TW200710928A - Gas exhaust system and semiconductor manufacturing apparatus and method for manufacturing thin film using the same - Google Patents

Gas exhaust system and semiconductor manufacturing apparatus and method for manufacturing thin film using the same

Info

Publication number
TW200710928A
TW200710928A TW095116733A TW95116733A TW200710928A TW 200710928 A TW200710928 A TW 200710928A TW 095116733 A TW095116733 A TW 095116733A TW 95116733 A TW95116733 A TW 95116733A TW 200710928 A TW200710928 A TW 200710928A
Authority
TW
Taiwan
Prior art keywords
shower head
manufacturing apparatus
semiconductor manufacturing
thin film
gas
Prior art date
Application number
TW095116733A
Other languages
English (en)
Other versions
TWI359444B (en
Inventor
Keun-Oh Park
Original Assignee
Tes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tes Co Ltd filed Critical Tes Co Ltd
Publication of TW200710928A publication Critical patent/TW200710928A/zh
Application granted granted Critical
Publication of TWI359444B publication Critical patent/TWI359444B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45587—Mechanical means for changing the gas flow
    • C23C16/45591—Fixed means, e.g. wings, baffles

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
TW095116733A 2005-05-13 2006-05-11 Semiconductor manufacturing apparatus and method f TWI359444B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050040009A KR100747735B1 (ko) 2005-05-13 2005-05-13 반도체 제조 장치

Publications (2)

Publication Number Publication Date
TW200710928A true TW200710928A (en) 2007-03-16
TWI359444B TWI359444B (en) 2012-03-01

Family

ID=37705059

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116733A TWI359444B (en) 2005-05-13 2006-05-11 Semiconductor manufacturing apparatus and method f

Country Status (2)

Country Link
KR (1) KR100747735B1 (zh)
TW (1) TWI359444B (zh)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617349B2 (en) 2009-10-15 2013-12-31 Orbotech LT Solar, LLC. Showerhead assembly for plasma processing chamber
US9287152B2 (en) 2009-12-10 2016-03-15 Orbotech LT Solar, LLC. Auto-sequencing multi-directional inline processing method
US9462921B2 (en) 2011-05-24 2016-10-11 Orbotech LT Solar, LLC. Broken wafer recovery system
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
US10316409B2 (en) 2012-12-21 2019-06-11 Novellus Systems, Inc. Radical source design for remote plasma atomic layer deposition
US10604841B2 (en) 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
CN112342528A (zh) * 2019-08-06 2021-02-09 台湾积体电路制造股份有限公司 半导体制程机台及其应用的方法
US11015247B2 (en) 2017-12-08 2021-05-25 Lam Research Corporation Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
CN113913784A (zh) * 2020-11-13 2022-01-11 台湾积体电路制造股份有限公司 气体幕帘元件、传送气体的导管系统与传送气体的方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101380861B1 (ko) * 2007-11-09 2014-04-03 참엔지니어링(주) 플라즈마 에칭 챔버
KR101494601B1 (ko) * 2013-06-21 2015-02-23 주식회사 테스 가스공급유닛 및 이를 구비한 박막증착장치
KR102585595B1 (ko) * 2017-07-31 2023-10-10 어플라이드 머티어리얼스, 인코포레이티드 배플을 갖는 가스 공급 부재
US11077410B2 (en) 2017-10-09 2021-08-03 Applied Materials, Inc. Gas injector with baffle
CN114657643B (zh) * 2020-12-24 2023-10-03 中国科学院微电子研究所 晶片处理设备
KR20240073395A (ko) 2022-11-18 2024-05-27 주식회사 한화 기판 처리 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07189966A (ja) * 1993-12-28 1995-07-28 Mitsubishi Electric Corp スクロール圧縮機
KR100406176B1 (ko) * 2000-06-19 2003-11-19 주식회사 하이닉스반도체 샤워헤드 및 이를 이용한 액체 원료 공급 장치
KR20040103216A (ko) * 2003-05-31 2004-12-08 삼성전자주식회사 절연막 증착 장치
KR20050001748A (ko) * 2003-06-26 2005-01-07 엘지.필립스 엘시디 주식회사 화학기상 증착장비

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8617349B2 (en) 2009-10-15 2013-12-31 Orbotech LT Solar, LLC. Showerhead assembly for plasma processing chamber
US9287152B2 (en) 2009-12-10 2016-03-15 Orbotech LT Solar, LLC. Auto-sequencing multi-directional inline processing method
US9462921B2 (en) 2011-05-24 2016-10-11 Orbotech LT Solar, LLC. Broken wafer recovery system
US10316409B2 (en) 2012-12-21 2019-06-11 Novellus Systems, Inc. Radical source design for remote plasma atomic layer deposition
US11053587B2 (en) 2012-12-21 2021-07-06 Novellus Systems, Inc. Radical source design for remote plasma atomic layer deposition
TWI697942B (zh) * 2012-12-21 2020-07-01 美商諾發系統有限公司 用於遠距離電漿原子層沉積之自由基來源設計
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
US10494717B2 (en) 2015-05-26 2019-12-03 Lam Research Corporation Anti-transient showerhead
US10604841B2 (en) 2016-12-14 2020-03-31 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US11608559B2 (en) 2016-12-14 2023-03-21 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US11101164B2 (en) 2016-12-14 2021-08-24 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US12000047B2 (en) 2016-12-14 2024-06-04 Lam Research Corporation Integrated showerhead with thermal control for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
US11015247B2 (en) 2017-12-08 2021-05-25 Lam Research Corporation Integrated showerhead with improved hole pattern for delivering radical and precursor gas to a downstream chamber to enable remote plasma film deposition
CN112342528A (zh) * 2019-08-06 2021-02-09 台湾积体电路制造股份有限公司 半导体制程机台及其应用的方法
CN112342528B (zh) * 2019-08-06 2023-02-17 台湾积体电路制造股份有限公司 半导体制程机台及其应用的方法
CN113913784B (zh) * 2020-11-13 2024-03-08 台湾积体电路制造股份有限公司 气体幕帘元件、传送气体的导管系统与传送气体的方法
US11971057B2 (en) 2020-11-13 2024-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Gas transport system
CN113913784A (zh) * 2020-11-13 2022-01-11 台湾积体电路制造股份有限公司 气体幕帘元件、传送气体的导管系统与传送气体的方法

Also Published As

Publication number Publication date
KR20060117613A (ko) 2006-11-17
KR100747735B1 (ko) 2007-08-09
TWI359444B (en) 2012-03-01

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