TW200539314A - Substrate carrying device and substrate processing device having the same - Google Patents

Abstract

A substrate carrying device is provided for carrying a substrate even in a high-temperature state such that the entire tact time can be decreased. A chuck 20 and a horizontal driving mechanism 21 are installed in an unloading chamber 13 of a substrate processing device 10. The chuck 20 chucks a substrate W loaded on a tray 17 and carries it towards a recycle tray 18. The horizontal driving mechanism 21 drives the chuck 20. A plate 30 and an elevator 31 that drives the plate 30 are disposed in the unloading chamber 13. In a case when the chuck 20 is going to chuck the substrate W, the plate 30 vertically moves the substrate W on the tray 17 to chuck the W.

Description

20053 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a substrate conveying device and a substrate processing device having the same. , '[Prior art]

Semiconductor substrates and glass substrates are processed through multiple processes to form products. As a method for shortening the overall manufacturing time, the substrate is recovered as soon as possible in order to immediately transfer the substrate that has completed one process to the next process. For example, a solar cell panel in which an amorphous silicon film is formed on a glass substrate is subjected to scribing after film formation, but the panel after the film formation process is at a high temperature. In the conventional technique, a vacuum chuck system is used to adsorb the panel by an adsorption portion made of synthetic resin, and the panel is held and transported. The conventional vacuum chuck method uses a synthetic resin adsorption section, so it cannot be held or transported while the panel is at a high temperature, and it takes time to cool the panel on the tray after the process is completed. As a result, the flow of the panels that are sequentially processed continuously is stagnated, and the tact time of the entire production process cannot be shortened. [Summary of the Invention] The present invention provides a substrate transporting device, which is a substrate transporting device that transports a substrate placed on a processing tray and in a high temperature state to a next recovery tray, which includes: The substrate on the processing tray is processed into a holding member made of a thermal material held by the T. The substrate on the processing tray is transferred from the processing tray to the holding member. I Turn 5 20053 ft3sif4 > c Transfer the substrate held by the moving sheet of the tray when the mobile unit is moved to the above-mentioned substrate conveying device on the first member on the recovery tray, and the through-hole soil provided on the tray The unit includes a structure in which the processing hole is reduced from the second through the through hole, and the second holding member on the back surface of the substrate is lifted through the processing tray. And == 出;, the substrate is transferred to the second liter of Baoxing lifting ^ t, including the tray loading into the tray II = can be recovered by the second lifting member:: Baniuhan is held on the holding member The substrate is moved to a collection tray and transferred to a collection tray. ^ In the above-mentioned substrate conveying device, the processing tray is partially separated and placed; the first transfer unit has a through-processing tray and is lifted Γ a lifting member 'lifts the main body on which the processing tray is placed by the first lifting member After the back end of the mounting member is joined with the holding member, the first! The lifting member is lowered, and the mounting structure is transferred to the holding member together with the substrate. In addition, the second transfer unit includes a second lifting member for lifting and lowering the recovery tray, and the second lifting member for lifting and lowering the recovery tray ′ and a holding member that is held on the holding member and moved to the recovery tray is transferred to the substrate together with the substrate. Composition on the recycling tray. In the substrate transfer apparatus described above, a cooling unit may be provided on the collection tray to cool the substrate transferred from the processing tray. 6 20053iS3plf4c The present invention also provides a substrate processing apparatus including a storage chamber for storing a processing tray for placing a substrate in a high temperature state, and the above-mentioned substrate transporting device. According to the present invention, even if the substrate is in a high-temperature state, the substrate on the processing tray is transferred to the substrate for recycling, because it is a simple member formed of a heat-resistant material. Therefore, the substrate can be transferred in a convenient manner, and Reduce the overall production time (tacttime) of the production process. ▲ In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the preferred embodiments are described below in detail with the accompanying drawings as follows. [Embodiment] Next, a substrate transfer apparatus and a substrate processing apparatus according to an embodiment of the present invention will be described with reference to Figs. 1 to 5. (First Embodiment) FIG. 1 is a diagram showing a schematic overall configuration of a substrate processing apparatus having a substrate transfer apparatus according to a first embodiment of the present invention. Fig. 2 is a perspective view of a chuck portion provided in the substrate transfer apparatus according to the first embodiment. Fig. 3 (a) to Fig. 3 (i) are schematic configuration diagrams of the configuration of a substrate transfer apparatus according to the first embodiment. The substrate processing apparatus 10 includes a loading chamber u, a processing chamber 12, an unloading chamber 13, and a recycling station 14. In the loading chamber u, a gate G1 is provided facing the outside. A gate G2 is provided at the boundary of the loading chamber 11 and the processing chamber 12, and a gate G3 is provided at the boundary of the processing chamber 12 and the unloading chamber 13. In the unloading chamber 13, A gate G4 is provided facing the recycling station 14. The gates G1 to G4 are configured to be individually switchable. In addition, the recycling station 14 may not constitute a chamber, but may only be used. Of the eight rules u, the processing chamber 12, the unloading chamber 13, and the recycling station 14, two: trays 15, 16, 17 and a recycling tray for placing the substrate w

, = 15, 16, and 17 are flat plates of the same shape in which a plurality of substrates w are arranged in a plurality of rows and I ′ are placed, but only on the tray 17, a plurality of permanent posts 17 a are formed by perforation of the roots. A flat plate on which a plurality of substrates W in one row or one column are placed. The substrate W 2 uses, for example, a non-crystalline Lai F cell panel, and a nitride stone film is formed on the surface of the plate in the processing chamber 12 as an anti-reflection film. Normally, solar cell panels are heated to about 300 ~ 500T using parallel flat plate plasma CVD (chemical vapor deposition). In the unloading chamber 13, a chuck portion 20 and a lifting plate 30 are housed, and a horizontal driving mechanism 21 for driving the missing plate portion 20 and a lifter for lifting the lifting plate 30 are provided; The chuck section 20 uses the horizontal drive mechanism 21 to perform a left-right reciprocating motion in the figure. When the substrate W on the tray 17 is moved toward the recycling tray for transportation, it enters the recycling station 14 through the gate G4. Off = The structure of the chuck section 20 will be described later. The elevating plate 30 uses the elevating mechanism 31 to move up and down in the figure. On the upper plate 30, a plurality of pins 30a and a plurality of bethle holes 17a of the tray 17 are inserted in a combined position. In the recycling station 1 *, a lifting mechanism 32 for raising and lowering the recycling tray 18 is provided. In the recycling station 14, a box portion 40 that receives the substrate W from the recycling tray 18 and stores it is stored.

200539314 i 6226pif.doc The structure of the central disk unit 20 will be described with reference to FIG. 2. The chuck portion 20 is a tube having a rectangular cross-section and both ends are open, and the center portion of the chuck portion 20 is cut out. The end portion 20a is a portion that comes into contact with both ends of the substrate w and is held to prevent the substrate W from descending. Hereinafter, the operation of the chuck portion 20 to hold the substrate w is referred to as chucking. In the illustration, the distance yi is set to be shorter than the size of the substrate W, the distance y2 is set to be longer than the size of the substrate, and the distance yl is set to be wider than the width of the recovery tray 18 (and Figure 丨 the paper surface is vertical). The size of the chuck portion 20 in the longitudinal direction (xs direction) is determined by the size of the substrate ... and the number of pieces to be clamped. Since the chuck portion 20 is formed in the shape shown in FIG. 2, it does not contact the upper surface of the substrate W and is not damaged when it is tight. In addition, during clamping, 2 forms are formed to cover the upper surface of the substrate w, so that dust can be prevented from being caught. The chuck portion 20 is made of metal and ceramics and has heat resistance. Since the chuck portion 20 is made of a metal or a substrate, the substrate can be immediately clamped and transported. Therefore, the length of the inter-substrate door m of the substrate processing apparatus 1G according to this embodiment will be shortened. The unprocessed substrate w is transferred from the outside to the processing chamber m11, and the material is heated to a predetermined temperature through the gate. The substrate W bundled in a cup-like shape is transferred to the unloading chamber Π 7 through the gate G 3. At this stage, the substrate rises to a high temperature state. 9 200539314 16226pif.doc The substrate W after the film formation process is clamped by the chuck section 20, and is transferred from the tray 17 of the unloading chamber 13 to the recycling tray 18 of the recycling station 14. In addition, the substrate W after the film formation process is transferred from the recovery tray a to the box portion 40 and is stored in the box portion 40. This conveyance process will be described in detail with reference to Fig. 3 (a) to Fig. 3 (0). Figs. 3 (a) to 3 (C) show the inside of the unloading chamber 13, and Fig. 3 (d) Figures 3 (f) and 3 (g) to 3 (i) show the inside of the recycling station 14. Figure 3 (a) shows the tray 17 and the chuck section 20 on which the substrate w is placed. Figure 3 (b) is a plan view of the positional relationship, and Figure 3 (b) is a cross-section view of Figure 3 (a), and Figure 3 (c) is a cross-sectional view of Figure 1 (a). Figure 3 (d) shows the load A plan view of the positional relationship between the recovery tray 18 on the substrate W and the chuck portion 20 is shown in FIG. 3 (0 is a π-m sectional view of FIG. 3 (d), and FIG. 3 (f) is IV_IV of FIG. 3 (d) Sectional view. Fig. 3 (g) is a plan view showing the positional relationship between the recovery tray 18 on which the substrate is placed and the box portion 40, and Fig. 3 (h) is a V_V cross-sectional view of Fig. 3 (g), and Fig. 3 ( i) is a sectional view of% _% in Fig. 3 (g). As shown in the plan view of Fig. 3 (a), the substrates w are arranged on the tray 17 in units of three pieces. In the initial state, the clamps are made in advance. The plate portion is retracted from above the tray portion 17. First, as shown in FIG. 3 (b) and FIG. 3 (c), the lifting plate is raised and the tip of the pin 30a passes through the top of the through hole. It is in contact with the back surfaces of the three substrates w, and the substrate w is spaced a distance from the surface of the tray 17. The chuck portion 20 is slid along the surface of the substrate w in the direction XI in FIG. 3 (a). , And the three substrates w are located inside the chuck part and close to the end part 20a. By lowering the lifting plate spell, the knot 200539314 16226pif.doc

The bundle substrate W is clamped. Next, as shown in FIG. 3 (d), FIG. 3 (e), and FIG. 3 (f), the chuck portion 20 that clamps the three substrates W is moved above the recovery unit 18. The lifting tray 32 is used to lift the recovery tray 18 from When the setting position is raised. Although the upper surface of the recovery tray 18 passes through the central opening under the chuck portion 20, the back surface of the fish plate W abuts, and the substrate W is pushed up only a predetermined distance f to form an end portion of the refreshing plate portion 20 by the moon substrate substrate W Shi separated and J'3 state. In this state, the chuck portion 20 is moved along the χ2 direction in Fig. 3 (d), separated from the three substrates W, and returned to the initial position. With the mechanism 32, the collection tray 18 is lowered and returned to the set position. In the process of the machine, the transfer of the substrate w from the tray 17 to the recovery tray 18 is completed. As shown in FIG. 3 (a), the chuck portion 20 returned to the initial position is shifted upward by 1 ° from the opening angle, and then moves along the X4 direction. Move and prepare for the next substrate ^ transfer. Next, the substrate w transferred to the collection tray 18 is transferred to each section 4.

in. As shown in FIGS. 3 (g), 3 (i), and 3 (i), the recovery tray 18 is moved in the direction of the box portion 40, that is, in the direction of χ3 in FIG. 3 (g), and is internally formed into each layer of the box portion 40 in multiple layers. , So that the substrate w is housed in the opening > At this time, the box portion 40 is intermittently moved in the z direction in Fig. 3 (h). This restorative moving distance is the step interval of the box portion 40. In addition, even if the collection tray 18 is intermittently moved upward and the box section 40 is moved back and forth in the left-right direction, the substrate w can be stored in the box section 40. = These series of conveying processes are repeated in sequence 'so that the base portion on the tray 17 is stored in the box portion 40.

200539314 16226pif.doc but agency 19. = 4 trays 1 ^ is provided with a cooling substrate ^ ^ for cooling the substrate W, and the substrate W formed into a film and a heat treatment is formed into a 1821 process. By providing the cooling mechanism 19, the collection tray can be added quickly and the soil plate can be quickly cooled, so that the substrate can be moved to two in a short time. 40 into the storage. As the cooling mechanism 9, it is possible to use cooling water circulation, cold air supply, and the like. Since the substrate conveying device of this embodiment uses a clip made of a thermally-conductive material, 20, the substrate W is mechanically clamped (held), so that even a substrate having a high temperature can be immediately conveyed, and the production time can be shortened. In addition, by providing a cooling mechanism 19 for cooling the substrate W on the recovery tray 18, even a substrate having a high temperature can be immediately cooled, so that the production time can be further reduced. In addition, since the chuck 20, the horizontal drive mechanism 21, the lifting plate 30, and the lifting mechanism 31 are provided in the unloading chamber 13, no new space for the substrate conveying device is required, and the substrate processing device 10 is not increased in size. , Can handle and transport substrates with a simple structure. In this embodiment, the substrate transfer device is constituted by the chuck section 20, the horizontal drive mechanism 21, the lifting plate 30, and the lifting mechanisms 31 and 32. (Second Embodiment) Figs. 4 (a) to 4 (i) are schematic partial configuration diagrams showing the configuration of a substrate transfer apparatus according to a second embodiment of the present invention. The configuration of the substrate processing apparatus having the substrate transfer apparatus of this embodiment is basically the same as that described in the first embodiment, so only the differences will be described. In addition, since the chuck section, the horizontal driving mechanism, and the lifting mechanism are also the same as those of the plate conveying device according to the first embodiment 12 200539314 &

(, U) shows the situation in the unloading chamber 13, and Figure 4 ^^ 4 (^ Figure) ~ Figure Chuan) shows the general part 9r / 〆 brother of the recycling station. Fig. 4 / a) is a plan view showing the positional relationship between the tray 17 on which the substrate W is placed and the loss of Θ. Fig. 4 (b) is 1J-^ 'of Fig. 4 (a). Fig. 4 (C) is Fig. 4 (a) Sectional view of Π-Π. Fig. 4 (a) is a top view of the positional relationship between the recovery tray 18 and the chuck portion 20 on which the substrate W is placed. Fig. 4 (e) is a cross-sectional view of III-III in Fig. 4 (d). 4. Section IV-IV in Figure 4 (d). FIG. 4 (g) is a plan view showing the positional relationship between the mounting substrate w = recovery tray 18 and the box portion 40, and FIG. 4⑴

2 is a sectional view taken along the line V_V in FIG. 4 (g), and FIG. 4 (0 is a sectional view taken along the line VI-VI in FIG. 4 (g). Refer to FIGS. 4 (a) to 4 (i) for the description of the first embodiment. The structure is different. = First, the structure of the tray Η is different from that of the tray openings shown in FIGS. 3 to 2. As shown in FIGS. 4 (a), 4 (b), and 4 (c), the tray 117 A plurality of layered hole portions U7b 'having a two-layer structure are formed thereon, and a mounting member 117a for mounting the substrate W is detachably provided in each layered hole portion 117b. In addition, the lifting plate 130 is also 3 (a) to 3 (i). That is, a structure is adopted in which the upper surface of the lifting plate is brought into contact with the lower surface of the mounting member 117a, and the lifting plate 130 is raised and lowered.

The process of transporting the substrate W using the substrate processing apparatus configured as described above will be described. As shown in the plan view of FIG. 4 (a), the substrate W 13

2005393H is arranged on the tray 117 in units of 3 pieces. In the initial state, the chuck section 20 is retracted from above the tray section 117 in advance. First, as shown in FIGS. 4 (b) and 4 (c), when the lifting plate 13 is raised, the upper surface of the lifting plate abuts on the lower surface of the mounting member 117a, and the mounting member u7a is only pushed up to a predetermined level. distance. At this time, three substrates W are placed on the upper surface of the placing member U7a. As described in the first embodiment, the chuck portion 20 is slid along the surface of the substrate W in the direction of "a" in FIG. 4 (a), and the mounting member U7a on which the three substrates W are placed is moved by the chuck. The end 2 of the portion 20 is loosened. This loosening is the same as the method described in the embodiment. Even if the clamping of the substrate W is completed, the lifting plate 30 is not lowered. Next, as shown in FIG. As shown in 4 (d), FIG. 4 (e), and FIG. 4 (f), the chuck portion holding the mounting member U7a on which the three substrates W are placed is moved to the top of the collection tray: t 18 When the recovery tray 18 is raised from the set position by the lifting mechanism 32, the upper surface of the recovery tray 18 passes through the central opening of the lower portion of the chuck portion 20 and abuts the lower surface of the mounting member 117a, and pushes the mounting member 117a only A predetermined distance is thereby formed. As a result, the mounting member ㈣ forms a state in which three substrates W are placed apart from the end of the chuck section 20 and floated. In this state, the clamp The tray portion 20 slides in the direction x2 in FIG. 4 and is separated from the mounting member U7a. The lifting tray 32 is used to lower the recovery tray 18 and return to the set position. Through the above process, the transfer of the substrate w from the tray 117 to the recovery tray 18 is completed. The three substrates W are maintained in a state of being placed on the placing member 117a. Next, the placement is carried on the recovery tray 18 The 14 200539314 16226pif.doc substrate W on the member 117a is stored in the box portion 40. The surfaces of the three substrates W are exposed by disengaging the chuck portion 20 from the mounting member. The vacuum chuck is equipped with a suction portion 50. The three substrates are dropped from above the three substrates w .: After the vacuum suction is performed on the same day, the adsorption portion 5G is released from the mounting member 117a, w-4 (g), 4 (4), and 4 (4). As shown in the figure, the adsorption portion 50 where three substrates are vacuum-adsorbed is moved to the box portion 40, that is, to FIG. 4 (g).

The substrate W is housed in a form of "moving forward" and forming a plurality of layers of the box portion 4G inside. At this time, the box portion 40 is moved intermittently outside of FIG. 4, that is, in units of intervals of each layer. Separately, the suction part 50 of the empty chuck device is intermittently moved upwards to the left and right in the box part 40, and the substrate W can also be repeatedly moved to the tray 17 in a series. All of the transports ^^ are stored in the box portion 40. When the pan section 20 is moved to the plate w :: shipping row in FIG. 4 (a), the plate 18 is transported in the direction of χ4 again in the above series, and there will be a recovery process. That is, the substrate W on the U7a is slid with the vacuum chuck device after the cutting member 50 is converted to the suction section 50, which is made on the 117, and is moved to the 4G side of the box section. The disk chuck portion 20 returns to the placing member 117a on the receiving tray 18, returns I 2 to the initial position, and transfers the lower plate 130 to the lower plate 117. The mounting member 117a is converted to 200539314 16226pif.doc disk 117 /. Further, even in this embodiment, a cooling mechanism 19 for cooling the substrate w may be provided on the recovery tray 18. The substrate 20 and the horizontal lifting mechanisms 31 and 32 constitute a substrate conveying device. The same effect as that of the first embodiment can be achieved in the present example. In addition, since the mounting member 117a is clamped together with the substrate w, even if the positional relationship between w from the tray 17 to the recovery tray 18 is constant, there is no need to perform a special = position, for example, to place the substrate Wllu_box The operation of the 4G towel becomes easy. The present invention is not limited to the embodiments described above, and it is only necessary to detract from the characteristics. For example, in the present embodiment, for the explanation, the above ^ refers to the case where 3 pieces are used as a single miscellaneous county board. The case 2 described above is not a mosquito, and 3 ^ may be 丨 pieces or plural pieces. Moreover, The substrate transfer cracking is not limited to the board transfer from the unloading chamber 13 to the recycling station M ^^, and it can also be used to transfer the substrate from the processing chamber 12 to the unloading chamber 13. In addition, the substrate transfer apparatus of the present invention can also be used. When the substrate w is unloaded in the substrate unloading chamber, the substrate 14 is transferred by the station 14 or the substrate processing and loading unit. ^ The substrate transfer device of the present invention can also be used for substrate transportation in the station 14 and other than 10 in the substrate processing rack. The board of the place is transferred. As shown in FIG. 5, the substrate conveying device of the present invention can be installed and used in the station 14. As explained above, when the μ port of the recycling station is a predetermined space, the substrate is conveyed. Vibration can be set on the outside of the substrate processing millet and tender. In addition, in Fig. 5, the components that use the same structure 200539314 16226pif.doc as ^ are given the same symbols, and description is omitted. Although the present invention has been better The examples disclosed limit the invention, any I do n’t use it as a way to… .., rpi ^ A Hot white artists, without departing from the spirit of the present invention [Schematic description] Fan Xier ^ The overall consideration of the outline of the substrate processing device of the substrate transfer device. Is a perspective view of a chuck portion provided on the substrate transfer device according to the first embodiment of the present invention. Fig. 3 (a) ~ 3 (i) is a schematic configuration diagram of the structure of a substrate device according to the first embodiment of the present invention. Figures: (:) to 4 (i) are schematic configurations of the structure of a substrate transport and placement according to the second embodiment of the present invention. Fig. 5 is a schematic diagram showing the overall structure of a substrate handling device 5 according to an embodiment of the present invention and an external material placed on a substrate processing apparatus. [Description of main component symbols] 10,] 〇A: 基; 11 Loading chamber 12 Processing chamber 13 Unloading chamber 14 Recycling station 15-'17 Pallet 200539314 16226pif.doc 17a: Through hole 18: Recycling tray 19: Cooling mechanism 20: Chuck portion 20a: End portion 21: Horizontal drive mechanism 30 Plate 30a: Pins 31, 32: Lifting mechanism 40: Box portion 50: Suction section 117: Tray 117a: Mounting member 117b: Layered hole section 130: Lifting plate

Gl, G2, G3, G4: Gate W: Base plate yl, y2: Distance 18

Claims (1)

200539314 16226pif.doc 10. Scope of applying for patents ... The substrate in the handling device, the lion is placed on the processing tray and under the plate / dish, and is transported to the next plate. It is characterized by: The basis of the collection is from the form of money: the processing unit that holds the substrate on the processing tray and holds the substrate on the processing tray from the processing tray to the money scale member; Moving from the aforementioned processing tray to the front collection: transfer the substrate held on the aforementioned recycling tray / bu ... member using the aforementioned moving unit, to the aforementioned repatriation, as described in item 2 of the full-time application center The substrate is moved, and its special first transfer unit includes through-holes for lifting and lowering, and the top end of the lowering pin provided after the processing is reduced, and the protruding surface of the tray is verified. The a floating from the processing tray is ejected from the through hole of the processing tray to the lifting pin holding member. The substrate just transferred is transferred to the aforementioned storage, which is the substrate transfer device described in the second section of the application. 19 200539314 16226pif.doc The second lifting member H2 transfer unit included in the disk includes lifting the aforementioned recovery support by the aforementioned The second lifting member lifts and holds the holding member, moves it to the second back plate, and transfers it to the collection tray. The basic features of the solitary sacrifice are as follows: the substrate transfer device described in the application% patent_ item 1, which has the aforementioned processing minus the partial separation and the liftable transfer unit has the first mounting member that passes through the aforementioned processing. The lifting member, and the lifting member like a puertodon bracket, make the mounting member from the aforementioned processing and: after the rear end of the mounting member is connected with the aforementioned &, the first lifting member is lowered. The mounting member is transferred to the holding member together with the substrate, and the substrate is transferred to the substrate as described in item 4 of the patent application scope. The special member H2 transfer unit includes a second lifting and lowering mechanism for lifting the recovery tray. The second lifting member lifts and lowers the holding member of the recovery tray and is moved to the holding member, which is transferred to the recovery member together with the substrate, and is placed on the recovery device. The substrate 20 200539314 16226pif.doc conveying device according to any one of the items, wherein the recovery tray is provided with a function of performing a process on the substrate transferred from the processing tray. Cooling cooling unit. 7. The substrate conveying device according to item 1 of the patent claim, wherein the heat-resistant material forming the scale member is metal or ceramic. 8. The substrate conveying device according to item i of the patent scope, where: The aforementioned simple member is a tube with a rectangular cross-section and two ends open, and the lower and central parts are cut out. With central opening. The substrate conveying device according to item 8 in the "Qi Ruili" item, the diameter of the central opening of the Yang Yang substrate holding member-side length yl inch; soil, and the length y2 of one side of the holding member is greater than the ruler 10 of the substrate .- A substrate processing farm, comprising: a chamber for placing a substrate in a warming state on a processing tray of the substrate; and the substrate transfer application device according to any one of items M and 21. 21