TW200616867A - Container for transporting substrate, inner wall structure of the same, and bottom lifting member used in the same - Google Patents

Container for transporting substrate, inner wall structure of the same, and bottom lifting member used in the same

Info

Publication number
TW200616867A
TW200616867A TW094134765A TW94134765A TW200616867A TW 200616867 A TW200616867 A TW 200616867A TW 094134765 A TW094134765 A TW 094134765A TW 94134765 A TW94134765 A TW 94134765A TW 200616867 A TW200616867 A TW 200616867A
Authority
TW
Taiwan
Prior art keywords
heat insulation
container
same
insulation material
inner heat
Prior art date
Application number
TW094134765A
Other languages
English (en)
Inventor
Toshiro Fujiwara
Original Assignee
Toshiro Fujiwara
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004292458A external-priority patent/JP3850852B2/ja
Priority claimed from JP2005223903A external-priority patent/JP3850863B1/ja
Priority claimed from JP2005229634A external-priority patent/JP3850864B1/ja
Priority claimed from JP2005229635A external-priority patent/JP3819412B1/ja
Priority claimed from JP2005229636A external-priority patent/JP3813628B1/ja
Application filed by Toshiro Fujiwara filed Critical Toshiro Fujiwara
Publication of TW200616867A publication Critical patent/TW200616867A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • B65D85/48—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for glass sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
TW094134765A 2004-10-05 2005-10-05 Container for transporting substrate, inner wall structure of the same, and bottom lifting member used in the same TW200616867A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2004292458A JP3850852B2 (ja) 2004-10-05 2004-10-05 基板搬送用容器
JP2005223903A JP3850863B1 (ja) 2005-08-02 2005-08-02 基板搬送用容器
JP2005229634A JP3850864B1 (ja) 2005-08-08 2005-08-08 基板搬送用容器の内壁構造
JP2005229635A JP3819412B1 (ja) 2005-08-08 2005-08-08 基板搬送用容器
JP2005229636A JP3813628B1 (ja) 2005-08-08 2005-08-08 基板搬送用容器

Publications (1)

Publication Number Publication Date
TW200616867A true TW200616867A (en) 2006-06-01

Family

ID=36142617

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134765A TW200616867A (en) 2004-10-05 2005-10-05 Container for transporting substrate, inner wall structure of the same, and bottom lifting member used in the same

Country Status (3)

Country Link
KR (1) KR100842819B1 (zh)
TW (1) TW200616867A (zh)
WO (1) WO2006038541A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460109B (zh) * 2010-05-12 2014-11-11 Corning Prec Materials Co Ltd 用於顯示器玻璃基板的包裝盒

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103204321A (zh) * 2012-01-16 2013-07-17 昆山允升吉光电科技有限公司 一种多功能储存箱
CN103204288B (zh) * 2012-01-16 2016-08-10 昆山允升吉光电科技有限公司 一种多功能储存箱
CN103204319B (zh) * 2012-01-16 2016-08-10 昆山允升吉光电科技有限公司 一种多功能储存箱
CN102874494B (zh) * 2012-10-12 2016-06-08 深圳市华星光电技术有限公司 液晶模组包装箱
GB2534910C (en) * 2015-02-05 2021-10-27 Laminar Medica Ltd A Thermally Insulated Container and Method for Making Same
DE102017131375B4 (de) * 2017-12-28 2021-03-18 Nanostone Water Gmbh Transporteinheit für ein Filtermodul, sowie Verwendung zum Transportieren eines Filtermoduls
CN111086738A (zh) * 2019-12-04 2020-05-01 深圳市微语信息技术开发有限公司 一种便于调节的机器人搬运防护盒

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5791272U (zh) * 1980-11-26 1982-06-04
JP3325385B2 (ja) * 1994-03-28 2002-09-17 淀川ヒューテック株式会社 ガラス基板搬送用ボックス
JP2000327075A (ja) * 1999-05-24 2000-11-28 Dainippon Printing Co Ltd 基板搬送用ボックス
DE10197125B3 (de) * 2000-12-27 2005-08-18 Asahi Kasei Kabushiki Kaisha Einbettungskörper für Glassubstrate sowie verpackter Gegenstand unter Verwendung desselben
JP4284895B2 (ja) * 2001-07-31 2009-06-24 日本ゼオン株式会社 薄板搬送用コンテナ
JP2003243496A (ja) * 2002-02-15 2003-08-29 Dainippon Printing Co Ltd 基板収納ケース
JP2004149191A (ja) * 2002-10-31 2004-05-27 Nippon Zeon Co Ltd 導光板保管用容器及び導光板の保管方法
JP2004149166A (ja) * 2002-10-31 2004-05-27 Fujitsu Display Technologies Corp ガラス基板搬送用ボックス
JP4233392B2 (ja) * 2003-06-12 2009-03-04 信越ポリマー株式会社 基板収納容器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460109B (zh) * 2010-05-12 2014-11-11 Corning Prec Materials Co Ltd 用於顯示器玻璃基板的包裝盒

Also Published As

Publication number Publication date
KR20070058700A (ko) 2007-06-08
KR100842819B1 (ko) 2008-07-03
WO2006038541A1 (ja) 2006-04-13

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