TW200637009A - Thin film transistor array panel - Google Patents

Thin film transistor array panel

Info

Publication number
TW200637009A
TW200637009A TW094142308A TW94142308A TW200637009A TW 200637009 A TW200637009 A TW 200637009A TW 094142308 A TW094142308 A TW 094142308A TW 94142308 A TW94142308 A TW 94142308A TW 200637009 A TW200637009 A TW 200637009A
Authority
TW
Taiwan
Prior art keywords
thin film
film transistor
transistor array
array panel
regions
Prior art date
Application number
TW094142308A
Other languages
English (en)
Inventor
Dong-Byum Kim
Chung Yi
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of TW200637009A publication Critical patent/TW200637009A/zh

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/22Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/127Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
    • H01L27/1274Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
    • H01L27/1285Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor using control of the annealing or irradiation parameters, e.g. using different scanning direction or intensity for different transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • H01L27/1296Multistep manufacturing methods adapted to increase the uniformity of device parameters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78645Thin film transistors, i.e. transistors with a channel being at least partly a thin film with multiple gate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Recrystallisation Techniques (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
TW094142308A 2004-12-20 2005-12-01 Thin film transistor array panel TW200637009A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040109052A KR20060070345A (ko) 2004-12-20 2004-12-20 박막 트랜지스터 표시판

Publications (1)

Publication Number Publication Date
TW200637009A true TW200637009A (en) 2006-10-16

Family

ID=36594544

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142308A TW200637009A (en) 2004-12-20 2005-12-01 Thin film transistor array panel

Country Status (5)

Country Link
US (1) US8106409B2 (zh)
JP (1) JP2006178449A (zh)
KR (1) KR20060070345A (zh)
CN (1) CN100474085C (zh)
TW (1) TW200637009A (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060157711A1 (en) * 2005-01-19 2006-07-20 Samsung Electronics Co., Ltd. Thin film transistor array panel
KR20070031620A (ko) 2005-09-15 2007-03-20 삼성전자주식회사 액정 표시 장치
KR101358827B1 (ko) * 2006-07-24 2014-02-06 삼성디스플레이 주식회사 액정 표시 장치
KR101094285B1 (ko) * 2009-12-04 2011-12-19 삼성모바일디스플레이주식회사 박막트랜지스터 및 이를 포함하는 표시장치
KR101100959B1 (ko) * 2010-03-10 2011-12-29 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를 구비하는 표시 장치
KR101666661B1 (ko) * 2010-08-26 2016-10-17 삼성디스플레이 주식회사 박막 트랜지스터 기판 및 평판 표시 장치
US9224759B2 (en) 2010-12-20 2015-12-29 Japan Display Inc. Pixel array substrate structure, method of manufacturing pixel array substrate structure, display device, and electronic apparatus
KR101984309B1 (ko) * 2010-12-20 2019-05-30 가부시키가이샤 재팬 디스프레이 화소 구조, 표시 장치, 및 전자 기기
US8830436B2 (en) * 2010-12-24 2014-09-09 Japan Display West Inc. Pixel structure, display device, and electronic apparatus
JP5725337B2 (ja) * 2011-03-24 2015-05-27 ソニー株式会社 表示装置、表示装置の製造方法および電子機器
KR102048941B1 (ko) 2013-04-12 2020-01-09 삼성디스플레이 주식회사 가요성 기판 및 그 제조 방법, 유기 발광 표시 장치

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JPH08201846A (ja) * 1995-01-25 1996-08-09 Matsushita Electric Ind Co Ltd レーザーアニール法及び液晶表示装置
JP3317482B2 (ja) 1996-11-26 2002-08-26 シャープ株式会社 半導体装置及びその製造方法
US5981974A (en) 1996-09-30 1999-11-09 Sharp Kabushiki Kaisha Semiconductor device and method for fabricating the same
KR100296109B1 (ko) * 1998-06-09 2001-10-26 구본준, 론 위라하디락사 박막트랜지스터제조방법
KR100319206B1 (ko) * 1998-10-20 2002-01-10 윤종용 박막트랜지스터 제조방법과 이에 의해 제조된 기판 및 박막트랜지스터
JP4398015B2 (ja) 1999-08-09 2010-01-13 シャープ株式会社 液晶表示装置及びその製造方法
JP4127466B2 (ja) 2000-07-31 2008-07-30 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6613620B2 (en) 2000-07-31 2003-09-02 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
WO2003018882A1 (en) 2001-08-27 2003-03-06 The Trustees Of Columbia University In The City Of New York Improved polycrystalline tft uniformity through microstructure mis-alignment
KR100796794B1 (ko) 2001-10-17 2008-01-22 삼성전자주식회사 다결정 규소 박막 트랜지스터 기판 및 그 제조 방법
JP4003471B2 (ja) * 2002-02-12 2007-11-07 セイコーエプソン株式会社 電気光学装置、電子機器、および電気光学装置の製造方法
JP4583004B2 (ja) 2003-05-21 2010-11-17 株式会社 日立ディスプレイズ アクティブ・マトリクス基板の製造方法
US7358165B2 (en) * 2003-07-31 2008-04-15 Semiconductor Energy Laboratory Co., Ltd Semiconductor device and method for manufacturing semiconductor device
US20050062052A1 (en) * 2003-09-23 2005-03-24 Fu-Hsiang Yang Panel of organic electroluminescent display
KR100997971B1 (ko) * 2003-11-19 2010-12-02 삼성전자주식회사 결정화용 마스크, 이를 이용한 결정화 방법 및 이를포함하는 박막 트랜지스터 표시판의 제조 방법
KR100984359B1 (ko) * 2003-11-20 2010-09-30 삼성전자주식회사 박막 트랜지스터 표시판
KR100737535B1 (ko) * 2003-12-29 2007-07-10 비오이 하이디스 테크놀로지 주식회사 다결정실리콘막 형성방법
KR101230299B1 (ko) * 2005-01-07 2013-02-07 삼성디스플레이 주식회사 박막 트랜지스터 표시판
US20060157711A1 (en) * 2005-01-19 2006-07-20 Samsung Electronics Co., Ltd. Thin film transistor array panel

Also Published As

Publication number Publication date
US20060131585A1 (en) 2006-06-22
KR20060070345A (ko) 2006-06-23
CN100474085C (zh) 2009-04-01
JP2006178449A (ja) 2006-07-06
US8106409B2 (en) 2012-01-31
CN1794069A (zh) 2006-06-28

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