TW200710573A - Material for protective film formation, and method for photoresist pattern formation using the same - Google Patents
Material for protective film formation, and method for photoresist pattern formation using the sameInfo
- Publication number
- TW200710573A TW200710573A TW095124959A TW95124959A TW200710573A TW 200710573 A TW200710573 A TW 200710573A TW 095124959 A TW095124959 A TW 095124959A TW 95124959 A TW95124959 A TW 95124959A TW 200710573 A TW200710573 A TW 200710573A
- Authority
- TW
- Taiwan
- Prior art keywords
- protective film
- film formation
- same
- photoresist pattern
- formation
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005203150A JP4611137B2 (ja) | 2005-07-12 | 2005-07-12 | 保護膜形成用材料、およびこれを用いたホトレジストパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200710573A true TW200710573A (en) | 2007-03-16 |
TWI325518B TWI325518B (zh) | 2010-06-01 |
Family
ID=37637013
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095124959A TW200710573A (en) | 2005-07-12 | 2006-07-07 | Material for protective film formation, and method for photoresist pattern formation using the same |
Country Status (4)
Country | Link |
---|---|
US (1) | US20100124720A1 (zh) |
JP (1) | JP4611137B2 (zh) |
TW (1) | TW200710573A (zh) |
WO (1) | WO2007007619A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101840152A (zh) * | 2009-03-12 | 2010-09-22 | 株式会社瑞萨科技 | 抗蚀剂图案的形成方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4662062B2 (ja) * | 2005-06-15 | 2011-03-30 | 信越化学工業株式会社 | レジスト保護膜材料及びパターン形成方法 |
US8323872B2 (en) | 2005-06-15 | 2012-12-04 | Shin-Etsu Chemical Co., Ltd. | Resist protective coating material and patterning process |
US8431332B2 (en) | 2007-09-26 | 2013-04-30 | Jsr Corporation | Composition for forming upper layer film for immersion exposure, upper layer film for immersion exposure, and method of forming photoresist pattern |
JP5311331B2 (ja) * | 2008-06-25 | 2013-10-09 | ルネサスエレクトロニクス株式会社 | 液浸リソグラフィの現像処理方法および該現像処理方法を用いた電子デバイス |
CN116263564A (zh) * | 2021-12-13 | 2023-06-16 | 长鑫存储技术有限公司 | 光刻胶图案的形成方法和光刻胶结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002196495A (ja) * | 2000-12-22 | 2002-07-12 | Sumitomo Chem Co Ltd | 化学増幅型ポジ型レジスト組成物 |
JP4083399B2 (ja) * | 2001-07-24 | 2008-04-30 | セントラル硝子株式会社 | 含フッ素重合性単量体およびそれを用いた高分子化合物 |
US6806026B2 (en) * | 2002-05-31 | 2004-10-19 | International Business Machines Corporation | Photoresist composition |
JP4265766B2 (ja) * | 2003-08-25 | 2009-05-20 | 東京応化工業株式会社 | 液浸露光プロセス用レジスト保護膜形成用材料、該保護膜形成材料からなるレジスト保護膜、および該レジスト保護膜を用いたレジストパターン形成方法 |
JP4609878B2 (ja) * | 2003-10-28 | 2011-01-12 | 東京応化工業株式会社 | レジスト上層膜形成材料、およびこれを用いたレジストパターン形成方法 |
JP2005220274A (ja) * | 2004-02-09 | 2005-08-18 | Shin Etsu Chem Co Ltd | 高分子化合物、レジスト材料及びパターン形成方法 |
JP4507891B2 (ja) * | 2004-02-20 | 2010-07-21 | ダイキン工業株式会社 | 液浸リソグラフィーに用いるレジスト積層体 |
US20050202351A1 (en) * | 2004-03-09 | 2005-09-15 | Houlihan Francis M. | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof |
JP4355944B2 (ja) * | 2004-04-16 | 2009-11-04 | 信越化学工業株式会社 | パターン形成方法及びこれに用いるレジスト上層膜材料 |
JP4621451B2 (ja) * | 2004-08-11 | 2011-01-26 | 富士フイルム株式会社 | 液浸露光用保護膜形成組成物及びそれを用いたパターン形成方法 |
-
2005
- 2005-07-12 JP JP2005203150A patent/JP4611137B2/ja active Active
-
2006
- 2006-07-05 US US11/995,291 patent/US20100124720A1/en not_active Abandoned
- 2006-07-05 WO PCT/JP2006/313425 patent/WO2007007619A1/ja active Application Filing
- 2006-07-07 TW TW095124959A patent/TW200710573A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101840152A (zh) * | 2009-03-12 | 2010-09-22 | 株式会社瑞萨科技 | 抗蚀剂图案的形成方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2007024959A (ja) | 2007-02-01 |
WO2007007619A1 (ja) | 2007-01-18 |
TWI325518B (zh) | 2010-06-01 |
US20100124720A1 (en) | 2010-05-20 |
JP4611137B2 (ja) | 2011-01-12 |
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