TW200602519A - Electrolytic plating apparatus - Google Patents

Electrolytic plating apparatus

Info

Publication number
TW200602519A
TW200602519A TW093135074A TW93135074A TW200602519A TW 200602519 A TW200602519 A TW 200602519A TW 093135074 A TW093135074 A TW 093135074A TW 93135074 A TW93135074 A TW 93135074A TW 200602519 A TW200602519 A TW 200602519A
Authority
TW
Taiwan
Prior art keywords
plating
wafer
electrolytic plating
intermediate layer
opening
Prior art date
Application number
TW093135074A
Other languages
Chinese (zh)
Inventor
Yuji Uchiumii
Original Assignee
Electroplating Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Eng filed Critical Electroplating Eng
Publication of TW200602519A publication Critical patent/TW200602519A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Abstract

To provide a technology facilitating a plating treatment of a uniform thickness even in an electrolytic plating treatment of a wafer, which requires extremely strict uniformity in a plating thickness. An electrolytic plating apparatus comprising: a cup-like plating tank having an opening on which disposed are cathode electrodes which make contact with a periphery of a wafer; and an anode electrode disposed in the plating tank in a manner opposed to the wafer placed on the opening, a plating solution is supplied into the plating tank to be contacted with the wafer, and plating current is applied to the wafer to conduct a plating treatment on the surface of the wafer, wherein the anode electrode consists of a titanium-made electrode substrate; a platinum coating as an intermediate layer applied on the substrate; and an iridium oxide coating applied on the surface of the intermediate layer.
TW093135074A 2004-07-08 2004-11-16 Electrolytic plating apparatus TW200602519A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004201769A JP2006022379A (en) 2004-07-08 2004-07-08 Electrolytic plating apparatus

Publications (1)

Publication Number Publication Date
TW200602519A true TW200602519A (en) 2006-01-16

Family

ID=35795867

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135074A TW200602519A (en) 2004-07-08 2004-11-16 Electrolytic plating apparatus

Country Status (4)

Country Link
JP (1) JP2006022379A (en)
KR (1) KR20060004594A (en)
CN (1) CN1718868A (en)
TW (1) TW200602519A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007263674A (en) * 2006-03-28 2007-10-11 Nippon Steel Corp Crack detection sensor
JP4976120B2 (en) 2006-06-14 2012-07-18 日本エレクトロプレイテイング・エンジニヤース株式会社 Wafer plating method
KR100900829B1 (en) * 2006-11-06 2009-06-04 이광우 Assistance anode for plating of vehicles wheel
KR100966664B1 (en) * 2007-10-11 2010-06-29 이광우 Assistance anode for plating of vehicles wheel
JP5134339B2 (en) 2007-11-02 2013-01-30 ルネサスエレクトロニクス株式会社 Manufacturing method of semiconductor integrated circuit device
CN114351179A (en) * 2021-12-02 2022-04-15 江苏友诺环保科技有限公司 Iridium tantalum manganese coating titanium anode plate with intermediate layer and preparation method thereof

Also Published As

Publication number Publication date
KR20060004594A (en) 2006-01-12
CN1718868A (en) 2006-01-11
JP2006022379A (en) 2006-01-26

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