TW200633625A - Adhesion material structure and process method thereof - Google Patents

Adhesion material structure and process method thereof

Info

Publication number
TW200633625A
TW200633625A TW094106498A TW94106498A TW200633625A TW 200633625 A TW200633625 A TW 200633625A TW 094106498 A TW094106498 A TW 094106498A TW 94106498 A TW94106498 A TW 94106498A TW 200633625 A TW200633625 A TW 200633625A
Authority
TW
Taiwan
Prior art keywords
adhesion material
heat dissipation
process method
metal
bracket structure
Prior art date
Application number
TW094106498A
Other languages
Chinese (zh)
Inventor
Ming-Hang Hwang
Yu-Chiang Cheng
Chao-Yi Chen
Hsin-Lung Kuo
Bin-Wei Lee
Wei Chung Hsiao
Original Assignee
Mitac Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitac Technology Corp filed Critical Mitac Technology Corp
Priority to TW094106498A priority Critical patent/TW200633625A/en
Priority to DE102006007528A priority patent/DE102006007528B4/en
Priority to JP2006051278A priority patent/JP2006245576A/en
Publication of TW200633625A publication Critical patent/TW200633625A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
    • B23K35/327—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C comprising refractory compounds, e.g. carbides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J1/00—Adhesives based on inorganic constituents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention discloses a process method and structure for adhesion material. This adhesion material is employed for heat dissipation device includes several heat dissipation fins, a heat dissipation slip and a heat pipe. The heat pipe connects several heat dissipation fins and a heat dissipation slip by adhesion material. The metal is combining with a bracket structure of carbon, which have high thermal conductivity so as to improve the heat conduction efficiency, to form adhesion material. The corresponding process method for this adhesion material can be made with a mode of process to form melting stuff, including the metal and a bracket structure of carbon element, and then use a mode of draw to form adhesion material. The bracket structure of carbon element can be mixed into the metal.
TW094106498A 2005-03-02 2005-03-03 Adhesion material structure and process method thereof TW200633625A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW094106498A TW200633625A (en) 2005-03-03 2005-03-03 Adhesion material structure and process method thereof
DE102006007528A DE102006007528B4 (en) 2005-03-02 2006-02-16 Process for the preparation of a bonding agent
JP2006051278A JP2006245576A (en) 2005-03-03 2006-02-27 Bonding material and its production process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094106498A TW200633625A (en) 2005-03-03 2005-03-03 Adhesion material structure and process method thereof

Publications (1)

Publication Number Publication Date
TW200633625A true TW200633625A (en) 2006-09-16

Family

ID=36914899

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106498A TW200633625A (en) 2005-03-02 2005-03-03 Adhesion material structure and process method thereof

Country Status (3)

Country Link
JP (1) JP2006245576A (en)
DE (1) DE102006007528B4 (en)
TW (1) TW200633625A (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60186374A (en) * 1984-03-05 1985-09-21 Ogura Houseki Seiki Kogyo Kk Composite containing diamond and metal solder
JPS63199050A (en) * 1987-02-13 1988-08-17 Natl Res Inst For Metals Drawing-up continuous casting method without using mold and its apparatus
WO1993012190A1 (en) * 1991-12-19 1993-06-24 Cookson Group Plc Conductive adhesive compositions based on thermally depolymerisable polymers
JPH06297160A (en) * 1993-04-14 1994-10-25 Honda Motor Co Ltd Electrode for resistance welding
US5957365A (en) * 1997-03-03 1999-09-28 Anthon; Royce A. Brazing rod for depositing diamond coating to metal substrate using gas or electric brazing techniques
AU6297200A (en) * 1999-07-14 2001-01-30 Fibre Optic Lamp Company Limited Method of, and material for, improving thermal conductivity
JP4707840B2 (en) * 2001-01-12 2011-06-22 ティーエス ヒートロニクス 株式会社 Radiator and manufacturing method thereof
US7111771B2 (en) * 2003-03-31 2006-09-26 Intel Corporation Solders with surfactant-refined grain sizes, solder bumps made thereof, and methods of making same

Also Published As

Publication number Publication date
DE102006007528A1 (en) 2006-09-14
DE102006007528B4 (en) 2007-08-02
JP2006245576A (en) 2006-09-14

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