TW200619867A - Exposure method and exposure device - Google Patents

Exposure method and exposure device

Info

Publication number
TW200619867A
TW200619867A TW094137407A TW94137407A TW200619867A TW 200619867 A TW200619867 A TW 200619867A TW 094137407 A TW094137407 A TW 094137407A TW 94137407 A TW94137407 A TW 94137407A TW 200619867 A TW200619867 A TW 200619867A
Authority
TW
Taiwan
Prior art keywords
exposure
photosensitive layer
prevent
edge region
light irradiated
Prior art date
Application number
TW094137407A
Other languages
English (en)
Inventor
Yoshiharu Sasaki
Original Assignee
Fuji Photo Film Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Photo Film Co Ltd filed Critical Fuji Photo Film Co Ltd
Publication of TW200619867A publication Critical patent/TW200619867A/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2022Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0073Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061Etching masks
    • H05K3/064Photoresists

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
TW094137407A 2004-10-28 2005-10-26 Exposure method and exposure device TW200619867A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004314047A JP2006126463A (ja) 2004-10-28 2004-10-28 露光方法および装置

Publications (1)

Publication Number Publication Date
TW200619867A true TW200619867A (en) 2006-06-16

Family

ID=36227986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094137407A TW200619867A (en) 2004-10-28 2005-10-26 Exposure method and exposure device

Country Status (6)

Country Link
US (1) US20080153041A1 (zh)
JP (1) JP2006126463A (zh)
KR (2) KR20070073861A (zh)
CN (1) CN1821882A (zh)
TW (1) TW200619867A (zh)
WO (1) WO2006046764A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4825060B2 (ja) * 2006-06-14 2011-11-30 富士通セミコンダクター株式会社 露光方法
KR101804478B1 (ko) 2011-07-12 2017-12-05 삼성디스플레이 주식회사 디지털 노광 장치 및 이를 이용하여 기판을 노광하는 방법
KR101949389B1 (ko) * 2012-11-07 2019-02-18 엘지디스플레이 주식회사 마스크리스 노광장치를 이용한 패턴 형성 방법
KR101832503B1 (ko) * 2012-11-27 2018-02-26 삼성전기주식회사 레지스트막 패터닝 방법 및 이의 구현을 위한 노광기
JPWO2018105000A1 (ja) * 2016-12-05 2019-03-22 三菱電機株式会社 プリント配線板の作製方法
DE102017110241A1 (de) * 2017-05-11 2018-11-15 Nanoscribe Gmbh Verfahren zum Erzeugen einer 3D-Struktur mittels Laserlithographie sowie Computerprogrammprodukt
JP7121509B2 (ja) * 2018-03-19 2022-08-18 キヤノン株式会社 露光装置、露光方法、および物品製造方法
KR102137278B1 (ko) * 2020-04-10 2020-07-23 김상봉 고속타발기 연동형 정밀 롤투롤 소재 연성회로기판 제조 방법
CN113973438B (zh) * 2020-07-22 2024-06-14 深南电路股份有限公司 一种电路板的加工方法及电路板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07241690A (ja) * 1994-03-07 1995-09-19 Hitachi Ltd レーザ加工用誘電体マスクとその製造方法
JP4547817B2 (ja) * 2000-03-15 2010-09-22 ソニー株式会社 プリント配線板のランド部、部品実装されたプリント配線板、プリント配線板の製造方法、及び、プリント配線板実装方法
JP2002280285A (ja) * 2001-03-16 2002-09-27 Murata Mfg Co Ltd レジストパターンの形成方法
JP4320694B2 (ja) * 2001-08-08 2009-08-26 株式会社オーク製作所 多重露光描画装置および多重露光式描画方法
JP2003337425A (ja) * 2002-05-20 2003-11-28 Fuji Photo Film Co Ltd 露光装置

Also Published As

Publication number Publication date
WO2006046764A1 (ja) 2006-05-04
US20080153041A1 (en) 2008-06-26
KR20060052305A (ko) 2006-05-19
CN1821882A (zh) 2006-08-23
JP2006126463A (ja) 2006-05-18
KR20070073861A (ko) 2007-07-10

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