TW200608024A - A highly resilient cantilever spring probe for testing ICs - Google Patents
A highly resilient cantilever spring probe for testing ICsInfo
- Publication number
- TW200608024A TW200608024A TW094127405A TW94127405A TW200608024A TW 200608024 A TW200608024 A TW 200608024A TW 094127405 A TW094127405 A TW 094127405A TW 94127405 A TW94127405 A TW 94127405A TW 200608024 A TW200608024 A TW 200608024A
- Authority
- TW
- Taiwan
- Prior art keywords
- cantilever spring
- spring probe
- highly resilient
- resilient cantilever
- base
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06727—Cantilever beams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/919,836 US6956389B1 (en) | 2004-08-16 | 2004-08-16 | Highly resilient cantilever spring probe for testing ICs |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200608024A true TW200608024A (en) | 2006-03-01 |
Family
ID=35066157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094127405A TW200608024A (en) | 2004-08-16 | 2005-08-12 | A highly resilient cantilever spring probe for testing ICs |
Country Status (6)
Country | Link |
---|---|
US (3) | US6956389B1 (zh) |
JP (1) | JP2008510166A (zh) |
KR (1) | KR20070041581A (zh) |
CN (1) | CN101014865A (zh) |
TW (1) | TW200608024A (zh) |
WO (1) | WO2006023380A1 (zh) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7659739B2 (en) | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US7733101B2 (en) | 2004-05-21 | 2010-06-08 | Microprobe, Inc. | Knee probe having increased scrub motion |
USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
US7230440B2 (en) * | 2004-10-21 | 2007-06-12 | Palo Alto Research Center Incorporated | Curved spring structure with elongated section located under cantilevered section |
US8330485B2 (en) * | 2004-10-21 | 2012-12-11 | Palo Alto Research Center Incorporated | Curved spring structure with downturned tip |
WO2007015218A2 (en) * | 2005-08-03 | 2007-02-08 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having an optimized non-flat surface |
US7880565B2 (en) * | 2005-08-03 | 2011-02-01 | Kolo Technologies, Inc. | Micro-electro-mechanical transducer having a surface plate |
JP5232382B2 (ja) * | 2005-12-06 | 2013-07-10 | 株式会社エンプラス | プローブチップ及びプローブカード |
US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
US7312617B2 (en) | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
US7786740B2 (en) | 2006-10-11 | 2010-08-31 | Astria Semiconductor Holdings, Inc. | Probe cards employing probes having retaining portions for potting in a potting region |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US7384277B1 (en) * | 2006-12-17 | 2008-06-10 | Formfactor, Inc. | Reinforced contact elements |
JP5147227B2 (ja) * | 2006-12-19 | 2013-02-20 | 株式会社日本マイクロニクス | 電気的接続装置の使用方法 |
US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
JP2008268145A (ja) * | 2007-04-25 | 2008-11-06 | Micronics Japan Co Ltd | プローブ組立体 |
US7671610B2 (en) | 2007-10-19 | 2010-03-02 | Microprobe, Inc. | Vertical guided probe array providing sideways scrub motion |
US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
CN102539849B (zh) * | 2012-01-12 | 2014-10-22 | 南京瑞尼特微电子有限公司 | 一种微探针阵列及其制作方法 |
US9086433B2 (en) | 2012-12-19 | 2015-07-21 | International Business Machines Corporation | Rigid probe with compliant characteristics |
JP6029535B2 (ja) * | 2013-05-27 | 2016-11-24 | 三菱電機株式会社 | コンタクトプローブ |
US9382960B2 (en) | 2014-02-19 | 2016-07-05 | Massachusetts Institute Of Technology | Beam-based nonlinear spring |
US10908182B2 (en) | 2016-06-28 | 2021-02-02 | Kabushiki Kaisha Nihon Micronics | Electrical connecting apparatus and contact |
JP6737171B2 (ja) | 2016-12-28 | 2020-08-05 | 信越化学工業株式会社 | 希土類焼結磁石のマルチ切断加工方法 |
EP3704496A4 (en) * | 2017-10-31 | 2021-08-11 | FormFactor, Inc. | MEMS PROBE CARD ASSEMBLY HAVING DECOUPLED ELECTRICAL AND MECHANICAL PROBE CONNECTIONS |
IT201800001170A1 (it) * | 2018-01-17 | 2019-07-17 | Technoprobe Spa | Testa di misura di tipo cantilever e relativa sonda di contatto |
CN114594373B (zh) * | 2022-05-11 | 2023-01-13 | 深圳市卓汉材料技术有限公司 | 一种面向集成电路测试的悬臂式探针及探针台 |
KR102532503B1 (ko) * | 2022-09-01 | 2023-05-17 | 주식회사 프로이천 | 프로브니들 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5166774A (en) * | 1990-10-05 | 1992-11-24 | Motorola, Inc. | Selectively releasing conductive runner and substrate assembly having non-planar areas |
US6482013B2 (en) * | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
US5832601A (en) | 1993-11-16 | 1998-11-10 | Form Factor, Inc. | Method of making temporary connections between electronic components |
US5613861A (en) | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
KR100202998B1 (ko) * | 1995-12-02 | 1999-06-15 | 남재우 | 마이크로 팁을 갖는 웨이퍼 프로브 카드 및 그 제조방법 |
EP1482314B1 (en) * | 1996-05-17 | 2009-11-11 | FormFactor, Inc. | Microelectronic spring contact element |
US5764072A (en) * | 1996-12-20 | 1998-06-09 | Probe Technology | Dual contact probe assembly for testing integrated circuits |
JP3269827B2 (ja) | 1997-04-04 | 2002-04-02 | ユニバーシティ・オブ・サザン・カリフォルニア | 電気化学製造のための物品、方法、および装置 |
US6014032A (en) * | 1997-09-30 | 2000-01-11 | International Business Machines Corporation | Micro probe ring assembly and method of fabrication |
US6414501B2 (en) * | 1998-10-01 | 2002-07-02 | Amst Co., Ltd. | Micro cantilever style contact pin structure for wafer probing |
US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
US6218203B1 (en) * | 1999-06-28 | 2001-04-17 | Advantest Corp. | Method of producing a contact structure |
US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
US6250933B1 (en) * | 2000-01-20 | 2001-06-26 | Advantest Corp. | Contact structure and production method thereof |
US6625004B1 (en) * | 2001-08-31 | 2003-09-23 | Superconductor Technologies, Inc. | Electrostatic actuators with intrinsic stress gradient |
US7649145B2 (en) * | 2004-06-18 | 2010-01-19 | Micron Technology, Inc. | Compliant spring contact structures |
-
2004
- 2004-08-16 US US10/919,836 patent/US6956389B1/en not_active Expired - Fee Related
-
2005
- 2005-08-11 KR KR1020077003923A patent/KR20070041581A/ko not_active Application Discontinuation
- 2005-08-11 JP JP2007527888A patent/JP2008510166A/ja active Pending
- 2005-08-11 WO PCT/US2005/028661 patent/WO2006023380A1/en active Application Filing
- 2005-08-11 CN CNA2005800245900A patent/CN101014865A/zh active Pending
- 2005-08-12 TW TW094127405A patent/TW200608024A/zh unknown
- 2005-09-02 US US11/162,259 patent/US20060033521A1/en not_active Abandoned
- 2005-09-02 US US11/162,252 patent/US7061262B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101014865A (zh) | 2007-08-08 |
US20060033521A1 (en) | 2006-02-16 |
JP2008510166A (ja) | 2008-04-03 |
US7061262B2 (en) | 2006-06-13 |
US6956389B1 (en) | 2005-10-18 |
KR20070041581A (ko) | 2007-04-18 |
WO2006023380A1 (en) | 2006-03-02 |
US20060033520A1 (en) | 2006-02-16 |
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