TW200627633A - Solid-state image pickup device using charged-coupled devices and method for fabricating the same - Google Patents

Solid-state image pickup device using charged-coupled devices and method for fabricating the same

Info

Publication number
TW200627633A
TW200627633A TW094130933A TW94130933A TW200627633A TW 200627633 A TW200627633 A TW 200627633A TW 094130933 A TW094130933 A TW 094130933A TW 94130933 A TW94130933 A TW 94130933A TW 200627633 A TW200627633 A TW 200627633A
Authority
TW
Taiwan
Prior art keywords
solid
image pickup
pickup device
charged
state image
Prior art date
Application number
TW094130933A
Other languages
English (en)
Chinese (zh)
Inventor
Kyung-Sik Kim
Original Assignee
Ids Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ids Co Ltd filed Critical Ids Co Ltd
Publication of TW200627633A publication Critical patent/TW200627633A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H01L27/14812—Special geometry or disposition of pixel-elements, address lines or gate-electrodes
    • H01L27/14818—Optical shielding
    • A—HUMAN NECESSITIES
    • A47—FURNITURE; DOMESTIC ARTICLES OR APPLIANCES; COFFEE MILLS; SPICE MILLS; SUCTION CLEANERS IN GENERAL
    • A47L—DOMESTIC WASHING OR CLEANING; SUCTION CLEANERS IN GENERAL
    • A47L17/00—Apparatus or implements used in manual washing or cleaning of crockery, table-ware, cooking-ware or the like
    • A47L17/04—Pan or pot cleaning utensils
    • A47L17/08—Pads; Balls of steel wool, wire, or plastic meshes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14689—MOS based technologies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Color Television Image Signal Generators (AREA)
TW094130933A 2005-01-25 2005-09-08 Solid-state image pickup device using charged-coupled devices and method for fabricating the same TW200627633A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050006862A KR20060086050A (ko) 2005-01-25 2005-01-25 Ｃｃｄ 고체촬상소자 및 그 제조방법

Publications (1)

Publication Number Publication Date
TW200627633A true TW200627633A (en) 2006-08-01

Family

ID=36740596

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130933A TW200627633A (en) 2005-01-25 2005-09-08 Solid-state image pickup device using charged-coupled devices and method for fabricating the same

Country Status (3)

Country Link
KR (1) KR20060086050A (ko)
TW (1) TW200627633A (ko)
WO (1) WO2006080594A1 (ko)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3248225B2 (ja) * 1992-04-08 2002-01-21 ソニー株式会社 固体撮像素子の製造方法
JP2755176B2 (ja) * 1994-06-30 1998-05-20 日本電気株式会社 固体撮像素子
JP2002319668A (ja) * 2001-04-24 2002-10-31 Fuji Film Microdevices Co Ltd 固体撮像装置及びその製造方法
JP2003229553A (ja) * 2002-02-05 2003-08-15 Sharp Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
KR20060086050A (ko) 2006-07-31
WO2006080594A1 (en) 2006-08-03

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