TW200734598A - Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof - Google Patents

Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof

Info

Publication number
TW200734598A
TW200734598A TW095107573A TW95107573A TW200734598A TW 200734598 A TW200734598 A TW 200734598A TW 095107573 A TW095107573 A TW 095107573A TW 95107573 A TW95107573 A TW 95107573A TW 200734598 A TW200734598 A TW 200734598A
Authority
TW
Taiwan
Prior art keywords
powder
manufacturing
heat
metallurgy
copper plate
Prior art date
Application number
TW095107573A
Other languages
Chinese (zh)
Inventor
Ming-Hong Jiang
Original Assignee
Ming-Hong Jiang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ming-Hong Jiang filed Critical Ming-Hong Jiang
Priority to TW095107573A priority Critical patent/TW200734598A/en
Publication of TW200734598A publication Critical patent/TW200734598A/en

Links

Abstract

The invention regards a powder-metallurgy heat-dissipating copper plate and manufacturing method thereof. A one-piece high-density copper heat dissipating plate is provided by powder-metallurgy and cold forging methods. Due to no need to weld or to adhere with other kind of material, the heat dissipating plate owns good conductivity and heat dissipation properties. Since the simple manufacturing process, it reduces the manufacturing cost.
TW095107573A 2006-03-07 2006-03-07 Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof TW200734598A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095107573A TW200734598A (en) 2006-03-07 2006-03-07 Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095107573A TW200734598A (en) 2006-03-07 2006-03-07 Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof

Publications (1)

Publication Number Publication Date
TW200734598A true TW200734598A (en) 2007-09-16

Family

ID=57913365

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095107573A TW200734598A (en) 2006-03-07 2006-03-07 Powder-metallurgy heat-dissipating copper plate and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TW200734598A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712115B (en) * 2008-10-07 2011-05-18 北京有色金属研究总院 Method for preparing gradient-structure copper radiating rib for electronic element
CN102554229A (en) * 2010-12-21 2012-07-11 北京有色金属研究总院 Method for preparing copper radiating fins of gradient structures by means of injection forming

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101712115B (en) * 2008-10-07 2011-05-18 北京有色金属研究总院 Method for preparing gradient-structure copper radiating rib for electronic element
CN102554229A (en) * 2010-12-21 2012-07-11 北京有色金属研究总院 Method for preparing copper radiating fins of gradient structures by means of injection forming
CN102554229B (en) * 2010-12-21 2014-01-29 北京有色金属研究总院 Method for preparing copper radiating fins of gradient structures by means of injection forming

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