TW200704938A - Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards - Google Patents

Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards

Info

Publication number
TW200704938A
TW200704938A TW095110314A TW95110314A TW200704938A TW 200704938 A TW200704938 A TW 200704938A TW 095110314 A TW095110314 A TW 095110314A TW 95110314 A TW95110314 A TW 95110314A TW 200704938 A TW200704938 A TW 200704938A
Authority
TW
Taiwan
Prior art keywords
interposer
socket
testability
connectors
engineering
Prior art date
Application number
TW095110314A
Other languages
English (en)
Inventor
Chris R Jacobsen
Kenneth P Parker
Myron J Schneider
Tak-Yee Kwan
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of TW200704938A publication Critical patent/TW200704938A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/312—Contactless testing by capacitive methods

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
TW095110314A 2005-07-23 2006-03-24 Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards TW200704938A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/188,080 US7307427B2 (en) 2005-07-23 2005-07-23 Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards

Publications (1)

Publication Number Publication Date
TW200704938A true TW200704938A (en) 2007-02-01

Family

ID=37656653

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095110314A TW200704938A (en) 2005-07-23 2006-03-24 Method and apparatus for engineering a testability interposer for testing sockets and connectors on printed circuit boards

Country Status (4)

Country Link
US (1) US7307427B2 (zh)
CN (1) CN1900728A (zh)
SG (1) SG129347A1 (zh)
TW (1) TW200704938A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801509B (zh) * 2018-04-24 2023-05-11 美商泰瑞達公司 測試系統中之熱控制

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US7511526B2 (en) * 2006-08-23 2009-03-31 Munt Kenneth A Circuit module testing apparatus and method
WO2010056343A2 (en) * 2008-11-14 2010-05-20 Teradyne, Inc. Fast open circuit detection for open power and ground pins
US8760185B2 (en) * 2009-12-22 2014-06-24 Anthony J. Suto Low capacitance probe for testing circuit assembly
US8310256B2 (en) * 2009-12-22 2012-11-13 Teradyne, Inc. Capacitive opens testing in low signal environments
TWI383159B (zh) * 2009-12-31 2013-01-21 Test Research Inc 電性連接瑕疵偵測裝置
US8922230B2 (en) * 2011-05-11 2014-12-30 Taiwan Semiconductor Manufacturing Company, Ltd. 3D IC testing apparatus
US20140082426A1 (en) * 2012-09-20 2014-03-20 Delta Electronics, Inc. Detection circuit for flexible printed circuit connection integrity
US10006942B2 (en) * 2013-05-13 2018-06-26 Intel IP Corporation Board, integrated circuit testing arrangement, and method for operating an integrated circuit
US9158881B2 (en) 2013-08-21 2015-10-13 Taiwan Semiconductor Manufacturing Company, Ltd. Interposer defect coverage metric and method to maximize the same
US9372205B2 (en) * 2014-01-15 2016-06-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal probe card PCB design
CN111183517B (zh) * 2018-01-17 2023-06-16 默升科技集团有限公司 具有中介层的并行prbs测试的ic裸片
CN108983071B (zh) * 2018-07-31 2020-12-22 重庆匠颖科技有限公司 一种自带插头插座的pcb测试方法
US10955465B2 (en) * 2018-09-14 2021-03-23 Teradyne, Inc. Method and apparatus for bond wire testing in an integrated circuit
WO2020150218A1 (en) * 2019-01-14 2020-07-23 Amphenol Corporation Midboard cable termination assembly
US11573264B2 (en) 2019-04-10 2023-02-07 Mediatek Inc. Device for testing chip or die with better system IR drop
CN112763942A (zh) * 2020-12-11 2021-05-07 上海大学 一种航空插头异常针脚检测装置
EP4370938A1 (en) * 2021-07-15 2024-05-22 Smiths Interconnect Americas, Inc. Systems and methods for coaxial test socket and printed circuit board interfaces

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US2007A (en) * 1841-03-16 Improvement in the mode of harvesting grain
US5498694A (en) * 1989-05-25 1996-03-12 La Jolla Cancer Research Foundation Peptides of the cytoplasmic domain of integrin
US5557209A (en) * 1990-12-20 1996-09-17 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5124660A (en) * 1990-12-20 1992-06-23 Hewlett-Packard Company Identification of pin-open faults by capacitive coupling through the integrated circuit package
US5420500A (en) * 1992-11-25 1995-05-30 Hewlett-Packard Company Pacitive electrode system for detecting open solder joints in printed circuit assemblies
US6703851B1 (en) * 2002-08-05 2004-03-09 Exatron, Inc. Test socket interposer
US6891258B1 (en) * 2002-12-06 2005-05-10 Xilinx, Inc. Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
US6960917B2 (en) * 2003-11-06 2005-11-01 Agilent Technologies, Inc. Methods and apparatus for diagnosing defect locations in electrical paths of connectors of circuit assemblies
US7068039B2 (en) * 2004-04-28 2006-06-27 Agilent Technologies, Inc. Test structure embedded in a shipping and handling cover for integrated circuit sockets and method for testing integrated circuit sockets and circuit assemblies utilizing same
US7123022B2 (en) * 2004-04-28 2006-10-17 Agilent Technologies, Inc. Method and apparatus for non-contact testing and diagnosing electrical paths through connectors on circuit assemblies
US7224169B2 (en) * 2004-11-02 2007-05-29 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of inaccessible shorted connections
US7362106B2 (en) 2005-06-29 2008-04-22 Agilent Technologies, Inc. Methods and apparatus for non-contact testing and diagnosing of open connections on non-probed nodes

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI801509B (zh) * 2018-04-24 2023-05-11 美商泰瑞達公司 測試系統中之熱控制

Also Published As

Publication number Publication date
US20070018672A1 (en) 2007-01-25
SG129347A1 (en) 2007-02-26
US7307427B2 (en) 2007-12-11
CN1900728A (zh) 2007-01-24

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