TW200636597A - Integrated circuit (IC) card and its manufacturing method - Google Patents

Integrated circuit (IC) card and its manufacturing method

Info

Publication number
TW200636597A
TW200636597A TW095105766A TW95105766A TW200636597A TW 200636597 A TW200636597 A TW 200636597A TW 095105766 A TW095105766 A TW 095105766A TW 95105766 A TW95105766 A TW 95105766A TW 200636597 A TW200636597 A TW 200636597A
Authority
TW
Taiwan
Prior art keywords
body portion
sim card
card
frame body
sealing
Prior art date
Application number
TW095105766A
Other languages
English (en)
Inventor
Hirotaka Nishizawa
Junichiro Osako
Tamaki Wada
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200636597A publication Critical patent/TW200636597A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
TW095105766A 2005-03-14 2006-02-21 Integrated circuit (IC) card and its manufacturing method TW200636597A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005071434 2005-03-14

Publications (1)

Publication Number Publication Date
TW200636597A true TW200636597A (en) 2006-10-16

Family

ID=36991498

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095105766A TW200636597A (en) 2005-03-14 2006-02-21 Integrated circuit (IC) card and its manufacturing method

Country Status (3)

Country Link
JP (1) JPWO2006098145A1 (zh)
TW (1) TW200636597A (zh)
WO (1) WO2006098145A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105654165A (zh) * 2014-12-04 2016-06-08 茂邦电子有限公司 芯片卡及其承载用载板与成型方法
CN105701532A (zh) * 2014-11-25 2016-06-22 茂邦电子有限公司 晶片卡的晶片封装件及其成型用片状封装板与成型方法
TWI569383B (zh) * 2014-11-25 2017-02-01 Chip chip chip package and its molding chip package board and molding method
TWI606398B (zh) * 2014-12-01 2017-11-21 Chip card and its carrying carrier plate and forming method

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102012001776A1 (de) * 2012-01-31 2013-08-01 Giesecke & Devrient Gmbh Chipkarte mit heraustrennbarer Miniaturchipkarte
CN104425327B (zh) * 2013-08-24 2017-08-25 英属维京群岛爱邦卡司有限公司 晶片卡组合结构及其方法
CN106127285B (zh) * 2016-06-17 2021-08-03 北京小米移动软件有限公司 集成电路卡

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3772278B2 (ja) * 1995-05-30 2006-05-10 マクセル精器株式会社 Ｉｃユニットホルダー
JP2003099745A (ja) * 2001-09-25 2003-04-04 Shinko Electric Ind Co Ltd Ｉｃカード及びその製造方法
JP4112258B2 (ja) * 2002-04-01 2008-07-02 大日本印刷株式会社 Ｉｃカード
JP2004013469A (ja) * 2002-06-06 2004-01-15 Dainippon Printing Co Ltd 小型ｉｃカード装着部を有する機器
JP2005092761A (ja) * 2003-09-19 2005-04-07 Dainippon Printing Co Ltd 板状枠体付きｕｉｍの製造方法と板状枠体付きｕｉｍ
JP4489402B2 (ja) * 2003-10-10 2010-06-23 大日本印刷株式会社 板状枠体付きｕｉｍ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105701532A (zh) * 2014-11-25 2016-06-22 茂邦电子有限公司 晶片卡的晶片封装件及其成型用片状封装板与成型方法
TWI569383B (zh) * 2014-11-25 2017-02-01 Chip chip chip package and its molding chip package board and molding method
CN105701532B (zh) * 2014-11-25 2018-09-11 茂邦电子有限公司 晶片卡的晶片封装件及其成型用片状封装板与成型方法
TWI606398B (zh) * 2014-12-01 2017-11-21 Chip card and its carrying carrier plate and forming method
CN105654165A (zh) * 2014-12-04 2016-06-08 茂邦电子有限公司 芯片卡及其承载用载板与成型方法

Also Published As

Publication number Publication date
JPWO2006098145A1 (ja) 2008-08-21
WO2006098145A1 (ja) 2006-09-21

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