TW200705113A - Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method - Google Patents

Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method

Info

Publication number
TW200705113A
TW200705113A TW095115030A TW95115030A TW200705113A TW 200705113 A TW200705113 A TW 200705113A TW 095115030 A TW095115030 A TW 095115030A TW 95115030 A TW95115030 A TW 95115030A TW 200705113 A TW200705113 A TW 200705113A
Authority
TW
Taiwan
Prior art keywords
exposure
manufacturing device
film evaluation
exposure apparatus
substrate
Prior art date
Application number
TW095115030A
Other languages
English (en)
Inventor
Hiroyuki Nagasaka
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200705113A publication Critical patent/TW200705113A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
TW095115030A 2005-04-27 2006-04-27 Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method TW200705113A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005129517 2005-04-27
JP2005211319 2005-07-21

Publications (1)

Publication Number Publication Date
TW200705113A true TW200705113A (en) 2007-02-01

Family

ID=37307908

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095115030A TW200705113A (en) 2005-04-27 2006-04-27 Exposure method, exposure apparatus, method for manufacturing device, and film evaluation method

Country Status (7)

Country Link
US (1) US20080246937A1 (zh)
EP (1) EP1879219A4 (zh)
JP (2) JP4918858B2 (zh)
KR (1) KR20080005362A (zh)
CN (2) CN102520592A (zh)
TW (1) TW200705113A (zh)
WO (1) WO2006118108A1 (zh)

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TWI422990B (zh) * 2009-06-16 2014-01-11 Asml Netherlands Bv 微影裝置、控制裝置的方法及利用微影裝置製造元件的方法

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TWI609409B (zh) 2003-10-28 2017-12-21 尼康股份有限公司 照明光學裝置、曝光裝置、曝光方法以及元件製造方法
TWI385414B (zh) 2003-11-20 2013-02-11 尼康股份有限公司 光學照明裝置、照明方法、曝光裝置、曝光方法以及元件製造方法
TWI505329B (zh) 2004-02-06 2015-10-21 尼康股份有限公司 光學照明裝置、曝光裝置、曝光方法以及元件製造方法
EP2660853B1 (en) 2005-05-12 2017-07-05 Nikon Corporation Projection optical system, exposure apparatus and exposure method
JP2008124194A (ja) * 2006-11-10 2008-05-29 Canon Inc 液浸露光方法および液浸露光装置
JP5055971B2 (ja) * 2006-11-16 2012-10-24 株式会社ニコン 表面処理方法及び表面処理装置、露光方法及び露光装置、並びにデバイス製造方法
US7679719B2 (en) * 2007-04-05 2010-03-16 Asml Netherlands B.V. Lithographic apparatus having a drive system with coordinate transformation, and device manufacturing method
JP2008300771A (ja) * 2007-06-04 2008-12-11 Nikon Corp 液浸露光装置、デバイス製造方法、及び露光条件の決定方法
JP4992558B2 (ja) * 2007-06-04 2012-08-08 株式会社ニコン 液浸露光装置、デバイス製造方法、及び評価方法
US8451427B2 (en) 2007-09-14 2013-05-28 Nikon Corporation Illumination optical system, exposure apparatus, optical element and manufacturing method thereof, and device manufacturing method
JP5267029B2 (ja) 2007-10-12 2013-08-21 株式会社ニコン 照明光学装置、露光装置及びデバイスの製造方法
US8379187B2 (en) 2007-10-24 2013-02-19 Nikon Corporation Optical unit, illumination optical apparatus, exposure apparatus, and device manufacturing method
US9116346B2 (en) 2007-11-06 2015-08-25 Nikon Corporation Illumination apparatus, illumination method, exposure apparatus, and device manufacturing method
EP2221669A3 (en) 2009-02-19 2011-02-09 ASML Netherlands B.V. A lithographic apparatus, a method of controlling the apparatus and a device manufacturing method
JP6127979B2 (ja) * 2011-12-08 2017-05-17 株式会社ニコン 情報算出方法、露光装置、露光方法、デバイス製造方法、プログラム、及び記録媒体
US9268231B2 (en) * 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
NL2020556A (en) 2017-04-20 2018-10-24 Asml Netherlands Bv A Method of Performance Testing Working Parameters of a Fluid Handling Structure and A Method of Detecting Loss of Immersion Liquid from a Fluid Handing Structure in an Immersion Lithographic Apparatus
CN111693406A (zh) * 2020-05-11 2020-09-22 江苏大学 一种材料表面润湿性接触角及滚动角的测量装置

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JPH08316124A (ja) * 1995-05-19 1996-11-29 Hitachi Ltd 投影露光方法及び露光装置
US5825043A (en) * 1996-10-07 1998-10-20 Nikon Precision Inc. Focusing and tilting adjustment system for lithography aligner, manufacturing apparatus or inspection apparatus
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KR101276392B1 (ko) * 2004-02-03 2013-06-19 가부시키가이샤 니콘 노광 장치 및 디바이스 제조 방법
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JP2005252246A (ja) * 2004-02-04 2005-09-15 Nikon Corp 露光装置及び方法、位置制御方法、並びにデバイス製造方法
JP4622340B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン 露光装置、デバイス製造方法
EP3462241A1 (en) * 2004-06-21 2019-04-03 Nikon Corporation Exposure apparatus, exposure method and method for producing a device
US7119035B2 (en) * 2004-11-22 2006-10-10 Taiwan Semiconductor Manufacturing Company, Ltd. Method using specific contact angle for immersion lithography
ATE517370T1 (de) * 2005-02-22 2011-08-15 Promerus Llc Norbornenpolymere und deren herstellungsverfahren
JP2006270057A (ja) * 2005-02-28 2006-10-05 Canon Inc 露光装置
US8111374B2 (en) * 2005-09-09 2012-02-07 Nikon Corporation Analysis method, exposure method, and device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422990B (zh) * 2009-06-16 2014-01-11 Asml Netherlands Bv 微影裝置、控制裝置的方法及利用微影裝置製造元件的方法

Also Published As

Publication number Publication date
WO2006118108A1 (ja) 2006-11-09
CN102520592A (zh) 2012-06-27
US20080246937A1 (en) 2008-10-09
JPWO2006118108A1 (ja) 2008-12-18
KR20080005362A (ko) 2008-01-11
JP4918858B2 (ja) 2012-04-18
CN101156226B (zh) 2012-03-14
JP2012049572A (ja) 2012-03-08
EP1879219A4 (en) 2012-08-08
EP1879219A1 (en) 2008-01-16
CN101156226A (zh) 2008-04-02

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