TW200603705A - Wiring board and method for producing the same - Google Patents

Wiring board and method for producing the same

Info

Publication number
TW200603705A
TW200603705A TW094112998A TW94112998A TW200603705A TW 200603705 A TW200603705 A TW 200603705A TW 094112998 A TW094112998 A TW 094112998A TW 94112998 A TW94112998 A TW 94112998A TW 200603705 A TW200603705 A TW 200603705A
Authority
TW
Taiwan
Prior art keywords
substrate
wiring board
producing
same
protruding
Prior art date
Application number
TW094112998A
Other languages
English (en)
Other versions
TWI290816B (en
Inventor
Yasuo Fukuhara
Kenji Ogasawara
Tomoaki Watanabe
Keiko Kashihara
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of TW200603705A publication Critical patent/TW200603705A/zh
Application granted granted Critical
Publication of TWI290816B publication Critical patent/TWI290816B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
TW94112998A 2004-04-23 2005-04-22 Wiring board and method for producing the same TWI290816B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004128847 2004-04-23

Publications (2)

Publication Number Publication Date
TW200603705A true TW200603705A (en) 2006-01-16
TWI290816B TWI290816B (en) 2007-12-01

Family

ID=35197400

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94112998A TWI290816B (en) 2004-04-23 2005-04-22 Wiring board and method for producing the same

Country Status (3)

Country Link
JP (1) JPWO2005104638A1 (zh)
TW (1) TWI290816B (zh)
WO (1) WO2005104638A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601202B (zh) * 2011-12-27 2017-10-01 Shibaura Mechatronics Corp Substrate processing apparatus and processing method
TWI616127B (zh) * 2013-03-13 2018-02-21 味之素股份有限公司 多層印刷配線板的製造方法及使用於其之含有載體金屬箔的預浸料之複合材
TWI645755B (zh) * 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4839982B2 (ja) * 2006-06-27 2011-12-21 パナソニック電工株式会社 フレキシブルリジット配線板の製造方法
US8409704B2 (en) 2007-01-25 2013-04-02 Panasonic Corporation Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board
JP5100429B2 (ja) * 2008-02-08 2012-12-19 古河電気工業株式会社 多層プリント配線板の製造方法
US8240036B2 (en) 2008-04-30 2012-08-14 Panasonic Corporation Method of producing a circuit board
US8272126B2 (en) 2008-04-30 2012-09-25 Panasonic Corporation Method of producing circuit board
WO2009133969A2 (en) * 2008-04-30 2009-11-05 Panasonic Electric Works Co., Ltd. Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the method
US9082438B2 (en) 2008-12-02 2015-07-14 Panasonic Corporation Three-dimensional structure for wiring formation
US8698003B2 (en) 2008-12-02 2014-04-15 Panasonic Corporation Method of producing circuit board, and circuit board obtained using the manufacturing method
CN102598883A (zh) 2009-10-30 2012-07-18 松下电器产业株式会社 电路板以及在电路板上安装有元件的半导体装置
US9332642B2 (en) 2009-10-30 2016-05-03 Panasonic Corporation Circuit board
JP2015012082A (ja) * 2013-06-27 2015-01-19 京セラ株式会社 配線基板およびこれを用いた実装構造体
JP6389782B2 (ja) * 2014-03-13 2018-09-12 積水化学工業株式会社 多層絶縁フィルム、多層基板の製造方法及び多層基板
WO2017022807A1 (ja) * 2015-08-03 2017-02-09 Ｊｘ金属株式会社 プリント配線板の製造方法、表面処理銅箔、積層体、プリント配線板、半導体パッケージ及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267840A (ja) * 1992-03-19 1993-10-15 Ibiden Co Ltd アディティブプリント配線板用接着層の形成方法
JPH07226575A (ja) * 1994-02-14 1995-08-22 Hitachi Chem Co Ltd プリント配線板の製造法
JPH1174643A (ja) * 1997-08-28 1999-03-16 Fuji Photo Film Co Ltd 多層配線基板の製造方法及び画像形成方法並びにこれらの方法に用いられる転写シート
JP3941271B2 (ja) * 1998-11-27 2007-07-04 三菱電機株式会社 プリント配線板の製造方法およびプリント配線板
JP2003246843A (ja) * 2002-02-26 2003-09-05 Mitsubishi Gas Chem Co Inc 硬化性樹脂組成物。

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601202B (zh) * 2011-12-27 2017-10-01 Shibaura Mechatronics Corp Substrate processing apparatus and processing method
TWI616127B (zh) * 2013-03-13 2018-02-21 味之素股份有限公司 多層印刷配線板的製造方法及使用於其之含有載體金屬箔的預浸料之複合材
TWI645755B (zh) * 2013-07-24 2018-12-21 Ｊｘ日鑛日石金屬股份有限公司 Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper-clad laminate, and printed wiring board manufacturing method
US10257938B2 (en) 2013-07-24 2019-04-09 Jx Nippon Mining & Metals Corporation Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board

Also Published As

Publication number Publication date
JPWO2005104638A1 (ja) 2008-03-13
TWI290816B (en) 2007-12-01
WO2005104638A1 (ja) 2005-11-03

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