TW200618925A - Solder composition and method for forming a solder layer with the solder composition - Google Patents

Solder composition and method for forming a solder layer with the solder composition

Info

Publication number
TW200618925A
TW200618925A TW094133879A TW94133879A TW200618925A TW 200618925 A TW200618925 A TW 200618925A TW 094133879 A TW094133879 A TW 094133879A TW 94133879 A TW94133879 A TW 94133879A TW 200618925 A TW200618925 A TW 200618925A
Authority
TW
Taiwan
Prior art keywords
solder
layer
electrode
solder layer
particle
Prior art date
Application number
TW094133879A
Other languages
English (en)
Inventor
Masahiko Furuno
Hiroshi Saito
Isao Sakamoto
Masaru Shirai
Original Assignee
Tamura Seisakusho Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Seisakusho Kk filed Critical Tamura Seisakusho Kk
Publication of TW200618925A publication Critical patent/TW200618925A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • B22F2998/10—Processes characterised by the sequence of their steps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW094133879A 2004-09-30 2005-09-29 Solder composition and method for forming a solder layer with the solder composition TW200618925A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004285779 2004-09-30

Publications (1)

Publication Number Publication Date
TW200618925A true TW200618925A (en) 2006-06-16

Family

ID=36142461

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094133879A TW200618925A (en) 2004-09-30 2005-09-29 Solder composition and method for forming a solder layer with the solder composition

Country Status (6)

Country Link
US (1) US20080035710A1 (zh)
EP (1) EP1795293A4 (zh)
JP (1) JP5001655B2 (zh)
CN (1) CN101031385A (zh)
TW (1) TW200618925A (zh)
WO (1) WO2006038376A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101745636B (zh) * 2008-12-16 2011-03-30 北京有色金属研究总院 一种抗氧化焊粉的制备方法
KR101436714B1 (ko) * 2010-06-01 2014-09-01 센주긴조쿠고교 가부시키가이샤 납프리 솔더 페이스트
KR101704868B1 (ko) * 2012-04-16 2017-02-08 가부시키가이샤 다니구로구미 납땜 장치 및 방법 그리고 제조된 기판 및 전자 부품
JP5766668B2 (ja) * 2012-08-16 2015-08-19 株式会社タムラ製作所 はんだ組成物およびそれを用いたプリント配線基板
DE102021110298A1 (de) * 2021-04-22 2022-10-27 Infineon Technologies Ag Bleifreies lotmaterial, schichtstruktur, verfahren zur herstellung eines lotmaterials und verfahren zur herstellung einer schichtstruktur

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4380518A (en) * 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
JP2564152B2 (ja) * 1987-10-27 1996-12-18 タムラ化研株式会社 はんだペースト
JP2719832B2 (ja) * 1989-06-09 1998-02-25 ユーホーケミカル株式会社 はんだペースト
JPH05192786A (ja) * 1992-01-17 1993-08-03 Seiko Instr Inc クリーム半田
JPH05337680A (ja) * 1992-06-08 1993-12-21 Alps Electric Co Ltd 液状半田および該液状半田を用いたリフロー半田付け方法
KR100203997B1 (ko) * 1993-12-06 1999-06-15 하세가와 요시히로 땜납석출용 조성물 및 이조성물을 사용한 장착법
US5922403A (en) * 1996-03-12 1999-07-13 Tecle; Berhan Method for isolating ultrafine and fine particles
JP3205793B2 (ja) * 1996-12-19 2001-09-04 株式会社巴製作所 超微粒子及びその製造方法
JP3394703B2 (ja) * 1998-03-16 2003-04-07 ハリマ化成株式会社 半田用フラックス
JP2001232496A (ja) * 2000-02-23 2001-08-28 Taiho Kogyo Co Ltd はんだ付け用フラックスおよびはんだペースト
JP2003166007A (ja) * 2001-03-28 2003-06-13 Tamura Kaken Co Ltd 金属微粒子の製造方法、金属微粒子含有物及びソルダーペースト組成物
JP2004107728A (ja) * 2002-09-18 2004-04-08 Ebara Corp 接合材料及び接合方法
TWI284581B (en) * 2002-09-18 2007-08-01 Ebara Corp Bonding material and bonding method

Also Published As

Publication number Publication date
US20080035710A1 (en) 2008-02-14
JP5001655B2 (ja) 2012-08-15
JPWO2006038376A1 (ja) 2008-07-31
CN101031385A (zh) 2007-09-05
WO2006038376A1 (ja) 2006-04-13
EP1795293A1 (en) 2007-06-13
EP1795293A4 (en) 2011-02-23

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