TW200643984A - Conductive paste - Google Patents

Conductive paste

Info

Publication number
TW200643984A
TW200643984A TW095102730A TW95102730A TW200643984A TW 200643984 A TW200643984 A TW 200643984A TW 095102730 A TW095102730 A TW 095102730A TW 95102730 A TW95102730 A TW 95102730A TW 200643984 A TW200643984 A TW 200643984A
Authority
TW
Taiwan
Prior art keywords
conductive paste
binder
conductive
lowest
differential scanning
Prior art date
Application number
TW095102730A
Other languages
English (en)
Other versions
TWI342570B (en
Inventor
Yohei Hirakawa
Katsutomo Wakabayashi
Yuta Yotsuyanagi
Norihito Tanaka
Original Assignee
Fujikura Kasei Kk
Asahi Kasei Emd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Kasei Kk, Asahi Kasei Emd Corp filed Critical Fujikura Kasei Kk
Publication of TW200643984A publication Critical patent/TW200643984A/zh
Application granted granted Critical
Publication of TWI342570B publication Critical patent/TWI342570B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
TW095102730A 2005-01-25 2006-01-23 Conductive paste TWI342570B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005016965 2005-01-25

Publications (2)

Publication Number Publication Date
TW200643984A true TW200643984A (en) 2006-12-16
TWI342570B TWI342570B (en) 2011-05-21

Family

ID=36740280

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102730A TWI342570B (en) 2005-01-25 2006-01-23 Conductive paste

Country Status (7)

Country Link
US (1) US20090020733A1 (zh)
EP (1) EP1850352A4 (zh)
JP (1) JPWO2006080247A1 (zh)
KR (1) KR101086358B1 (zh)
CN (1) CN101107678B (zh)
TW (1) TWI342570B (zh)
WO (1) WO2006080247A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671382B (zh) * 2014-03-07 2019-09-11 日商積水化學工業股份有限公司 導電糊、連接構造體及連接構造體之製造方法

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454115B (zh) 2006-06-30 2012-04-25 旭化成电子材料株式会社 导电性填料和焊料糊剂
JP4969363B2 (ja) * 2006-08-07 2012-07-04 東レ株式会社 プリプレグおよび炭素繊維強化複合材料
JP5052857B2 (ja) * 2006-10-13 2012-10-17 株式会社フジクラ 導電性組成物およびこれを用いた導電体、導電回路の形成方法
WO2009069273A1 (ja) 2007-11-28 2009-06-04 Panasonic Corporation 導電性ペーストおよびこれを用いた電気電子機器
JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
JP5633285B2 (ja) * 2010-01-25 2014-12-03 日立化成株式会社 電極用ペースト組成物及び太陽電池
US9390829B2 (en) 2010-01-25 2016-07-12 Hitachi Chemical Company, Ltd. Paste composition for electrode and photovoltaic cell
CN106170835B (zh) * 2012-10-31 2018-12-04 东进世美肯株式会社 印刷电子用铜糊剂组合物
CN103923578A (zh) 2013-01-10 2014-07-16 杜邦公司 包括含氟弹性体的导电粘合剂
JP6286448B2 (ja) * 2013-01-23 2018-02-28 ヘンケル アイピー アンド ホールディング ゲゼルシャフト ミット ベシュレンクテル ハフツング フレキシブル導電性インク
KR101511068B1 (ko) * 2013-09-23 2015-04-10 대덕지디에스 주식회사 도전성 페이스트를 이용한 방열기판 모듈
WO2015115565A1 (ja) * 2014-01-31 2015-08-06 日立化成株式会社 電極形成用組成物、電極、太陽電池素子及びその製造方法並びに太陽電池
CN106663494B (zh) * 2014-07-22 2018-11-30 阿尔法装配解决方案公司 用于柔性电子件表面的可拉伸互连部
JP6639823B2 (ja) * 2015-01-13 2020-02-05 三菱マテリアル電子化成株式会社 銀被覆樹脂粒子及びその製造方法並びにそれを用いた導電性ペースト
US20180178293A1 (en) * 2015-06-27 2018-06-28 Yamamoto Metal Technos Co., Ltd. Rotary machine tool equipped with sensor for real-time detection of state
JP2017147163A (ja) * 2016-02-19 2017-08-24 三菱マテリアル株式会社 導電性ペースト及びこれを用いて形成された導電性膜
JP7411553B2 (ja) 2019-03-19 2024-01-11 積水化学工業株式会社 樹脂粒子、導電性粒子、導電材料及び接続構造体

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
EP0933010B1 (en) * 1996-08-16 2002-01-23 Hugh P. Craig Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards
JPH10279902A (ja) * 1997-04-01 1998-10-20 Asahi Chem Ind Co Ltd 導電性接着剤
US6207259B1 (en) * 1998-11-02 2001-03-27 Kyocera Corporation Wiring board
JP3634984B2 (ja) * 1999-07-30 2005-03-30 京セラ株式会社 配線基板
JP4684439B2 (ja) * 2001-03-06 2011-05-18 富士通株式会社 伝導性粒子、伝導性組成物および、電子機器の製造方法
JP2003305588A (ja) * 2002-04-11 2003-10-28 Fujitsu Ltd 接合材料
CN1326155C (zh) * 2002-05-31 2007-07-11 大自达电线股份有限公司 导电糊、使用其的多层基板及其制造方法
JP4235888B2 (ja) * 2002-06-07 2009-03-11 日立化成工業株式会社 導電ペースト
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP4412578B2 (ja) * 2003-05-09 2010-02-10 富士通株式会社 熱伝導性材料およびそれを用いた熱伝導性接合体とその製造方法
JP4248938B2 (ja) * 2003-06-06 2009-04-02 旭化成エレクトロニクス株式会社 導電性材料、導電性成形体、導電性成形体の製造方法
JP4468750B2 (ja) * 2004-06-29 2010-05-26 タツタ システム・エレクトロニクス株式会社 導電性ペースト及びこれを用いた多層基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI671382B (zh) * 2014-03-07 2019-09-11 日商積水化學工業股份有限公司 導電糊、連接構造體及連接構造體之製造方法

Also Published As

Publication number Publication date
CN101107678A (zh) 2008-01-16
WO2006080247A1 (ja) 2006-08-03
KR20070094625A (ko) 2007-09-20
CN101107678B (zh) 2012-03-07
KR101086358B1 (ko) 2011-11-23
EP1850352A1 (en) 2007-10-31
US20090020733A1 (en) 2009-01-22
EP1850352A4 (en) 2012-11-28
TWI342570B (en) 2011-05-21
JPWO2006080247A1 (ja) 2008-06-19

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