TW200624746A - Heat treatment apparatus - Google Patents

Heat treatment apparatus

Info

Publication number
TW200624746A
TW200624746A TW094121449A TW94121449A TW200624746A TW 200624746 A TW200624746 A TW 200624746A TW 094121449 A TW094121449 A TW 094121449A TW 94121449 A TW94121449 A TW 94121449A TW 200624746 A TW200624746 A TW 200624746A
Authority
TW
Taiwan
Prior art keywords
heat treatment
gondola
treatment apparatus
hot blast
loaded
Prior art date
Application number
TW094121449A
Other languages
Chinese (zh)
Other versions
TWI279513B (en
Inventor
Ikuo Kanamori
Tsutomu Hirata
Original Assignee
Espec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espec Corp filed Critical Espec Corp
Publication of TW200624746A publication Critical patent/TW200624746A/en
Application granted granted Critical
Publication of TWI279513B publication Critical patent/TWI279513B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Tunnel Furnaces (AREA)
  • Furnace Charging Or Discharging (AREA)
  • Furnace Details (AREA)

Abstract

To provide a heat treatment apparatus that can heat-treat densely loaded objects to be heated by reducing the intervals of loading stages where the objects to be heated are loaded. The heat treatment apparatus 1 has a heat treatment chamber 12 into which a hot blast generated by a hot blast supply means 14 for supplying a hot blast is introduced. The heat treatment chamber 12 incorporates a substrate reload system 54 comprising a gondola 55, guide rails 71 and support means 90. The gondola 55 is a stack of loading stages 56 where substrates are loaded, in the region of a gondola frame 70. The support means 90 can support the loading stages 56 independently of vertical motion of the gondola 55. In a substrate reload action of the heat treatment apparatus 1, on condition that rotary shafts 91 are rotated to move support pieces 93 under a predetermined loading stage 56, the gondola 55 is lowered to perform an interval expansion action of expanding the interval between the predetermined loading stage 56 and the loading stage 56 above.
TW094121449A 2004-06-28 2005-06-27 Heat treatment apparatus TWI279513B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004189308 2004-06-28

Publications (2)

Publication Number Publication Date
TW200624746A true TW200624746A (en) 2006-07-16
TWI279513B TWI279513B (en) 2007-04-21

Family

ID=37149886

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094121449A TWI279513B (en) 2004-06-28 2005-06-27 Heat treatment apparatus

Country Status (2)

Country Link
KR (1) KR101200291B1 (en)
TW (1) TWI279513B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103155119A (en) * 2010-08-31 2013-06-12 泰拉半导体株式会社 Batch type substrate processing device
TWI505864B (en) * 2013-12-05 2015-11-01 Metal Ind Res & Dev Ct Material collection device of heat treatment apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101484734B1 (en) * 2013-10-25 2015-01-20 주식회사 이엔씨 테크놀로지 Heat treatment device and the Heat treatment Method for flat display panel
KR102075273B1 (en) * 2018-11-28 2020-02-07 주식회사 동아엠씨 FPCB manufacturing apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3851784B2 (en) * 2001-03-12 2006-11-29 エスペック株式会社 Multi-stage heating plate heat treatment equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103155119A (en) * 2010-08-31 2013-06-12 泰拉半导体株式会社 Batch type substrate processing device
TWI505864B (en) * 2013-12-05 2015-11-01 Metal Ind Res & Dev Ct Material collection device of heat treatment apparatus

Also Published As

Publication number Publication date
TWI279513B (en) 2007-04-21
KR101200291B1 (en) 2012-11-13
KR20060048612A (en) 2006-05-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees