TW200630167A - Spin-coating apparatus and coated substrates prepared using the same - Google Patents

Spin-coating apparatus and coated substrates prepared using the same

Info

Publication number
TW200630167A
TW200630167A TW094143631A TW94143631A TW200630167A TW 200630167 A TW200630167 A TW 200630167A TW 094143631 A TW094143631 A TW 094143631A TW 94143631 A TW94143631 A TW 94143631A TW 200630167 A TW200630167 A TW 200630167A
Authority
TW
Taiwan
Prior art keywords
coating
substrate
spin
coated
same
Prior art date
Application number
TW094143631A
Other languages
English (en)
Other versions
TWI285565B (en
Inventor
Tae-Sik Kang
Seong-Keun Lee
Young-Jun Hong
Original Assignee
Lg Chemical Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd filed Critical Lg Chemical Ltd
Publication of TW200630167A publication Critical patent/TW200630167A/zh
Application granted granted Critical
Publication of TWI285565B publication Critical patent/TWI285565B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
    • B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12528—Semiconductor component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
TW094143631A 2004-12-10 2005-12-09 Spin-coating apparatus and coated substrates prepared using the same TWI285565B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20040104504 2004-12-10

Publications (2)

Publication Number Publication Date
TW200630167A true TW200630167A (en) 2006-09-01
TWI285565B TWI285565B (en) 2007-08-21

Family

ID=36578111

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094143631A TWI285565B (en) 2004-12-10 2005-12-09 Spin-coating apparatus and coated substrates prepared using the same

Country Status (7)

Country Link
US (1) US7632352B2 (zh)
EP (1) EP1819448A1 (zh)
JP (1) JP2008525996A (zh)
KR (1) KR100696855B1 (zh)
CN (1) CN100515583C (zh)
TW (1) TWI285565B (zh)
WO (1) WO2006062321A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581066B (zh) * 2015-02-27 2017-05-01 精材科技股份有限公司 光阻噴塗機及其環狀結構

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4549969B2 (ja) * 2005-12-28 2010-09-22 オリジン電気株式会社 光ディスク製造方法及び装置
TWI359456B (en) * 2006-12-15 2012-03-01 Lam Res Ag Device and method for wet treating plate-like arti
EP2630653B1 (de) * 2010-10-19 2015-04-01 EV Group GmbH Vorrichtung zum beschichten eines wafers
CN102744538B (zh) * 2012-06-11 2015-01-21 台州欧信环保净化器有限公司 一种金属蜂窝载体波峰去膏装置
CN103521400B (zh) * 2013-10-24 2015-12-02 福建农林大学 一种激光熔敷试样预置涂层用夹具
JP6811442B2 (ja) * 2016-03-17 2021-01-13 パナソニックＩｐマネジメント株式会社 光ディスク記録媒体
EP3424074B1 (en) * 2016-07-01 2021-10-27 Carbon, Inc. Method and system for spin-coating multi-layer thin films having liquid conservation features
US11626315B2 (en) * 2016-11-29 2023-04-11 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor structure and planarization method thereof

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JPS6391166A (ja) 1986-10-03 1988-04-21 Matsushita Electric Ind Co Ltd スピンナ−塗布装置
JPH05103396A (ja) * 1991-10-04 1993-04-23 Olympus Optical Co Ltd 音響整合層の製造方法および製造装置
JPH0699125A (ja) * 1992-09-24 1994-04-12 Mitsubishi Plastics Ind Ltd スピンコーターおよび光ディスクの製造方法
JP3337867B2 (ja) * 1995-05-22 2002-10-28 富士通株式会社 半導体装置の製造方法
JPH09206655A (ja) * 1996-02-07 1997-08-12 Miyagi Oki Denki Kk 試料加工装置
KR100605311B1 (ko) 1999-08-09 2006-07-28 삼성전자주식회사 두꺼운 감광막 형성 방법
TW480584B (en) * 1999-08-17 2002-03-21 Tokyo Electron Ltd Solution processing apparatus and method
JP3622592B2 (ja) * 1999-10-13 2005-02-23 株式会社日立製作所 液晶表示装置
US6527860B1 (en) * 1999-10-19 2003-03-04 Tokyo Electron Limited Substrate processing apparatus
KR100617224B1 (ko) * 1999-11-30 2006-08-31 엘지전자 주식회사 드럼세탁기
KR100648332B1 (ko) 1999-12-09 2006-11-23 엘지전자 주식회사 광 디스크 제조 방법
JP3689301B2 (ja) * 2000-03-15 2005-08-31 Ｈｏｙａ株式会社 フォトマスクブランクの製造方法及び不要膜除去装置
JP4021125B2 (ja) * 2000-06-02 2007-12-12 東京エレクトロン株式会社 ウェハ移載装置の装置ユニット接続時に用いられるレールの真直性保持装置
JP2002059060A (ja) * 2000-08-22 2002-02-26 Canon Inc 塗布方法、塗布装置および被膜の作製方法
JP3721320B2 (ja) * 2000-11-01 2005-11-30 東京エレクトロン株式会社 基板処理装置及び基板処理方法
KR100754161B1 (ko) 2001-07-05 2007-09-03 삼성전자주식회사 광디스크 제조 방법
KR20030059915A (ko) * 2002-01-03 2003-07-12 삼성전자주식회사 광디스크 및 광디스크 제조 방법
US20050039675A1 (en) 2003-08-22 2005-02-24 Kang Tae Sik Spin coating apparatus and coated substrate manufactured using the same
KR100890761B1 (ko) 2003-08-22 2009-03-31 주식회사 엘지화학 스핀 코팅용 장치 및 이에 의해 제조된 코팅체

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI581066B (zh) * 2015-02-27 2017-05-01 精材科技股份有限公司 光阻噴塗機及其環狀結構
US9875924B2 (en) 2015-02-27 2018-01-23 Xintec Inc. Spray coater and ring-shaped structure thereof

Also Published As

Publication number Publication date
KR100696855B1 (ko) 2007-03-20
CN101060936A (zh) 2007-10-24
US20070006804A1 (en) 2007-01-11
JP2008525996A (ja) 2008-07-17
EP1819448A1 (en) 2007-08-22
US7632352B2 (en) 2009-12-15
CN100515583C (zh) 2009-07-22
WO2006062321A1 (en) 2006-06-15
TWI285565B (en) 2007-08-21
KR20060065498A (ko) 2006-06-14

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees