TW200634490A - Heat-dissipating device with high efficiency of heat dissipation - Google Patents

Heat-dissipating device with high efficiency of heat dissipation

Info

Publication number
TW200634490A
TW200634490A TW094107997A TW94107997A TW200634490A TW 200634490 A TW200634490 A TW 200634490A TW 094107997 A TW094107997 A TW 094107997A TW 94107997 A TW94107997 A TW 94107997A TW 200634490 A TW200634490 A TW 200634490A
Authority
TW
Taiwan
Prior art keywords
heat
dissipating
high efficiency
diamond
dissipating device
Prior art date
Application number
TW094107997A
Other languages
Chinese (zh)
Inventor
Ming-Ji Gan
Shau-Jung Hu
Jian-Min Sung
Original Assignee
Kinik Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinik Co filed Critical Kinik Co
Priority to TW094107997A priority Critical patent/TW200634490A/en
Publication of TW200634490A publication Critical patent/TW200634490A/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The present invention relates to a heat-dissipating device with high efficiency of heat dissipation, comprising a heat-dissipating plate, a heat conduction layer and a heat-dissipating piece; the heat conduction layer, which is disposed at the bottom of a cooper heat-dissipating plate, is made of diamond-like carbon or diamond so that it has a heat conduction rate higher than the cooper heat-dissipating plate; the heat-dissipating piece is disposed on the top of the heat-dissipating piece; when the diamond-like carbon or diamond heat conduction layer with heat conduction rate up to 400 to 1800 w/mK is in contact with a processor chip, it can dissipate the high heat of the chip homogeneously onto the heat-dissipating plate effectively, and the heat can be then dissipated by the heat-dissipating piece, providing the chip with high efficiency of heat dissipation.
TW094107997A 2005-03-16 2005-03-16 Heat-dissipating device with high efficiency of heat dissipation TW200634490A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094107997A TW200634490A (en) 2005-03-16 2005-03-16 Heat-dissipating device with high efficiency of heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094107997A TW200634490A (en) 2005-03-16 2005-03-16 Heat-dissipating device with high efficiency of heat dissipation

Publications (1)

Publication Number Publication Date
TW200634490A true TW200634490A (en) 2006-10-01

Family

ID=57809356

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107997A TW200634490A (en) 2005-03-16 2005-03-16 Heat-dissipating device with high efficiency of heat dissipation

Country Status (1)

Country Link
TW (1) TW200634490A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408329B (en) * 2010-02-12 2013-09-11 Univ Nat Sun Yat Sen Heat transfer micro-channel and heat sink and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI408329B (en) * 2010-02-12 2013-09-11 Univ Nat Sun Yat Sen Heat transfer micro-channel and heat sink and manufacturing method thereof

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