TW200634490A - Heat-dissipating device with high efficiency of heat dissipation - Google Patents
Heat-dissipating device with high efficiency of heat dissipationInfo
- Publication number
- TW200634490A TW200634490A TW094107997A TW94107997A TW200634490A TW 200634490 A TW200634490 A TW 200634490A TW 094107997 A TW094107997 A TW 094107997A TW 94107997 A TW94107997 A TW 94107997A TW 200634490 A TW200634490 A TW 200634490A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- dissipating
- high efficiency
- diamond
- dissipating device
- Prior art date
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to a heat-dissipating device with high efficiency of heat dissipation, comprising a heat-dissipating plate, a heat conduction layer and a heat-dissipating piece; the heat conduction layer, which is disposed at the bottom of a cooper heat-dissipating plate, is made of diamond-like carbon or diamond so that it has a heat conduction rate higher than the cooper heat-dissipating plate; the heat-dissipating piece is disposed on the top of the heat-dissipating piece; when the diamond-like carbon or diamond heat conduction layer with heat conduction rate up to 400 to 1800 w/mK is in contact with a processor chip, it can dissipate the high heat of the chip homogeneously onto the heat-dissipating plate effectively, and the heat can be then dissipated by the heat-dissipating piece, providing the chip with high efficiency of heat dissipation.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094107997A TW200634490A (en) | 2005-03-16 | 2005-03-16 | Heat-dissipating device with high efficiency of heat dissipation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW094107997A TW200634490A (en) | 2005-03-16 | 2005-03-16 | Heat-dissipating device with high efficiency of heat dissipation |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200634490A true TW200634490A (en) | 2006-10-01 |
Family
ID=57809356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094107997A TW200634490A (en) | 2005-03-16 | 2005-03-16 | Heat-dissipating device with high efficiency of heat dissipation |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW200634490A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI408329B (en) * | 2010-02-12 | 2013-09-11 | Univ Nat Sun Yat Sen | Heat transfer micro-channel and heat sink and manufacturing method thereof |
-
2005
- 2005-03-16 TW TW094107997A patent/TW200634490A/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI408329B (en) * | 2010-02-12 | 2013-09-11 | Univ Nat Sun Yat Sen | Heat transfer micro-channel and heat sink and manufacturing method thereof |
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