TW200625005A - Alkaline developable resin composition - Google Patents

Alkaline developable resin composition

Info

Publication number
TW200625005A
TW200625005A TW094130706A TW94130706A TW200625005A TW 200625005 A TW200625005 A TW 200625005A TW 094130706 A TW094130706 A TW 094130706A TW 94130706 A TW94130706 A TW 94130706A TW 200625005 A TW200625005 A TW 200625005A
Authority
TW
Taiwan
Prior art keywords
sub
resin composition
alkaline developable
developable resin
alkyl group
Prior art date
Application number
TW094130706A
Other languages
Chinese (zh)
Other versions
TWI375863B (en
Inventor
Mitsuo Akutsu
Masaaki Shimizu
Yoshie Makabe
Naomi Sato
Tomohito Ishiguro
Koichi Kimishima
Naoki Maeda
Original Assignee
Asahi Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Denka Co Ltd filed Critical Asahi Denka Co Ltd
Publication of TW200625005A publication Critical patent/TW200625005A/en
Application granted granted Critical
Publication of TWI375863B publication Critical patent/TWI375863B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Abstract

Disclosed is an alkaline developable resin composition containing a reaction product obtained by esterifying a polybasic acid anhydride (D) with respect to an epoxy adduct having a structure wherein an unsaturated monobasic acid (B) and a compound (C) selected from phenol compounds, alcohol compounds, amine compounds and carboxylic acids are added to an epoxy resin (A) represented by the following general formula (I). (In the formula, Cy represents a C<SUB>3-5</SUB> cycloalkyl group; X represents H, a C<SUB>1-10</SUB> alkyl group or the like; Y and Z respectively represent a C<SUB>1-10</SUB> alkyl group or the like; n represents a number of 0-10; p represents a number of 0-5; and r represents a number of 0-4.)
TW094130706A 2004-09-17 2005-09-07 Alkaline developable resin composition TW200625005A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004271688A JP4198101B2 (en) 2004-09-17 2004-09-17 Alkali developable resin composition

Publications (2)

Publication Number Publication Date
TW200625005A true TW200625005A (en) 2006-07-16
TWI375863B TWI375863B (en) 2012-11-01

Family

ID=36059885

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094130706A TW200625005A (en) 2004-09-17 2005-09-07 Alkaline developable resin composition

Country Status (5)

Country Link
JP (1) JP4198101B2 (en)
KR (1) KR101168438B1 (en)
CN (1) CN100580555C (en)
TW (1) TW200625005A (en)
WO (1) WO2006030630A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137257A1 (en) * 2005-06-20 2006-12-28 Toppan Printing Co., Ltd. Colored alkali-developable photosensitive resin composition and color filters made by using the same
JP4916224B2 (en) * 2005-06-20 2012-04-11 株式会社Ａｄｅｋａ Alkali-developable photosensitive resin composition
JP5546093B2 (en) 2006-12-26 2014-07-09 株式会社Ａｄｅｋａ Polymerizable compound and polymerizable composition
JP5311750B2 (en) * 2007-02-28 2013-10-09 株式会社Ａｄｅｋａ Phenol resin, epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP6061449B2 (en) * 2011-03-31 2017-01-18 太陽インキ製造株式会社 Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them
WO2016129195A1 (en) * 2015-02-10 2016-08-18 Jsr株式会社 Photosensitive resin composition and resin composition, patterned resin film and method for manufacturing same, and cell culture device
CN112250836B (en) * 2020-12-08 2021-03-30 北京市银帆涂料有限责任公司 High molecular compound, coating composition containing high molecular compound and preparation method of coating composition

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148429B2 (en) * 1992-02-04 2001-03-19 新日本製鐵株式会社 Photopolymerizable unsaturated compound and alkali-developable photosensitive resin composition
JP2003107702A (en) 2001-09-27 2003-04-09 Sumitomo Chem Co Ltd Resin composition
JP4087650B2 (en) * 2002-07-12 2008-05-21 太陽インキ製造株式会社 Photocurable / thermosetting resin composition and cured product thereof
JP2004061566A (en) * 2002-07-25 2004-02-26 Taiyo Ink Mfg Ltd Photosetting/thermosetting resin composition and printed-wiring board using the same
JP2004137328A (en) 2002-10-16 2004-05-13 Japan U-Pica Co Ltd Photocurable compound and photocurable thermosetting resin composition and its cured product
CN100386298C (en) * 2004-03-25 2008-05-07 株式会社艾迪科 Novel phenol compound and novel epoxy resin derivable from such phenol compound

Also Published As

Publication number Publication date
JP4198101B2 (en) 2008-12-17
CN100580555C (en) 2010-01-13
WO2006030630A1 (en) 2006-03-23
TWI375863B (en) 2012-11-01
KR101168438B1 (en) 2012-07-25
KR20070051762A (en) 2007-05-18
CN1860415A (en) 2006-11-08
JP2006084985A (en) 2006-03-30

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