TW200704931A - Probe card and testing device of micro structure - Google Patents

Probe card and testing device of micro structure

Info

Publication number
TW200704931A
TW200704931A TW095111699A TW95111699A TW200704931A TW 200704931 A TW200704931 A TW 200704931A TW 095111699 A TW095111699 A TW 095111699A TW 95111699 A TW95111699 A TW 95111699A TW 200704931 A TW200704931 A TW 200704931A
Authority
TW
Taiwan
Prior art keywords
microstructure
speaker
circuit substrate
moving section
testing device
Prior art date
Application number
TW095111699A
Other languages
English (en)
Other versions
TWI290625B (en
Inventor
Masami Yakabe
Naoki Ikeuchi
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200704931A publication Critical patent/TW200704931A/zh
Application granted granted Critical
Publication of TWI290625B publication Critical patent/TWI290625B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H1/00—Measuring characteristics of vibrations in solids by using direct conduction to the detector
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
TW095111699A 2005-03-31 2006-03-31 Probe card and testing device of micro structure TWI290625B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005102760 2005-03-31
JP2005266720 2005-09-14
JP2006093448A JP4573794B2 (ja) 2005-03-31 2006-03-30 プローブカードおよび微小構造体の検査装置

Publications (2)

Publication Number Publication Date
TW200704931A true TW200704931A (en) 2007-02-01
TWI290625B TWI290625B (en) 2007-12-01

Family

ID=36648363

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095111699A TWI290625B (en) 2005-03-31 2006-03-31 Probe card and testing device of micro structure

Country Status (7)

Country Link
US (1) US7348788B2 (zh)
EP (1) EP1707532A3 (zh)
JP (1) JP4573794B2 (zh)
KR (1) KR100845485B1 (zh)
CN (1) CN1866030B (zh)
SG (1) SG126130A1 (zh)
TW (1) TWI290625B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4387987B2 (ja) * 2004-06-11 2009-12-24 株式会社オクテック 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
CN101133320A (zh) * 2005-03-03 2008-02-27 东京毅力科创株式会社 微小结构体的检查装置、检查方法、以及检查程序
US20080223136A1 (en) * 2005-08-04 2008-09-18 Tokyo Electron Limited Minute structure inspection device, inspection method, and inspection program
US20090039908A1 (en) * 2006-04-26 2009-02-12 Tokyo Electron Limited Microstructure inspecting apparatus and microstructure inspecting method
JP5121202B2 (ja) * 2006-09-29 2013-01-16 東京エレクトロン株式会社 プローブカードおよび微小構造体の検査装置
KR20100095560A (ko) 2007-11-26 2010-08-31 도쿄엘렉트론가부시키가이샤 미소 구조체 검사 장치 및 미소 구조체 검사 방법
DE102007059279B3 (de) * 2007-12-08 2010-01-21 X-Fab Semiconductor Foundries Ag Vorrichtung zum Testen der mechanisch-elektrischen Eigenschaften von mikroelektromechanischen Sensoren (MEMS)
TWI401976B (zh) * 2008-12-31 2013-07-11 Beijing Funate Innovation Tech 揚聲器
CN104637922B (zh) * 2013-11-14 2018-04-27 中芯国际集成电路制造(上海)有限公司 用于栅介质完整性的测试结构及其测试方法
GB2524517A (en) 2014-03-25 2015-09-30 Ibm A semiconductor automatic test equipment, a backing apparatus for use therein, and methods for operating these equipments
CN103969104B (zh) * 2014-05-21 2017-02-22 上海华力微电子有限公司 一种聚焦离子束机台之探针的降震装置及其降震方法
US9921268B2 (en) 2015-11-18 2018-03-20 International Business Machines Corporation Auto-alignment of backer plate for direct docking test boards
TWI602443B (zh) * 2016-06-01 2017-10-11 京元電子股份有限公司 麥克風元件測試座及其測試裝置

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JP4456325B2 (ja) * 2002-12-12 2010-04-28 東京エレクトロン株式会社 検査方法及び検査装置
JP2005028504A (ja) * 2003-07-11 2005-02-03 Sony Corp Ｍｅｍｓ素子及びその製造方法
JP4387987B2 (ja) * 2004-06-11 2009-12-24 株式会社オクテック 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム
JP2006078435A (ja) * 2004-09-13 2006-03-23 Okutekku:Kk 微小構造体の検査装置および微小構造体の検査方法

Also Published As

Publication number Publication date
US7348788B2 (en) 2008-03-25
US20070069746A1 (en) 2007-03-29
JP4573794B2 (ja) 2010-11-04
CN1866030B (zh) 2011-12-07
JP2007108157A (ja) 2007-04-26
SG126130A1 (en) 2006-10-30
TWI290625B (en) 2007-12-01
KR100845485B1 (ko) 2008-07-10
CN1866030A (zh) 2006-11-22
EP1707532A2 (en) 2006-10-04
EP1707532A3 (en) 2007-11-21
KR20060105686A (ko) 2006-10-11

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees