TW200641531A - Alkali developable photosensitive resin composition - Google Patents

Alkali developable photosensitive resin composition

Info

Publication number
TW200641531A
TW200641531A TW095106146A TW95106146A TW200641531A TW 200641531 A TW200641531 A TW 200641531A TW 095106146 A TW095106146 A TW 095106146A TW 95106146 A TW95106146 A TW 95106146A TW 200641531 A TW200641531 A TW 200641531A
Authority
TW
Taiwan
Prior art keywords
group
compound
epoxy
acid
epoxy adduct
Prior art date
Application number
TW095106146A
Other languages
Chinese (zh)
Inventor
Tomohito Ishiguro
Yoshie Makabe
Naomi Sato
Masahiro Takata
Original Assignee
Adeka Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Adeka Corp filed Critical Adeka Corp
Publication of TW200641531A publication Critical patent/TW200641531A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
    • C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
    • C08G59/1455—Monocarboxylic acids, anhydrides, halides, or low-molecular-weight esters thereof
    • C08G59/1461—Unsaturated monoacids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • C08G59/1494—Polycondensates modified by chemical after-treatment followed by a further chemical treatment thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Emergency Medicine (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)

Abstract

An alkali-developable resin composition comprising a reaction product obtained by providing an epoxy adduct having a structure resulting from adding, to epoxy resin (A) expressed with the following general formula (I), unsaturated monobasic acid (B), and compound (C) selected from among a phenol compound, an alcohol compound, an amine compound and a carboxylic acid. The reaction product is made by subjecting the epoxy adduct to esterification with polybasic acid anhydride (D). Also, the epoxy adduct has the structure made to add by the ratio from which the number of the carboxyl groups of the unsaturated monobasic acid (B) is 0.2~1.0, and that of the phenolic hydroxyl groups, the alcoholic hydroxyl groups, amino groups, or carboxyl groups of compound (C) is 0~0.8, and the sum of the unsaturated monobasic acid (B) and compound (C) becomes 0.1~1.0 pieces with respect to one epoxy group of the above-mentioned epoxy resin (A). The above-mentioned esterification is performed by making the ratio of the acid-anhydride structure of the polybasic acid anhydride (D) becomes 0.2~0.7 pieces with respect to one hydroxyl group of the above-mentioned epoxy adduct. In formula (I), A is a alicyclic hydrocarbon group;R1 and R2 independently represent hydrogen atoms, alkyl group with 1~5 carbon, an alkoxy group with 1~8 carbon atoms, a halogen atom or an vinyl group with 2~5 carbon atoms, wherein the beforesaid alkyl group, alkoxy group, vinyl group can be substituted with halogen, and n is an integer of 0~10.
TW095106146A 2005-03-11 2006-02-23 Alkali developable photosensitive resin composition TW200641531A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005069275A JP2006251495A (en) 2005-03-11 2005-03-11 Alkali developable photosensitive resin composition

Publications (1)

Publication Number Publication Date
TW200641531A true TW200641531A (en) 2006-12-01

Family

ID=36953156

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095106146A TW200641531A (en) 2005-03-11 2006-02-23 Alkali developable photosensitive resin composition

Country Status (3)

Country Link
JP (1) JP2006251495A (en)
TW (1) TW200641531A (en)
WO (1) WO2006095554A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5153081B2 (en) * 2006-03-23 2013-02-27 日本化薬株式会社 Epoxy resin, epoxy resin composition and cured product thereof
KR102305058B1 (en) * 2014-07-04 2021-09-24 미쯔비시 케미컬 주식회사 Resin, photosensitive resin composition, cured product, color filter, and image display device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2931860B2 (en) * 1992-01-31 1999-08-09 日石三菱株式会社 Photocurable resin composition and photocurable resin composition for solder resist
JPH09268220A (en) * 1996-03-29 1997-10-14 Nippon Kayaku Co Ltd Production of epoxy resin, epoxy resin composition and its cured material
JPH10282666A (en) * 1997-04-01 1998-10-23 Mitsui Chem Inc Photosensitive resin composition
JPH11140145A (en) * 1997-11-07 1999-05-25 Nippon Kayaku Co Ltd Resin composition, permanent resist resin composition, and cured product thereof
JP2000297137A (en) * 1999-04-14 2000-10-24 Mitsubishi Gas Chem Co Inc Photosensitive resin composition
JP2001056554A (en) * 1999-08-20 2001-02-27 Dainippon Ink & Chem Inc Alkali developable photosensitive resin composition
JP2002220425A (en) * 2001-01-25 2002-08-09 Nippon Kayaku Co Ltd Resin composition, solder resist resin composition and their cured items
JP4290483B2 (en) * 2003-06-05 2009-07-08 新日鐵化学株式会社 Photosensitive resin composition for black resist and light-shielding film formed using the same

Also Published As

Publication number Publication date
JP2006251495A (en) 2006-09-21
WO2006095554A1 (en) 2006-09-14

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