TW200706707A - Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution - Google Patents
Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solutionInfo
- Publication number
- TW200706707A TW200706707A TW095108414A TW95108414A TW200706707A TW 200706707 A TW200706707 A TW 200706707A TW 095108414 A TW095108414 A TW 095108414A TW 95108414 A TW95108414 A TW 95108414A TW 200706707 A TW200706707 A TW 200706707A
- Authority
- TW
- Taiwan
- Prior art keywords
- tin plating
- plating solution
- tin
- solution
- preparing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
- C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005132092 | 2005-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200706707A true TW200706707A (en) | 2007-02-16 |
TWI325022B TWI325022B (ko) | 2010-05-21 |
Family
ID=37307726
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095108414A TW200706707A (en) | 2005-04-28 | 2006-03-13 | Tin plating solution, plating method using the tin plating solution, method for preparing tin plating solution and chip parts having tin plating layer formed by using the tin plating solution |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3878959B2 (ko) |
KR (1) | KR100934401B1 (ko) |
TW (1) | TW200706707A (ko) |
WO (1) | WO2006117920A1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104593835A (zh) * | 2015-02-04 | 2015-05-06 | 广东羚光新材料股份有限公司 | 用于片式元器件端电极电镀的中性镀锡液 |
CN105525312A (zh) * | 2015-12-11 | 2016-04-27 | 广州市精利表面处理技术有限公司 | 一种镀锡溶液及其制备方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4632186B2 (ja) * | 2007-08-01 | 2011-02-16 | 太陽化学工業株式会社 | 電子部品用錫電解めっき液、電子部品の錫電解めっき方法及び錫電解めっき電子部品 |
CN101748425B (zh) * | 2008-12-05 | 2014-07-09 | 宜兴方晶科技有限公司 | 甲基磺酸亚锡制备方法 |
JP6127289B2 (ja) * | 2012-03-02 | 2017-05-17 | 国立大学法人信州大学 | リチウムイオン電池用負極材料およびその製造方法 |
CN103014786B (zh) * | 2013-01-22 | 2016-01-20 | 广州博泉环保材料科技有限公司 | 电镀液、其制备方法及应用此电镀液的镀锡工艺 |
CN104109885B (zh) * | 2013-04-22 | 2017-02-01 | 广东致卓精密金属科技有限公司 | 一种弱碱性焦磷酸盐电镀光亮锡溶液及工艺 |
JP2017504715A (ja) * | 2013-12-05 | 2017-02-09 | ハネウェル・インターナショナル・インコーポレーテッド | 調節されたpHを有するメタンスルホン酸第一スズ溶液 |
KR102282332B1 (ko) | 2014-07-07 | 2021-07-27 | 허니웰 인터내셔날 인코포레이티드 | 이온 스캐빈저를 갖는 열 계면 재료 |
WO2016086410A1 (en) | 2014-12-05 | 2016-06-09 | Honeywell International Inc. | High performance thermal interface materials with low thermal impedance |
US10312177B2 (en) | 2015-11-17 | 2019-06-04 | Honeywell International Inc. | Thermal interface materials including a coloring agent |
US10781349B2 (en) | 2016-03-08 | 2020-09-22 | Honeywell International Inc. | Thermal interface material including crosslinker and multiple fillers |
US10501671B2 (en) | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
US10428256B2 (en) | 2017-10-23 | 2019-10-01 | Honeywell International Inc. | Releasable thermal gel |
US11072706B2 (en) | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
JP2022059731A (ja) | 2020-10-02 | 2022-04-14 | メルテックス株式会社 | バレルめっき用スズめっき液 |
CN113430592A (zh) * | 2021-06-30 | 2021-09-24 | 广东德浩化工新材料有限公司 | 一种中性镀锡稳定剂及其制备方法 |
KR102664806B1 (ko) * | 2021-11-18 | 2024-05-10 | 주식회사 에이엔씨코리아 | 적층세라믹 콘덴서용 주석도금액 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3858241B2 (ja) * | 2002-04-09 | 2006-12-13 | 石原薬品株式会社 | 中性スズメッキ浴を用いたバレルメッキ方法 |
JP4224698B2 (ja) * | 2003-10-24 | 2009-02-18 | 株式会社村田製作所 | めっき浴の作製方法、めっき浴、めっき方法、及び電子部品の製造方法 |
-
2006
- 2006-02-22 WO PCT/JP2006/303124 patent/WO2006117920A1/ja active Application Filing
- 2006-02-22 JP JP2006044722A patent/JP3878959B2/ja active Active
- 2006-02-22 KR KR1020077024412A patent/KR100934401B1/ko active IP Right Grant
- 2006-03-13 TW TW095108414A patent/TW200706707A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104593835A (zh) * | 2015-02-04 | 2015-05-06 | 广东羚光新材料股份有限公司 | 用于片式元器件端电极电镀的中性镀锡液 |
CN105525312A (zh) * | 2015-12-11 | 2016-04-27 | 广州市精利表面处理技术有限公司 | 一种镀锡溶液及其制备方法 |
CN105525312B (zh) * | 2015-12-11 | 2017-12-29 | 广州市精利表面处理技术有限公司 | 一种镀锡溶液及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006328528A (ja) | 2006-12-07 |
KR20070116654A (ko) | 2007-12-10 |
TWI325022B (ko) | 2010-05-21 |
KR100934401B1 (ko) | 2009-12-29 |
WO2006117920A1 (ja) | 2006-11-09 |
JP3878959B2 (ja) | 2007-02-07 |
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