TW200608526A - Memory module and method for manufacturing the same - Google Patents
Memory module and method for manufacturing the sameInfo
- Publication number
- TW200608526A TW200608526A TW093125406A TW93125406A TW200608526A TW 200608526 A TW200608526 A TW 200608526A TW 093125406 A TW093125406 A TW 093125406A TW 93125406 A TW93125406 A TW 93125406A TW 200608526 A TW200608526 A TW 200608526A
- Authority
- TW
- Taiwan
- Prior art keywords
- memory
- module
- memory module
- manufacturing
- same
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093125406A TWI260069B (en) | 2004-08-24 | 2004-08-24 | Memory module and method for manufacturing the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW093125406A TWI260069B (en) | 2004-08-24 | 2004-08-24 | Memory module and method for manufacturing the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200608526A true TW200608526A (en) | 2006-03-01 |
TWI260069B TWI260069B (en) | 2006-08-11 |
Family
ID=37872619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093125406A TWI260069B (en) | 2004-08-24 | 2004-08-24 | Memory module and method for manufacturing the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI260069B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413128B (zh) * | 2008-05-05 | 2013-10-21 | Micron Technology Inc | 具有可組態輸入/輸出埠之記憶體模組 |
TWI478313B (zh) * | 2009-03-30 | 2015-03-21 | Qualcomm Inc | 使用頂部後護層技術及底部結構技術之積體電路晶片 |
CN106847712A (zh) * | 2016-12-28 | 2017-06-13 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型晶圆级封装结构及其制作方法 |
WO2024031774A1 (zh) * | 2022-08-10 | 2024-02-15 | 长鑫存储技术有限公司 | 半导体结构、半导体结构的制造方法和半导体器件 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6635805B2 (ja) * | 2016-01-26 | 2020-01-29 | 三菱電機株式会社 | 半導体装置 |
-
2004
- 2004-08-24 TW TW093125406A patent/TWI260069B/zh not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI413128B (zh) * | 2008-05-05 | 2013-10-21 | Micron Technology Inc | 具有可組態輸入/輸出埠之記憶體模組 |
TWI478313B (zh) * | 2009-03-30 | 2015-03-21 | Qualcomm Inc | 使用頂部後護層技術及底部結構技術之積體電路晶片 |
CN106847712A (zh) * | 2016-12-28 | 2017-06-13 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型晶圆级封装结构及其制作方法 |
CN106847712B (zh) * | 2016-12-28 | 2019-06-14 | 华进半导体封装先导技术研发中心有限公司 | 一种扇出型晶圆级封装结构及其制作方法 |
WO2024031774A1 (zh) * | 2022-08-10 | 2024-02-15 | 长鑫存储技术有限公司 | 半导体结构、半导体结构的制造方法和半导体器件 |
Also Published As
Publication number | Publication date |
---|---|
TWI260069B (en) | 2006-08-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |