TW200604479A - Heat treatment apparatus - Google Patents

Heat treatment apparatus

Info

Publication number
TW200604479A
TW200604479A TW094120473A TW94120473A TW200604479A TW 200604479 A TW200604479 A TW 200604479A TW 094120473 A TW094120473 A TW 094120473A TW 94120473 A TW94120473 A TW 94120473A TW 200604479 A TW200604479 A TW 200604479A
Authority
TW
Taiwan
Prior art keywords
heat treatment
base plate
produced
treatment device
produced gas
Prior art date
Application number
TW094120473A
Other languages
Chinese (zh)
Other versions
TWI275762B (en
Inventor
Masao Yasaka
Original Assignee
Espec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espec Corp filed Critical Espec Corp
Publication of TW200604479A publication Critical patent/TW200604479A/en
Application granted granted Critical
Publication of TWI275762B publication Critical patent/TWI275762B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exhaust Gas Treatment By Means Of Catalyst (AREA)
  • Furnace Details (AREA)
  • Waste-Gas Treatment And Other Accessory Devices For Furnaces (AREA)

Abstract

To provide a heat treatment device of a comparatively simple configuration, and inhibiting the production of so-called sublimate produced when a produced gas generated in accompany with the heat treatment of a base plate is cooled. This heat treatment device 1 has an air adjusting part 11 comprising a hot water supplying means 14 for allowing a base plate treatment part 5 to supply the hot air, and a heat treatment chamber 12 for heat treatment of the base plate. The heat treatment device 1 is provided with a catalyst wall 40 holding a catalyst promoting oxidative dissolution of the produced gas generated at a downstreammost side of the heat treatment chamber 12 in treating the base plate. Thus the production of the so-called sublimate produced when the produced gas is cooled, can be remarkably reduced in this heat treatment device 1. Further, as the reaction heat is generated in oxidative dissolution of the produced gas, the consumption of electric power for heating a mixed gas in the heat treatment can be reduced.
TW094120473A 2004-06-30 2005-06-20 Heat treatment apparatus TWI275762B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004194242A JP2006017357A (en) 2004-06-30 2004-06-30 Heat treatment device

Publications (2)

Publication Number Publication Date
TW200604479A true TW200604479A (en) 2006-02-01
TWI275762B TWI275762B (en) 2007-03-11

Family

ID=35791810

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094120473A TWI275762B (en) 2004-06-30 2005-06-20 Heat treatment apparatus

Country Status (4)

Country Link
JP (1) JP2006017357A (en)
KR (1) KR101184570B1 (en)
CN (1) CN100573011C (en)
TW (1) TWI275762B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643283B (en) * 2015-07-29 2018-12-01 日商東京威力科創股份有限公司 Substrate processing apparatus, substrate processing method, maintenance method of substrate processing apparatus, and recording medium

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5107528B2 (en) * 2006-04-24 2012-12-26 光洋サーモシステム株式会社 Exhaust gas treatment unit
JP4291832B2 (en) * 2006-06-23 2009-07-08 株式会社フューチャービジョン Air supply and exhaust system for substrate firing furnace
JP4372806B2 (en) * 2006-07-13 2009-11-25 エスペック株式会社 Heat treatment equipment
JP4273145B2 (en) * 2006-09-13 2009-06-03 エスペック株式会社 Heat treatment equipment
WO2008038880A1 (en) * 2006-09-28 2008-04-03 Korea Pionics Co., Ltd. Annealing apparatus
JP5015541B2 (en) * 2006-10-07 2012-08-29 昭和鉄工株式会社 Heat treatment equipment
JP4630307B2 (en) * 2007-05-22 2011-02-09 エスペック株式会社 Heat treatment equipment
JP4589943B2 (en) * 2007-06-12 2010-12-01 エスペック株式会社 Heat treatment equipment
JP2009047351A (en) * 2007-08-20 2009-03-05 Tohoku Univ Circulation type substrate baking furnace
TW200934574A (en) * 2008-01-11 2009-08-16 Nikki Universal Co Ltd Catalyst for purifying discharge gas from heat-treatment furnace, method of purifying discharge gas from heat-treatment furnace with the catalyst, and method of preventing contamination of heat-treatment furnace
JP4331784B2 (en) * 2008-07-22 2009-09-16 株式会社フューチャービジョン Supply and exhaust method for substrate firing furnace
US20170032983A1 (en) * 2015-07-29 2017-02-02 Tokyo Electron Limited Substrate processing apparatus, substrate processing method, maintenance method of substrate processing apparatus, and storage medium

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61174464A (en) * 1985-01-23 1986-08-06 京都機械株式会社 Apparatus for heat treatment of fabric
JPS6399492A (en) * 1986-10-14 1988-04-30 株式会社村田製作所 Exhaust gas treater
JPH087656Y2 (en) * 1989-08-15 1996-03-04 千住金属工業株式会社 Reflow furnace
US5282880A (en) * 1992-09-15 1994-02-01 Olson Larry K Low pressure plasma metal extraction
JPH11197517A (en) * 1998-01-08 1999-07-27 Honda Motor Co Ltd Metallic carrier for catalyst
JP3696505B2 (en) * 2000-12-15 2005-09-21 光洋サーモシステム株式会社 Heat treatment apparatus and heat treatment method
JP2003214772A (en) * 2002-01-21 2003-07-30 Ngk Insulators Ltd Heating furnace
JP2003247706A (en) * 2002-02-26 2003-09-05 Japan Steel Works Ltd:The Combustion method for organic waste and its device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI643283B (en) * 2015-07-29 2018-12-01 日商東京威力科創股份有限公司 Substrate processing apparatus, substrate processing method, maintenance method of substrate processing apparatus, and recording medium

Also Published As

Publication number Publication date
KR101184570B1 (en) 2012-09-21
KR20060048613A (en) 2006-05-18
CN100573011C (en) 2009-12-23
JP2006017357A (en) 2006-01-19
CN1737478A (en) 2006-02-22
TWI275762B (en) 2007-03-11

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees