TW200626275A - Method for laser dicing of a substrate - Google Patents

Method for laser dicing of a substrate

Info

Publication number
TW200626275A
TW200626275A TW094134407A TW94134407A TW200626275A TW 200626275 A TW200626275 A TW 200626275A TW 094134407 A TW094134407 A TW 094134407A TW 94134407 A TW94134407 A TW 94134407A TW 200626275 A TW200626275 A TW 200626275A
Authority
TW
Taiwan
Prior art keywords
substrate
dicing
laser
supplied
assist gas
Prior art date
Application number
TW094134407A
Other languages
English (en)
Inventor
Antonius Johannes Hendriks
Hendrik Jan Kettelarij
Ivar Jacco Boerefijn
Original Assignee
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv filed Critical Koninkl Philips Electronics Nv
Publication of TW200626275A publication Critical patent/TW200626275A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
    • B23K26/1437—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for flow rate control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
TW094134407A 2004-10-05 2005-09-30 Method for laser dicing of a substrate TW200626275A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP04104866 2004-10-05

Publications (1)

Publication Number Publication Date
TW200626275A true TW200626275A (en) 2006-08-01

Family

ID=35502559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134407A TW200626275A (en) 2004-10-05 2005-09-30 Method for laser dicing of a substrate

Country Status (7)

Country Link
US (1) US20080096367A1 (zh)
EP (1) EP1800339A1 (zh)
JP (1) JP2008516442A (zh)
KR (1) KR20070073764A (zh)
CN (1) CN101036223A (zh)
TW (1) TW200626275A (zh)
WO (1) WO2006038152A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420155B (zh) * 2010-06-11 2013-12-21 Au Optronics Corp 光學模組及顯示裝置之製造方法
TWI464030B (zh) * 2011-02-07 2014-12-11 Lpkf Laser & Electronics Ag 將貫穿孔做入基材的方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102211255B (zh) * 2010-04-09 2015-03-11 大族激光科技产业集团股份有限公司 一种激光切割方法及设备
US9844833B2 (en) * 2014-01-30 2017-12-19 Apple Inc. System and method for laser cutting sapphire using multiple gas media
US10639746B1 (en) 2014-06-20 2020-05-05 Apple Inc. Ceramic-based components having laser-etched markings
US10144107B2 (en) 2015-09-30 2018-12-04 Apple Inc. Ultrasonic polishing systems and methods of polishing brittle components for electronic devices
US11113494B2 (en) 2019-11-11 2021-09-07 Apple Inc. Biometric key including a textured ceramic cover
CN112783264A (zh) 2019-11-11 2021-05-11 苹果公司 包括纹理化陶瓷盖的生物识别按键

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5987996A (ja) * 1982-11-10 1984-05-21 Ishikawajima Harima Heavy Ind Co Ltd レ−ザ・ガス切断装置
JPS6444296A (en) * 1987-08-12 1989-02-16 Fanuc Ltd Assist gas control system
DE4202941C2 (de) 1992-02-01 1994-08-04 Fraunhofer Ges Forschung Verfahren zum Materialabtrag an einem bewegten Werkstück
US6413839B1 (en) * 1998-10-23 2002-07-02 Emcore Corporation Semiconductor device separation using a patterned laser projection
US6204473B1 (en) * 1999-04-30 2001-03-20 W.A. Whitney Co. Laser-equipped machine tool cutting head with pressurized counterbalance
US6376797B1 (en) * 2000-07-26 2002-04-23 Ase Americas, Inc. Laser cutting of semiconductor materials
FR2817782B1 (fr) 2000-12-13 2003-02-28 Air Liquide Procede et installation de coupage laser avec tete de decoupe a double flux et double foyer
ATE323569T1 (de) * 2001-03-22 2006-05-15 Xsil Technology Ltd Ein laserbearbeitungssystem und -verfahren
US20030155328A1 (en) 2002-02-15 2003-08-21 Huth Mark C. Laser micromachining and methods and systems of same
JP2005523583A (ja) 2002-04-19 2005-08-04 エグシル テクノロジー リミテッド パルスレーザを用いる、基板のプログラム制御ダイシング
US20040075717A1 (en) * 2002-10-16 2004-04-22 O'brien Seamus Wafer processing apparatus and method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI420155B (zh) * 2010-06-11 2013-12-21 Au Optronics Corp 光學模組及顯示裝置之製造方法
TWI464030B (zh) * 2011-02-07 2014-12-11 Lpkf Laser & Electronics Ag 將貫穿孔做入基材的方法

Also Published As

Publication number Publication date
JP2008516442A (ja) 2008-05-15
CN101036223A (zh) 2007-09-12
KR20070073764A (ko) 2007-07-10
US20080096367A1 (en) 2008-04-24
EP1800339A1 (en) 2007-06-27
WO2006038152A1 (en) 2006-04-13

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