536108A (en) * 2014-04-17 2017-03-22 贺利氏材料新加坡私人有限公司 Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
CN111250896A (en) * 2020-03-26 2020-06-09 郑州机械研究所有限公司 High-strength, corrosion-resistant and low-melting brazing filler metal for aluminum alloy honeycomb plate and preparation method

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013081995A (en) * 2011-10-12 2013-05-09 Sumitomo Metal Mining Co Ltd Pb-FREE SOLDER ALLOY INCLUDING Zn AS MAIN COMPONENT
JP2014151364A (en) * 2013-02-13 2014-08-25 Toyota Industries Corp Solder and die bond structure
US9520347B2 (en) 2013-05-03 2016-12-13 Honeywell International Inc. Lead frame construct for lead-free solder connections
JP2014221484A (en) * 2013-05-13 2014-11-27 住友金属鉱山株式会社 Pb-FREE Zn-BASED SOLDER PASTE
CN105324209A (en) * 2013-06-20 2016-02-10 三菱电机株式会社 Zn-based lead-free solder and semiconductor power module
WO2014203425A1 (en) * 2013-06-20 2014-12-24 三菱電機株式会社 Zn-based lead-free solder and semiconductor power module
JP2015098048A (en) * 2013-11-19 2015-05-28 住友金属鉱山株式会社 Zn-Ge-BASED SOLDER ALLOY WITHOUT Pb, AND ELECTRONIC COMPONENT USING THE SAME
JP2017501879A (en) * 2013-12-04 2017-01-19 ハネウェル・インターナショナル・インコーポレーテッド Zinc-based lead-free solder composition
CN105764645A (en) * 2013-12-04 2016-07-13 霍尼韦尔国际公司 Zinc-based lead-free solder compositions
WO2015084723A1 (en) 2013-12-04 2015-06-11 Honeywell International Inc. Zinc-based lead-free solder compositions
US20150151387A1 (en) * 2013-12-04 2015-06-04 Honeywell International Inc. Zinc-based lead-free solder compositions
EP3077151A4 (en) * 2013-12-04 2017-09-27 Honeywell International Inc. Zinc-based lead-free solder compositions
TWI645048B (en) * 2013-12-04 2018-12-21 美商哈尼威爾國際公司 Zinc-based lead-free solder compositions
CN105764645B (en) * 2013-12-04 2019-03-12 霍尼韦尔国际公司 Pb-free solder compositions based on zinc
CN106536108A (en) * 2014-04-17 2017-03-22 贺利氏材料新加坡私人有限公司 Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
JP2017513713A (en) * 2014-04-17 2017-06-01 ヘレウス マテリアルズ シンガポール ピーティーイー． リミテッド Lead-free eutectic solder alloy containing zinc as the main component and aluminum as alloying metal
EP3192610A1 (en) * 2014-04-17 2017-07-19 Heraeus Materials Singapore Pte. Ltd. Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
US10399186B2 (en) 2014-04-17 2019-09-03 Heraeus Materials Singapore Pte., Ltd. Lead-free eutectic solder alloy comprising zinc as the main component and aluminum as an alloying metal
CN106536108B (en) * 2014-04-17 2019-10-01 贺利氏材料新加坡私人有限公司 Contain unleaded eutectic solder alloy of the zinc as main component and aluminium as alloying metal
CN111250896A (en) * 2020-03-26 2020-06-09 郑州机械研究所有限公司 High-strength, corrosion-resistant and low-melting brazing filler metal for aluminum alloy honeycomb plate and preparation method

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