TW200631979A - Curing accelerator, curable resin composition, and electronic part/device - Google Patents

Curing accelerator, curable resin composition, and electronic part/device

Info

Publication number
TW200631979A
TW200631979A TW095102882A TW95102882A TW200631979A TW 200631979 A TW200631979 A TW 200631979A TW 095102882 A TW095102882 A TW 095102882A TW 95102882 A TW95102882 A TW 95102882A TW 200631979 A TW200631979 A TW 200631979A
Authority
TW
Taiwan
Prior art keywords
curable resin
resin composition
curing accelerator
bonded
electronic part
Prior art date
Application number
TW095102882A
Other languages
English (en)
Chinese (zh)
Other versions
TWI310774B (https=
Inventor
Shinya Nakamura
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200631979A publication Critical patent/TW200631979A/zh
Application granted granted Critical
Publication of TWI310774B publication Critical patent/TWI310774B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F9/00—Compounds containing elements of Groups 5 or 15 of the Periodic Table
    • C07F9/02—Phosphorus compounds
    • C07F9/28—Phosphorus compounds with one or more P—C bonds
    • C07F9/54—Quaternary phosphonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/688—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing phosphorus
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095102882A 2005-01-26 2006-01-25 Curing accelerator, curable resin composition, and electronic part/device TW200631979A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005018598 2005-01-26

Publications (2)

Publication Number Publication Date
TW200631979A true TW200631979A (en) 2006-09-16
TWI310774B TWI310774B (https=) 2009-06-11

Family

ID=36740301

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095102882A TW200631979A (en) 2005-01-26 2006-01-25 Curing accelerator, curable resin composition, and electronic part/device

Country Status (5)

Country Link
US (1) US7585904B2 (https=)
KR (1) KR100893022B1 (https=)
CN (1) CN101133097B (https=)
TW (1) TW200631979A (https=)
WO (1) WO2006080270A1 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5157444B2 (ja) * 2005-04-15 2013-03-06 日立化成株式会社 硬化促進性化合物−シリカ複合体、硬化促進性化合物−シリカ複合体の製造方法、硬化促進剤、硬化性樹脂組成物及び電子部品装置
EP2558543B1 (en) 2010-04-16 2017-08-30 Valspar Sourcing, Inc. Coating compositions for packaging articles and methods of coating
EP3878912B1 (en) 2011-02-07 2023-04-05 Swimc Llc Coating compositions for containers and other articles and methods of coating
AU2013299578A1 (en) 2012-08-09 2015-02-19 Valspar Sourcing, Inc. Compositions for containers and other articles and methods of using same
EP2882658B1 (en) 2012-08-09 2021-09-08 Swimc Llc Container coating system
TWI485516B (zh) * 2013-08-28 2015-05-21 Chi Mei Corp 黑色矩陣用感光性樹脂組成物及其應用
CN110790914A (zh) 2014-04-14 2020-02-14 宣伟投资管理有限公司 制备用于容器和其它制品的组合物的方法以及使用所述组合物的方法
TWI614275B (zh) 2015-11-03 2018-02-11 Valspar Sourcing Inc 用於製備聚合物的液體環氧樹脂組合物
US20250034988A1 (en) * 2023-07-27 2025-01-30 Halliburton Energy Services, Inc. Downhole electronics encapsulation against gas invasion

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3478315B2 (ja) 1995-12-06 2003-12-15 日立化成工業株式会社 半導体封止用エポキシ樹脂組成物及び該樹脂組成物で封止した半導体装置
MY123645A (en) * 1999-07-22 2006-05-31 Sumitomo Bakelite Co Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product
JP2001139661A (ja) 1999-11-10 2001-05-22 Sumitomo Bakelite Co Ltd 半導体封止用樹脂組成物および半導体装置
CN1223622C (zh) * 2001-09-28 2005-10-19 三井化学株式会社 用于环氧树脂的固化剂组合物、环氧树脂组合物及其用途
JP4569076B2 (ja) * 2002-06-05 2010-10-27 住友ベークライト株式会社 硬化促進剤、エポキシ樹脂組成物および半導体装置
JP2004156035A (ja) 2002-10-18 2004-06-03 Hitachi Chem Co Ltd 硬化性樹脂の硬化促進剤、硬化性樹脂組成物及び電子部品装置
JP4244777B2 (ja) 2002-10-18 2009-03-25 日立化成工業株式会社 硬化性樹脂の硬化促進剤、硬化性樹脂組成物、電子部品装置、及びホスフィン誘導体の製造方法

Also Published As

Publication number Publication date
WO2006080270A1 (ja) 2006-08-03
US20090012232A1 (en) 2009-01-08
TWI310774B (https=) 2009-06-11
US7585904B2 (en) 2009-09-08
CN101133097A (zh) 2008-02-27
KR100893022B1 (ko) 2009-04-15
KR20070104629A (ko) 2007-10-26
CN101133097B (zh) 2011-11-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees