TW200712768A - Alkali developable photosensitive resin composition - Google Patents
Alkali developable photosensitive resin compositionInfo
- Publication number
- TW200712768A TW200712768A TW095121898A TW95121898A TW200712768A TW 200712768 A TW200712768 A TW 200712768A TW 095121898 A TW095121898 A TW 095121898A TW 95121898 A TW95121898 A TW 95121898A TW 200712768 A TW200712768 A TW 200712768A
- Authority
- TW
- Taiwan
- Prior art keywords
- group
- carbon atoms
- epoxy
- halogen atom
- acid anhydride
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Chemical & Material Sciences (AREA)
- Materials For Photolithography (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
The present invention relates to an alkaline developable photosensitive resin composition which contains a reaction product, obtained by sequentially esterifying a polybasic acid anhydride (C) and a polyfunctional epoxy compound (D) with an epoxy adduct, having a structure formed by adding an unsaturated monobasic acid (B) to an epoxy resin (A) expressed by the following general formula (I), wherein the epoxy adduct has the structure formed by adding 0.1-1.0 piece of carboxyl group of the unsaturated monobasic acid (B) to 1 epoxy group of the epoxy resin (A), and esterification is performed in a ratio of 0.1-1.0 acid anhydride structure of the polybasic acid anhydride (C) and in a ratio of 0.1-1.0 epoxy group of the polyfunctional epoxy compound (D) to 1 hydroxyl group of the epoxy adduct. In the formula, Cy represents the naphthene base with 3-10 carbon atoms; X represents the hydrogen atom or the alkyl group with 1-10 carbon atoms, the alkoxy group with 1-10 carbon atoms or the halogen atom replacing the phenyl group or the naphthene base with 3-10 carbon atoms; Y and Z represent individually the alkyl group with 1-10 carbon atoms, the alkoxy group with 1-10 carbon atoms, the alkenyl group with 2-10 carbon atoms or the halogen atom respectively; the alkyl group, the alkoxy group and the alkenyl group can be replaced by the halogen atom; n represents numbers 0-10; p represents numbers 0-4; r represents numbers 0-4.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005178857 | 2005-06-20 | ||
JP2006155876A JP4916224B2 (en) | 2005-06-20 | 2006-06-05 | Alkali-developable photosensitive resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200712768A true TW200712768A (en) | 2007-04-01 |
TWI372943B TWI372943B (en) | 2012-09-21 |
Family
ID=37793551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095121898A TW200712768A (en) | 2005-06-20 | 2006-06-19 | Alkali developable photosensitive resin composition |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4916224B2 (en) |
KR (1) | KR101308954B1 (en) |
CN (1) | CN1885162B (en) |
TW (1) | TW200712768A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4667261B2 (en) * | 2006-02-01 | 2011-04-06 | 株式会社Adeka | Alkali-developable photosensitive resin composition |
JP4738190B2 (en) * | 2006-02-01 | 2011-08-03 | 株式会社Adeka | Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
JP4878876B2 (en) * | 2006-03-15 | 2012-02-15 | 株式会社Adeka | Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
JP5311750B2 (en) * | 2007-02-28 | 2013-10-09 | 株式会社Adeka | Phenol resin, epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
JP2009275148A (en) * | 2008-05-15 | 2009-11-26 | Adeka Corp | New compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition |
WO2012039286A1 (en) * | 2010-09-22 | 2012-03-29 | 株式会社Adeka | Pigment and colored photosensitive composition |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3148429B2 (en) * | 1992-02-04 | 2001-03-19 | 新日本製鐵株式会社 | Photopolymerizable unsaturated compound and alkali-developable photosensitive resin composition |
JP2000053746A (en) * | 1998-08-06 | 2000-02-22 | Nippon Shokubai Co Ltd | Production of photosensitive resin and photosensitive resin composition containing resin produced by the method |
US6727042B2 (en) * | 2000-01-17 | 2004-04-27 | Showa Highpolymer Co., Ltd. | Photosensitive resin composition |
WO2002025378A1 (en) * | 2000-09-16 | 2002-03-28 | Goo Chemical Co., Ltd. | Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
JP3593066B2 (en) * | 2001-06-28 | 2004-11-24 | 株式会社日本触媒 | Photosensitive resin for liquid crystal spacer and photosensitive resin composition |
JP2003177528A (en) * | 2001-09-21 | 2003-06-27 | Tamura Kaken Co Ltd | Photosensitive resin composition and printed wiring board |
JP4554170B2 (en) * | 2003-06-03 | 2010-09-29 | 株式会社タムラ製作所 | UV curable alkali-soluble resin, UV curable resin for solder resist film and printed wiring board |
CN100386298C (en) * | 2004-03-25 | 2008-05-07 | 株式会社艾迪科 | Novel phenol compound and novel epoxy resin derivable from such phenol compound |
JP4198101B2 (en) * | 2004-09-17 | 2008-12-17 | 株式会社Adeka | Alkali developable resin composition |
-
2006
- 2006-06-05 JP JP2006155876A patent/JP4916224B2/en active Active
- 2006-06-19 KR KR1020060055034A patent/KR101308954B1/en active IP Right Grant
- 2006-06-19 TW TW095121898A patent/TW200712768A/en unknown
- 2006-06-20 CN CN2006100938192A patent/CN1885162B/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP4916224B2 (en) | 2012-04-11 |
KR20060133482A (en) | 2006-12-26 |
CN1885162B (en) | 2011-06-22 |
CN1885162A (en) | 2006-12-27 |
JP2007034279A (en) | 2007-02-08 |
KR101308954B1 (en) | 2013-09-24 |
TWI372943B (en) | 2012-09-21 |
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