TW200622566A - A heat dissipation assembly and method for cooling heat-generating components in an electrical device - Google Patents

A heat dissipation assembly and method for cooling heat-generating components in an electrical device

Info

Publication number
TW200622566A
TW200622566A TW094140482A TW94140482A TW200622566A TW 200622566 A TW200622566 A TW 200622566A TW 094140482 A TW094140482 A TW 094140482A TW 94140482 A TW94140482 A TW 94140482A TW 200622566 A TW200622566 A TW 200622566A
Authority
TW
Taiwan
Prior art keywords
heat
heat dissipation
generating components
electrical device
dissipation assembly
Prior art date
Application number
TW094140482A
Other languages
English (en)
Inventor
Max W Durney
Original Assignee
Ind Origami Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Origami Llc filed Critical Ind Origami Llc
Publication of TW200622566A publication Critical patent/TW200622566A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW094140482A 2004-11-18 2005-11-17 A heat dissipation assembly and method for cooling heat-generating components in an electrical device TW200622566A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US62984504P 2004-11-18 2004-11-18

Publications (1)

Publication Number Publication Date
TW200622566A true TW200622566A (en) 2006-07-01

Family

ID=36407770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094140482A TW200622566A (en) 2004-11-18 2005-11-17 A heat dissipation assembly and method for cooling heat-generating components in an electrical device

Country Status (3)

Country Link
US (1) US20060133036A1 (zh)
TW (1) TW200622566A (zh)
WO (1) WO2006055776A2 (zh)

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US9047066B2 (en) 2005-09-30 2015-06-02 Intel Corporation Apparatus and method to efficiently cool a computing device
US7403385B2 (en) * 2006-03-06 2008-07-22 Cisco Technology, Inc. Efficient airflow management
US7764514B2 (en) * 2006-12-08 2010-07-27 Intel Corporation Electromagnetic interference shielding for device cooling
BRPI0807526A2 (pt) 2007-02-09 2014-06-10 Ind Origami Inc Estrutura tridimensional para mancal de carga
JP5011016B2 (ja) * 2007-07-30 2012-08-29 株式会社日立産機システム 電力変換装置
US7957140B2 (en) * 2007-12-31 2011-06-07 Intel Corporation Air mover for device surface cooling
US7599183B2 (en) * 2008-02-27 2009-10-06 International Business Machines Corporation Variable position dampers for controlling air flow to multiple modules in a common chassis
US7876559B2 (en) * 2008-11-17 2011-01-25 Dell Products L.P. Universal blank for air flow management
CN101907910A (zh) * 2009-06-05 2010-12-08 鸿富锦精密工业（深圳）有限公司 散热系统及其上的连接器
US8605428B2 (en) * 2011-07-01 2013-12-10 Intel Corporation Apparatus, system and method for concealed venting thermal solution
JP2013051294A (ja) * 2011-08-30 2013-03-14 Sony Corp 電子機器
US10172365B2 (en) * 2014-07-02 2019-01-08 Stephen Thibodeaux Negative draft inducing device for smoker
CN105658033A (zh) * 2016-01-26 2016-06-08 华为技术有限公司 具有热交换的装置
US10481658B1 (en) * 2018-06-26 2019-11-19 Dell Products, L.P. Under-motherboard air cooling plenum
US10772188B1 (en) * 2019-06-11 2020-09-08 International Business Machines Corporation Stiffener cooling structure
US11432422B2 (en) 2019-10-25 2022-08-30 Rohde & Schwarz Gmbh & Co. Kg Electrical device with a modular structure

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US5077601A (en) * 1988-09-09 1991-12-31 Hitachi, Ltd. Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system
US5440450A (en) * 1990-09-14 1995-08-08 Next, Inc. Housing cooling system
US5592363A (en) * 1992-09-30 1997-01-07 Hitachi, Ltd. Electronic apparatus
JPH07321265A (ja) * 1994-05-27 1995-12-08 Fujitsu Ltd 集積回路素子モジュールの冷却構造
US5497825A (en) * 1995-05-24 1996-03-12 Symphony Group International Co., Ltd. Heat-radiator for CPU of a computer
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
US5704212A (en) * 1996-09-13 1998-01-06 Itronix Corporation Active cooling system for cradle of portable electronic devices
US6021042A (en) * 1997-08-06 2000-02-01 Intel Corporation Cooling duct for a computer cooling system with redundant air moving units
US6400012B1 (en) * 1997-09-17 2002-06-04 Advanced Energy Voorhees, Inc. Heat sink for use in cooling an integrated circuit
US6373696B1 (en) * 1998-06-15 2002-04-16 Compaq Computer Corporation Hard drive cooling using finned heat sink and thermally conductive interface pad
US6330153B1 (en) * 1999-01-14 2001-12-11 Nokia Telecommunications Oy Method and system for efficiently removing heat generated from an electronic device
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
US6677562B2 (en) * 2001-03-13 2004-01-13 Matsushita Electric Industrial Co., Ltd. High-frequency heating apparatus and cooling system for magnetron-driving power supply utilized in the apparatus
US20040190253A1 (en) * 2003-03-31 2004-09-30 Ravi Prasher Channeled heat sink and chassis with integrated heat rejector for two-phase cooling
US20050174732A1 (en) * 2004-02-06 2005-08-11 Fang-Cheng Lin Main unit of a computer
US7126819B2 (en) * 2004-04-14 2006-10-24 Hsien-Rong Liang Chassis air guide thermal cooling solution
JP4045264B2 (ja) * 2004-08-24 2008-02-13 富士通株式会社 冷却冗長機能を有する電子機器
US20060181846A1 (en) * 2005-02-11 2006-08-17 Farnsworth Arthur K Cooling system for a computer environment
JP4675666B2 (ja) * 2005-04-15 2011-04-27 株式会社東芝 電子機器
US20070117502A1 (en) * 2005-11-22 2007-05-24 Gateway Inc. Adjustable cooling air duct for use with components of different sizes
JP2007172328A (ja) * 2005-12-22 2007-07-05 Toshiba Corp 電子機器
US7403385B2 (en) * 2006-03-06 2008-07-22 Cisco Technology, Inc. Efficient airflow management
US20070286722A1 (en) * 2006-06-12 2007-12-13 Asia Vital Components Co.,Ltd. Structure of air duct and manufacturing process of the same

Also Published As

Publication number Publication date
US20060133036A1 (en) 2006-06-22
WO2006055776A2 (en) 2006-05-26
WO2006055776A3 (en) 2007-11-15

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