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Application filed by Ming-Hong JiangfiledCriticalMing-Hong Jiang
Priority to TW095107573ApriorityCriticalpatent/TW200734598A/en
Publication of TW200734598ApublicationCriticalpatent/TW200734598A/en
The invention regards a powder-metallurgy heat-dissipating copper plate and manufacturing method thereof. A one-piece high-density copper heat dissipating plate is provided by powder-metallurgy and cold forging methods. Due to no need to weld or to adhere with other kind of material, the heat dissipating plate owns good conductivity and heat dissipation properties. Since the simple manufacturing process, it reduces the manufacturing cost.
TW095107573A2006-03-072006-03-07Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof
TW200734598A
(en)
Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for produc