TW200712768A - Alkali developable photosensitive resin composition - Google Patents

Alkali developable photosensitive resin composition

Info

Publication number
TW200712768A
TW200712768A TW095121898A TW95121898A TW200712768A TW 200712768 A TW200712768 A TW 200712768A TW 095121898 A TW095121898 A TW 095121898A TW 95121898 A TW95121898 A TW 95121898A TW 200712768 A TW200712768 A TW 200712768A
Authority
TW
Taiwan
Prior art keywords
group
carbon atoms
epoxy
halogen atom
acid anhydride
Prior art date
Application number
TW095121898A
Other languages
Chinese (zh)
Other versions
TWI372943B (en
Inventor
Yoshie Makabe
Naomi Sato
Naoki Maeda
Kazuyuki Fuchigami
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200712768A publication Critical patent/TW200712768A/en
Application granted granted Critical
Publication of TWI372943B publication Critical patent/TWI372943B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment

Abstract

The present invention relates to an alkaline developable photosensitive resin composition which contains a reaction product, obtained by sequentially esterifying a polybasic acid anhydride (C) and a polyfunctional epoxy compound (D) with an epoxy adduct, having a structure formed by adding an unsaturated monobasic acid (B) to an epoxy resin (A) expressed by the following general formula (I), wherein the epoxy adduct has the structure formed by adding 0.1-1.0 piece of carboxyl group of the unsaturated monobasic acid (B) to 1 epoxy group of the epoxy resin (A), and esterification is performed in a ratio of 0.1-1.0 acid anhydride structure of the polybasic acid anhydride (C) and in a ratio of 0.1-1.0 epoxy group of the polyfunctional epoxy compound (D) to 1 hydroxyl group of the epoxy adduct. In the formula, Cy represents the naphthene base with 3-10 carbon atoms; X represents the hydrogen atom or the alkyl group with 1-10 carbon atoms, the alkoxy group with 1-10 carbon atoms or the halogen atom replacing the phenyl group or the naphthene base with 3-10 carbon atoms; Y and Z represent individually the alkyl group with 1-10 carbon atoms, the alkoxy group with 1-10 carbon atoms, the alkenyl group with 2-10 carbon atoms or the halogen atom respectively; the alkyl group, the alkoxy group and the alkenyl group can be replaced by the halogen atom; n represents numbers 0-10; p represents numbers 0-4; r represents numbers 0-4.
TW095121898A 2005-06-20 2006-06-19 Alkali developable photosensitive resin composition TW200712768A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005178857 2005-06-20
JP2006155876A JP4916224B2 (en) 2005-06-20 2006-06-05 Alkali-developable photosensitive resin composition

Publications (2)

Publication Number Publication Date
TW200712768A true TW200712768A (en) 2007-04-01
TWI372943B TWI372943B (en) 2012-09-21

Family

ID=37793551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095121898A TW200712768A (en) 2005-06-20 2006-06-19 Alkali developable photosensitive resin composition

Country Status (4)

Country Link
JP (1) JP4916224B2 (en)
KR (1) KR101308954B1 (en)
CN (1) CN1885162B (en)
TW (1) TW200712768A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4738190B2 (en) * 2006-02-01 2011-08-03 株式会社Ａｄｅｋａ Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP4667261B2 (en) * 2006-02-01 2011-04-06 株式会社Ａｄｅｋａ Alkali-developable photosensitive resin composition
JP4878876B2 (en) * 2006-03-15 2012-02-15 株式会社Ａｄｅｋａ Epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP5311750B2 (en) * 2007-02-28 2013-10-09 株式会社Ａｄｅｋａ Phenol resin, epoxy resin, alkali-developable resin composition, and alkali-developable photosensitive resin composition
JP2009275148A (en) * 2008-05-15 2009-11-26 Adeka Corp New compound, alkali-developable resin composition, and alkali-developable photosensitive resin composition
US8664289B2 (en) * 2010-09-22 2014-03-04 Adeka Corporation Dye and coloring photosensitive composition

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3148429B2 (en) * 1992-02-04 2001-03-19 新日本製鐵株式会社 Photopolymerizable unsaturated compound and alkali-developable photosensitive resin composition
JP2000053746A (en) * 1998-08-06 2000-02-22 Nippon Shokubai Co Ltd Production of photosensitive resin and photosensitive resin composition containing resin produced by the method
AU2001222286A1 (en) * 2000-01-17 2001-07-31 Showa Highpolymer Co. Ltd. Photosensitive resin composition
CN1210620C (en) * 2000-09-16 2005-07-13 互応化学工业株式会社 Ultraviolet-curable resin composition and photosolder resist ink contaning the composition
JP3593066B2 (en) * 2001-06-28 2004-11-24 株式会社日本触媒 Photosensitive resin for liquid crystal spacer and photosensitive resin composition
JP2003177528A (en) * 2001-09-21 2003-06-27 Tamura Kaken Co Ltd Photosensitive resin composition and printed wiring board
JP4554170B2 (en) * 2003-06-03 2010-09-29 株式会社タムラ製作所 UV curable alkali-soluble resin, UV curable resin for solder resist film and printed wiring board
CN100386298C (en) * 2004-03-25 2008-05-07 株式会社艾迪科 Novel phenol compound and novel epoxy resin derivable from such phenol compound
JP4198101B2 (en) * 2004-09-17 2008-12-17 株式会社Ａｄｅｋａ Alkali developable resin composition

Also Published As

Publication number Publication date
TWI372943B (en) 2012-09-21
CN1885162B (en) 2011-06-22
KR101308954B1 (en) 2013-09-24
CN1885162A (en) 2006-12-27
JP4916224B2 (en) 2012-04-11
JP2007034279A (en) 2007-02-08
KR20060133482A (en) 2006-12-26

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