TW200625724A - Anisotropic conductive connector for wafer inspection, production method and application therefor - Google Patents

Anisotropic conductive connector for wafer inspection, production method and application therefor

Info

Publication number
TW200625724A
TW200625724A TW094129757A TW94129757A TW200625724A TW 200625724 A TW200625724 A TW 200625724A TW 094129757 A TW094129757 A TW 094129757A TW 94129757 A TW94129757 A TW 94129757A TW 200625724 A TW200625724 A TW 200625724A
Authority
TW
Taiwan
Prior art keywords
anisotropic conductive
disposed
inspected
wafer
units
Prior art date
Application number
TW094129757A
Other languages
English (en)
Chinese (zh)
Inventor
Kiyoshi Kimura
Fujio Hara
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200625724A publication Critical patent/TW200625724A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7082—Coupling device supported only by cooperation with PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW094129757A 2004-08-31 2005-08-30 Anisotropic conductive connector for wafer inspection, production method and application therefor TW200625724A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004252621 2004-08-31

Publications (1)

Publication Number Publication Date
TW200625724A true TW200625724A (en) 2006-07-16

Family

ID=35999934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094129757A TW200625724A (en) 2004-08-31 2005-08-30 Anisotropic conductive connector for wafer inspection, production method and application therefor

Country Status (4)

Country Link
KR (1) KR20070046033A (ko)
CN (1) CN1989606A (ko)
TW (1) TW200625724A (ko)
WO (1) WO2006025279A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101013553B1 (ko) * 2008-10-08 2011-02-14 주식회사 하이닉스반도체 반도체 패키지 및 이의 제조 방법
CN101769911B (zh) * 2008-12-29 2014-09-03 北京卫星环境工程研究所 石英晶片低温频温曲线测试装置
CN105845204A (zh) * 2016-04-12 2016-08-10 京东方科技集团股份有限公司 各向异性导电胶、显示装置及基板与外接电路的邦定方法
CN112753135B (zh) * 2018-10-11 2024-05-10 积水保力马科技株式会社 电连接片及带端子的玻璃板构造
US20210251086A1 (en) * 2018-11-05 2021-08-12 Nok Corporation Manufacturing method of conductive member
KR102175797B1 (ko) * 2019-03-25 2020-11-06 주식회사 아이에스시 검사용 소켓
KR20210041661A (ko) * 2019-10-07 2021-04-16 삼성디스플레이 주식회사 표시모듈 제조장치 및 표시모듈 제조방법
CN115053139A (zh) * 2020-02-10 2022-09-13 株式会社Isc 用于检测被检测设备的测试座
WO2023219357A1 (ko) * 2022-05-09 2023-11-16 주식회사 마이다스에이치앤티 액체금속 입자를 포함하는 연신성 이방 전도성 필름 및 이의 제조방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08186169A (ja) * 1994-12-28 1996-07-16 Matsushita Electric Ind Co Ltd フリップチップの実装方法
JPH11154550A (ja) * 1997-11-19 1999-06-08 Jsr Corp コネクター
JP2000082511A (ja) * 1998-09-07 2000-03-21 Jsr Corp 異方導電性シート
JP2000100495A (ja) * 1998-09-18 2000-04-07 Jsr Corp アダプタ装置、その製造方法、回路基板検査装置および回路基板の検査方法
DE60238824D1 (de) * 2001-02-09 2011-02-17 Jsr Corp "anisotroper leitfähiger verbinder, herstellungsverfahren dafür und sondenglied"
JP3753145B2 (ja) * 2003-04-21 2006-03-08 Ｊｓｒ株式会社 異方導電性シートおよびその製造方法、アダプター装置およびその製造方法並びに回路装置の電気的検査装置
JP2005166534A (ja) * 2003-12-04 2005-06-23 Polymatech Co Ltd 異方導電性コネクタの製造方法

Also Published As

Publication number Publication date
WO2006025279A1 (ja) 2006-03-09
KR20070046033A (ko) 2007-05-02
CN1989606A (zh) 2007-06-27

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