TW200604130A - Thick-film dielectric and conductive compositions - Google Patents

Thick-film dielectric and conductive compositions

Info

Publication number
TW200604130A
TW200604130A TW094107955A TW94107955A TW200604130A TW 200604130 A TW200604130 A TW 200604130A TW 094107955 A TW094107955 A TW 094107955A TW 94107955 A TW94107955 A TW 94107955A TW 200604130 A TW200604130 A TW 200604130A
Authority
TW
Taiwan
Prior art keywords
thick
paste compositions
film dielectric
conductive compositions
powder
Prior art date
Application number
TW094107955A
Other languages
English (en)
Chinese (zh)
Inventor
William J Borland
Alton Bruce Jones Iii
Olga L Renovales
Kenneth Warren Hang
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/801,326 external-priority patent/US20050204864A1/en
Priority claimed from US10/801,257 external-priority patent/US7688569B2/en
Application filed by Du Pont filed Critical Du Pont
Publication of TW200604130A publication Critical patent/TW200604130A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B43—WRITING OR DRAWING IMPLEMENTS; BUREAU ACCESSORIES
    • B43M—BUREAU ACCESSORIES NOT OTHERWISE PROVIDED FOR
    • B43M15/00—Drawing-pins, Thumb-tacks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
    • H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
    • H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors 
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Ceramic Capacitors (AREA)
  • Conductive Materials (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094107955A 2004-03-16 2005-03-16 Thick-film dielectric and conductive compositions TW200604130A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/801,326 US20050204864A1 (en) 2004-03-16 2004-03-16 Thick-film dielectric and conductive compositions
US10/801,257 US7688569B2 (en) 2004-03-16 2004-03-16 Thick-film dielectric and conductive compositions

Publications (1)

Publication Number Publication Date
TW200604130A true TW200604130A (en) 2006-02-01

Family

ID=34841282

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107955A TW200604130A (en) 2004-03-16 2005-03-16 Thick-film dielectric and conductive compositions

Country Status (5)

Country Link
EP (1) EP1578179A3 (fr)
JP (1) JP2005303282A (fr)
KR (2) KR100713758B1 (fr)
CN (1) CN1674761A (fr)
TW (1) TW200604130A (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1578179A3 (fr) 2004-03-16 2006-05-03 E.I. du Pont de Nemours and Company Film épais diélectrique et composition conductrice
US7531416B2 (en) 2005-12-21 2009-05-12 E. I. Du Pont De Nemours And Company Thick film capacitors on ceramic interconnect substrates
US20080010798A1 (en) * 2006-07-14 2008-01-17 Borland William J Thin film dielectrics with co-fired electrodes for capacitors and methods of making thereof
CN104112487A (zh) * 2013-04-18 2014-10-22 上海市灿晶电子材料有限公司 一种导电铜浆料及其制备方法和应用
JP6804255B2 (ja) 2015-12-15 2020-12-23 三星エスディアイ株式会社Samsung SDI Co., Ltd. 電極形成用組成物ならびにこれを用いて製造された電極および太陽電池

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4158219A (en) * 1977-11-01 1979-06-12 University Of Illinois Foundation Heterophasic ceramic capacitor
DE2923981A1 (de) * 1979-03-26 1980-10-09 Univ Illinois Keramikmasse mit heterogener phase
FR2520729B1 (fr) * 1982-02-02 1986-01-31 Europ Composants Electron Composition ceramique dielectrique a base de titanate de baryum, d'oxyde de lithium et de fluorure de zinc, condensateur utilisant une telle composition et procede de fabrication de ladite composition
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4514321A (en) * 1983-08-25 1985-04-30 E. I. Du Pont De Nemours And Company Thick film conductor compositions
JPS61111957A (ja) * 1984-11-02 1986-05-30 堺化学工業株式会社 セラミック誘電体の製造方法
JPS61232260A (ja) * 1985-04-05 1986-10-16 旭化成株式会社 誘電体磁器組成物
JP2518839B2 (ja) * 1987-03-20 1996-07-31 富士通株式会社 導体ペ−スト組成物
JP2682022B2 (ja) * 1987-07-02 1997-11-26 株式会社村田製作所 強誘電性磁器組成物及びそれを利用した圧電素子
JP2570662B2 (ja) * 1989-01-26 1997-01-08 株式会社村田製作所 強誘電性磁器体
JP2504176B2 (ja) * 1989-04-04 1996-06-05 株式会社村田製作所 鉛酸化物含有強誘電性磁器組成物およびそれを利用した圧電素子
JPH03221448A (ja) * 1990-01-26 1991-09-30 Hitachi Chem Co Ltd 高誘電率銅張積層板の製造方法
US5155072A (en) * 1990-06-29 1992-10-13 E. I. Du Pont De Nemours And Company High K dielectric compositions with fine grain size
JP3326513B2 (ja) * 1994-10-19 2002-09-24 ティーディーケイ株式会社 積層型セラミックチップコンデンサ
JPH08125302A (ja) * 1994-10-20 1996-05-17 Hokuriku Electric Ind Co Ltd コンデンサ付き回路基板及び該回路基板を用いた多層回路基板
JP3206496B2 (ja) * 1997-06-02 2001-09-10 昭栄化学工業株式会社 金属粉末及びその製造方法
US6608760B2 (en) 1998-05-04 2003-08-19 Tpl, Inc. Dielectric material including particulate filler
US6317023B1 (en) * 1999-10-15 2001-11-13 E. I. Du Pont De Nemours And Company Method to embed passive components
JP2002356619A (ja) 2001-05-29 2002-12-13 Nippon Paint Co Ltd 熱硬化性複合誘電体フィルム及びその製造方法
US6847527B2 (en) * 2001-08-24 2005-01-25 3M Innovative Properties Company Interconnect module with reduced power distribution impedance
EP1578179A3 (fr) * 2004-03-16 2006-05-03 E.I. du Pont de Nemours and Company Film épais diélectrique et composition conductrice

Also Published As

Publication number Publication date
KR20060126861A (ko) 2006-12-11
EP1578179A2 (fr) 2005-09-21
CN1674761A (zh) 2005-09-28
KR100803499B1 (ko) 2008-02-14
KR20060043683A (ko) 2006-05-15
KR100713758B1 (ko) 2007-05-04
JP2005303282A (ja) 2005-10-27
EP1578179A3 (fr) 2006-05-03

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