TW200626659A - Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same - Google Patents

Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same

Info

Publication number
TW200626659A
TW200626659A TW094137683A TW94137683A TW200626659A TW 200626659 A TW200626659 A TW 200626659A TW 094137683 A TW094137683 A TW 094137683A TW 94137683 A TW94137683 A TW 94137683A TW 200626659 A TW200626659 A TW 200626659A
Authority
TW
Taiwan
Prior art keywords
groups
resin composition
thermosetting resin
same
formula
Prior art date
Application number
TW094137683A
Other languages
English (en)
Inventor
Kenichi Tomioka
Hiroshi Shimizu
Nobuyuki Minami
Harumi Negishi
Shinichi Kamoshida
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004321996A external-priority patent/JP2006131743A/ja
Priority claimed from JP2005115859A external-priority patent/JP2006291098A/ja
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of TW200626659A publication Critical patent/TW200626659A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5397—Phosphine oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
TW094137683A 2004-11-05 2005-10-27 Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same TW200626659A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004321996A JP2006131743A (ja) 2004-11-05 2004-11-05 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、プリント配線板
JP2005115859A JP2006291098A (ja) 2005-04-13 2005-04-13 熱硬化性樹脂組成物及びそれを用いたプリプレグ、金属張積層板、配線板

Publications (1)

Publication Number Publication Date
TW200626659A true TW200626659A (en) 2006-08-01

Family

ID=36316658

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137683A TW200626659A (en) 2004-11-05 2005-10-27 Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same

Country Status (4)

Country Link
US (1) US20060099391A1 (zh)
KR (1) KR100722900B1 (zh)
DE (1) DE102005051611B4 (zh)
TW (1) TW200626659A (zh)

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Publication number Priority date Publication date Assignee Title
DE102007015083A1 (de) * 2007-03-29 2008-10-02 Clariant International Limited Flammgeschützte Klebe- und Dichtmassen
JP5024205B2 (ja) * 2007-07-12 2012-09-12 三菱瓦斯化学株式会社 プリプレグ及び積層板
JP2009155399A (ja) 2007-12-25 2009-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物並びにこれを用いたプリプレグ及び積層板
EP2098571A1 (de) 2008-03-07 2009-09-09 Robert Bosch GmbH Modifiziertes Reaktionsharz
WO2010078690A1 (en) * 2009-01-06 2010-07-15 Dow Global Technologies Inc. Metal stabilizers for epoxy resins and dispersion process
TWI494340B (zh) * 2010-08-02 2015-08-01 Taiwan Union Technology Corp 環氧樹脂組成物及其製成的預浸材和印刷電路板
SG11201404327PA (en) * 2012-01-31 2014-10-30 Mitsubishi Gas Chemical Co Resin composition for printed wiring board material, and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using same
WO2015064064A1 (ja) 2013-10-31 2015-05-07 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
KR102368069B1 (ko) * 2014-10-22 2022-02-25 삼성전자주식회사 반도체 패키지의 제조 방법
JP7388235B2 (ja) * 2020-02-20 2023-11-29 味の素株式会社 樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2070944A1 (en) * 1991-06-11 1992-12-12 Cynthia A. Arnold Inorganic oxide modified cyanate resin bodies
DE4432188A1 (de) * 1994-09-09 1996-03-14 Siemens Ag Epoxidharzformmassen zur Umhüllung von elektronischen Bauelementen
JP3775919B2 (ja) * 1998-03-13 2006-05-17 大塚化学ホールディングス株式会社 難燃性樹脂、その組成物及びその製造法
CN1423678B (zh) * 1999-12-13 2010-11-10 陶氏环球技术公司 含磷元素阻燃剂环氧树脂组合物
JP2001214053A (ja) * 2000-01-31 2001-08-07 Hitachi Chem Co Ltd フェノール変性シアネートエステル樹脂組成物の製造方法、この方法によって得られるフェノール変性シアネートエステル樹脂組成物並びにこれを用いたプリプレグ及び金属張積層板
KR20050055042A (ko) * 2000-03-21 2005-06-10 히다치 가세고교 가부시끼가이샤 유전 특성이 우수한 수지 조성물, 수지 조성물의 제조방법, 이것을 사용하여 제조되는 바니시, 이의 제조 방법,이들을 사용한 프리프레그, 및 금속을 입힌 적층판
JP5318306B2 (ja) * 2001-02-09 2013-10-16 東洋紡株式会社 耐熱性組成物
EP1238997A1 (en) * 2001-03-07 2002-09-11 Ucb S.A. Phosphorus containing materials, their preparation and use
JP2003043682A (ja) * 2001-08-01 2003-02-13 Jsr Corp 感放射線性誘電率変化性組成物、誘電率変化法
JP4039034B2 (ja) * 2001-10-31 2008-01-30 日立化成工業株式会社 変性シアネートエステル系樹脂組成物、難燃性樹脂フィルム、難燃性多層プリント配線板およびそれらの製造方法
TWI278481B (en) * 2002-04-16 2007-04-11 Hitachi Chemical Co Ltd Thermosetting resin composition, prepreg and laminate using the same
JP2004258617A (ja) * 2003-02-07 2004-09-16 Konica Minolta Holdings Inc 感光性組成物及び感光性平版印刷版材料
WO2004094499A1 (ja) * 2003-04-18 2004-11-04 Kaneka Corporation 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板

Also Published As

Publication number Publication date
DE102005051611A1 (de) 2006-06-08
KR20060052468A (ko) 2006-05-19
DE102005051611B4 (de) 2008-10-16
US20060099391A1 (en) 2006-05-11
KR100722900B1 (ko) 2007-05-30

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