TW200632990A - Decompression dry device - Google Patents

Decompression dry device

Info

Publication number
TW200632990A
TW200632990A TW094141626A TW94141626A TW200632990A TW 200632990 A TW200632990 A TW 200632990A TW 094141626 A TW094141626 A TW 094141626A TW 94141626 A TW94141626 A TW 94141626A TW 200632990 A TW200632990 A TW 200632990A
Authority
TW
Taiwan
Prior art keywords
opening
closing valve
chamber
exhaust pump
dry device
Prior art date
Application number
TW094141626A
Other languages
English (en)
Other versions
TWI272650B (en
Inventor
Takashi Kakimura
Yoshitaka Kitamura
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW200632990A publication Critical patent/TW200632990A/zh
Application granted granted Critical
Publication of TWI272650B publication Critical patent/TWI272650B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps

Landscapes

  • Physics & Mathematics (AREA)
  • Atmospheric Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
TW094141626A 2005-03-14 2005-11-25 Reduced-pressure dryer TWI272650B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005070283A JP2006253517A (ja) 2005-03-14 2005-03-14 減圧乾燥装置

Publications (2)

Publication Number Publication Date
TW200632990A true TW200632990A (en) 2006-09-16
TWI272650B TWI272650B (en) 2007-02-01

Family

ID=37002594

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094141626A TWI272650B (en) 2005-03-14 2005-11-25 Reduced-pressure dryer

Country Status (4)

Country Link
JP (1) JP2006253517A (zh)
KR (1) KR100730449B1 (zh)
CN (1) CN100543589C (zh)
TW (1) TWI272650B (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI283005B (en) 2005-12-28 2007-06-21 Au Optronics Corp Low-pressure process apparatus
JP5089288B2 (ja) * 2007-01-26 2012-12-05 大日本スクリーン製造株式会社 減圧乾燥装置
JP2008192642A (ja) 2007-01-31 2008-08-21 Tokyo Electron Ltd 基板処理装置
JP5371605B2 (ja) * 2008-09-25 2013-12-18 東京エレクトロン株式会社 減圧乾燥装置及び減圧乾燥方法
JP5298041B2 (ja) * 2010-02-03 2013-09-25 株式会社カワタ 乾燥装置および不活性ガス置換方法
JP6093172B2 (ja) * 2012-12-26 2017-03-08 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置および減圧乾燥方法
JP6141479B1 (ja) * 2016-03-18 2017-06-07 エスペック株式会社 乾燥装置
JP6872328B2 (ja) * 2016-09-06 2021-05-19 株式会社Ｓｃｒｅｅｎホールディングス 減圧乾燥装置、減圧乾燥システム、減圧乾燥方法
CN106526915B (zh) * 2016-11-28 2019-04-30 武汉华星光电技术有限公司 基板清洁干燥装置及其维护方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236530U (zh) * 1985-08-21 1987-03-04
JPS63260028A (ja) * 1986-11-19 1988-10-27 Tokyo Ohka Kogyo Co Ltd ホトレジストの熱安定化装置
JPS63291624A (ja) * 1987-05-23 1988-11-29 Showa Denko Kk ガリウム・ヒ素ウェハ−のドライエッチング排ガスの処理方法
US5025571A (en) * 1990-04-25 1991-06-25 Savant Instruments, Inc. Vacuum pump with heated vapor pre-trap
JP3029767B2 (ja) * 1994-04-07 2000-04-04 大日本スクリーン製造株式会社 薄膜形成装置
JPH11294957A (ja) * 1998-04-07 1999-10-29 Takaoka Electric Mfg Co Ltd 電気機器の乾燥装置
JP2000199480A (ja) * 1998-12-25 2000-07-18 Kissei Pharmaceut Co Ltd 真空装置の安全機構
JP4328436B2 (ja) * 1999-12-20 2009-09-09 三菱電機株式会社 脱脂洗浄方法及び洗浄装置
JP3739287B2 (ja) * 2001-02-14 2006-01-25 東京エレクトロン株式会社 減圧乾燥方法及び塗布膜形成装置
JP4153686B2 (ja) * 2001-09-26 2008-09-24 大日本スクリーン製造株式会社 成膜液乾燥装置
KR100464853B1 (ko) 2002-06-20 2005-01-06 삼성전자주식회사 순간감압가열 건조방법 및 장치
JP4335786B2 (ja) * 2004-11-29 2009-09-30 大日本スクリーン製造株式会社 減圧乾燥装置

Also Published As

Publication number Publication date
TWI272650B (en) 2007-02-01
JP2006253517A (ja) 2006-09-21
CN100543589C (zh) 2009-09-23
KR100730449B1 (ko) 2007-06-19
CN1834791A (zh) 2006-09-20
KR20060100916A (ko) 2006-09-21

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