TW200608024A - A highly resilient cantilever spring probe for testing ICs - Google Patents

A highly resilient cantilever spring probe for testing ICs

Info

Publication number
TW200608024A
TW200608024A TW094127405A TW94127405A TW200608024A TW 200608024 A TW200608024 A TW 200608024A TW 094127405 A TW094127405 A TW 094127405A TW 94127405 A TW94127405 A TW 94127405A TW 200608024 A TW200608024 A TW 200608024A
Authority
TW
Taiwan
Prior art keywords
cantilever spring
spring probe
highly resilient
resilient cantilever
base
Prior art date
Application number
TW094127405A
Other languages
Chinese (zh)
Inventor
Phillip Mai
Original Assignee
Jem America Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jem America Corp filed Critical Jem America Corp
Publication of TW200608024A publication Critical patent/TW200608024A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Abstract

A probe has a cantilever arm coupled to a base via an anchor. A surface of the arm facing the base or a surface of the base facing the arm has steps with contact points that contact the base when the arm is depressed. Alternatively, the surface of the arm and/or the surface of the base may be curved.
TW094127405A 2004-08-16 2005-08-12 A highly resilient cantilever spring probe for testing ICs TW200608024A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/919,836 US6956389B1 (en) 2004-08-16 2004-08-16 Highly resilient cantilever spring probe for testing ICs

Publications (1)

Publication Number Publication Date
TW200608024A true TW200608024A (en) 2006-03-01

Family

ID=35066157

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127405A TW200608024A (en) 2004-08-16 2005-08-12 A highly resilient cantilever spring probe for testing ICs

Country Status (6)

Country Link
US (3) US6956389B1 (en)
JP (1) JP2008510166A (en)
KR (1) KR20070041581A (en)
CN (1) CN101014865A (en)
TW (1) TW200608024A (en)
WO (1) WO2006023380A1 (en)

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US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US8330485B2 (en) * 2004-10-21 2012-12-11 Palo Alto Research Center Incorporated Curved spring structure with downturned tip
US7230440B2 (en) * 2004-10-21 2007-06-12 Palo Alto Research Center Incorporated Curved spring structure with elongated section located under cantilevered section
US7564172B1 (en) * 2005-08-03 2009-07-21 Kolo Technologies, Inc. Micro-electro-mechanical transducer having embedded springs
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
JP5232382B2 (en) * 2005-12-06 2013-07-10 株式会社エンプラス Probe tip and probe card
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7384277B1 (en) * 2006-12-17 2008-06-10 Formfactor, Inc. Reinforced contact elements
JP5147227B2 (en) * 2006-12-19 2013-02-20 株式会社日本マイクロニクス How to use the electrical connection device
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
JP2008268145A (en) * 2007-04-25 2008-11-06 Micronics Japan Co Ltd Probe assembly
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
CN102539849B (en) * 2012-01-12 2014-10-22 南京瑞尼特微电子有限公司 Microprobe array and manufacturing method thereof
US9086433B2 (en) 2012-12-19 2015-07-21 International Business Machines Corporation Rigid probe with compliant characteristics
JP6029535B2 (en) * 2013-05-27 2016-11-24 三菱電機株式会社 Contact probe
US9382960B2 (en) 2014-02-19 2016-07-05 Massachusetts Institute Of Technology Beam-based nonlinear spring
MY191065A (en) * 2016-06-28 2022-05-30 Nihon Micronics Kk Electrical connecting apparatus and contact
JP6737171B2 (en) 2016-12-28 2020-08-05 信越化学工業株式会社 Multi-cutting method for rare earth sintered magnets
US11156640B2 (en) * 2017-10-31 2021-10-26 Formfactor, Inc. MEMS probe card assembly having decoupled electrical and mechanical probe connections
IT201800001170A1 (en) * 2018-01-17 2019-07-17 Technoprobe Spa Cantilever-type measuring head and relative contact probe
CN114594373B (en) * 2022-05-11 2023-01-13 深圳市卓汉材料技术有限公司 Cantilever type probe and probe station for integrated circuit test
KR102532503B1 (en) * 2022-09-01 2023-05-17 주식회사 프로이천 Probe needle

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US5166774A (en) * 1990-10-05 1992-11-24 Motorola, Inc. Selectively releasing conductive runner and substrate assembly having non-planar areas
US5832601A (en) 1993-11-16 1998-11-10 Form Factor, Inc. Method of making temporary connections between electronic components
US6482013B2 (en) * 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
KR100202998B1 (en) * 1995-12-02 1999-06-15 남재우 Wafer probe card having a micro-tip and manufacturing method thereof
WO1997044676A1 (en) * 1996-05-17 1997-11-27 Formfactor, Inc. Microelectronic contact structure and method of making same
US5764072A (en) * 1996-12-20 1998-06-09 Probe Technology Dual contact probe assembly for testing integrated circuits
CA2572499A1 (en) 1997-04-04 1998-10-15 University Of Southern California Method for electrochemical fabrication including use of multiple structural and/or sacrificial materials
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US6414501B2 (en) * 1998-10-01 2002-07-02 Amst Co., Ltd. Micro cantilever style contact pin structure for wafer probing
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
US6218203B1 (en) * 1999-06-28 2001-04-17 Advantest Corp. Method of producing a contact structure
US6939474B2 (en) * 1999-07-30 2005-09-06 Formfactor, Inc. Method for forming microelectronic spring structures on a substrate
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US6250933B1 (en) * 2000-01-20 2001-06-26 Advantest Corp. Contact structure and production method thereof
US6625004B1 (en) * 2001-08-31 2003-09-23 Superconductor Technologies, Inc. Electrostatic actuators with intrinsic stress gradient
US7649145B2 (en) * 2004-06-18 2010-01-19 Micron Technology, Inc. Compliant spring contact structures

Also Published As

Publication number Publication date
US20060033521A1 (en) 2006-02-16
KR20070041581A (en) 2007-04-18
US7061262B2 (en) 2006-06-13
WO2006023380A1 (en) 2006-03-02
CN101014865A (en) 2007-08-08
US6956389B1 (en) 2005-10-18
JP2008510166A (en) 2008-04-03
US20060033520A1 (en) 2006-02-16

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