TW200704797A - Organic evaporation device and method for organic evaporation - Google Patents
Organic evaporation device and method for organic evaporationInfo
- Publication number
- TW200704797A TW200704797A TW095121283A TW95121283A TW200704797A TW 200704797 A TW200704797 A TW 200704797A TW 095121283 A TW095121283 A TW 095121283A TW 95121283 A TW95121283 A TW 95121283A TW 200704797 A TW200704797 A TW 200704797A
- Authority
- TW
- Taiwan
- Prior art keywords
- evaporation
- organic
- evaporation source
- main
- organic evaporation
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005175633 | 2005-06-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200704797A true TW200704797A (en) | 2007-02-01 |
Family
ID=37532266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121283A TW200704797A (en) | 2005-06-15 | 2006-06-14 | Organic evaporation device and method for organic evaporation |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW200704797A (zh) |
WO (1) | WO2006134908A1 (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111676454B (zh) * | 2020-08-04 | 2023-09-05 | 光驰科技(上海)有限公司 | 一种节省真空镀膜室内空间的蒸发源配置结构及其设计方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0762241B2 (ja) * | 1985-12-28 | 1995-07-05 | 石川島播磨重工業株式会社 | イオンプレ−テイング装置 |
JPH09143697A (ja) * | 1995-11-20 | 1997-06-03 | Ishikawajima Harima Heavy Ind Co Ltd | 真空蒸着装置の成膜方法および真空蒸着装置 |
JPH10335062A (ja) * | 1997-05-30 | 1998-12-18 | Tdk Corp | 有機el素子の製造装置および製造方法 |
JP2000199062A (ja) * | 1999-01-06 | 2000-07-18 | Nikon Corp | 光学素子の製造方法および光学薄膜成膜装置 |
JP2003321770A (ja) * | 2002-04-26 | 2003-11-14 | Seiko Epson Corp | 薄膜の蒸着方法、有機エレクトロルミネッセンス装置、有機エレクトロルミネッセンス装置の製造方法及び電子機器 |
-
2006
- 2006-06-13 WO PCT/JP2006/311822 patent/WO2006134908A1/ja active Application Filing
- 2006-06-14 TW TW095121283A patent/TW200704797A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2006134908A1 (ja) | 2006-12-21 |
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