200538258 柒、指定代表圖： (一) 本案指定代表圖為：第（3 )圖。 (二) 本代表圖之元件代表符號簡單說明： 3 本發明線鋸切割機 31 機台主體 32 滾輪系統 33 夾具組 34 移動機構 35 搖擺式機構 36 磨漿提供裝置 37 第一動力提供裝置 38 驅動軸 39 搖擺驅動裝置 40 控制裝置 50 工件 60 錄線 321 出料滾輪 322 收料滾輪 323,324,325 被動滾輪 354,355 導引頭 391 連桿 392 偏心塊 393 第二動力提供裝置 捌、本案若有化學式時，請揭示最能顯示發明特徵的化學式： (無） 玖、發明說明： 【發明所屬之技術領域】200538258 (1) Designated representative map: (1) The designated representative map in this case is: (3). (II) Brief description of the components of this representative diagram: 3 The wire saw cutting machine 31 of the present invention 31 machine body 32 roller system 33 fixture group 34 moving mechanism 35 swinging mechanism 36 refining providing device 37 first power providing device 38 drive Shaft 39 Swing drive device 40 Control device 50 Work piece 60 Feed line 321 Discharge roller 322 Take-up roller 323,324,325 Passive roller 354,355 Seeker 391 Link 392 Eccentric block 393 Second power supply device 捌 If there is a chemical formula in this case, please disclose The chemical formula that best shows the characteristics of the invention: (none) 玖. Description of the invention: [Technical field to which the invention belongs]
O:\91\9I626.DOC 200538258 本發明係關於一種線鋸切割機，特別是關於一種可切割 出曲線之線鋸切割機。 【先前技術】 參考圖1，顯示習用線鋸切割機之示意圖，該線鋸切割機 1包括複數個多溝滑輪11，12，13、一鋼線14及一磨漿（磨粒及 液體）15，該等多溝滑輪11，12，13係用以支撐該鋼線14成一 張力狀態，且以該鋼線14帶動該磨漿15對一硬脆材料（例 如一矽晶圓棒）16進行鋸切加工，而將該硬脆材料16同時 鋸切出許多薄片（例如一晶圓），且厚度幾乎完全相同。相 關於此種線鋸切割機之研究如下，Yamamoto [T· Yamamoto, Multi-wire slabbing of granite, Ind. Diam. Rev·，55(567) (1995) 179-181.]利用複式線鋸切割花崗石，得到很高的切削 效率。Contardi [G. L. Contardi, Wire saw beads economic production，Ind. Diam. Rev·，53 (558) (1993) 256-260·]以線 鋸切割精密陶瓷，比傳統内圓鑛的加工方法經濟。Kojima [M. Kojima, Development of new wafer slicing equipment, Sumitomo Met·，42 (4) (1990) 218-224·]提出高效率複式線 鑛切，用於精確切割矽石定成片狀的研究。Suwabe [H. Suwabe， K. I. Ishikawa, T. Miyashita, A study of the processing characteristics of a vibration multi-wire saw-regarding the effects of slurry composition, Int. Conf. Precis. Eng., Taipei, (1997) 253-256.]等人提出不同磨粒組合對線鋸切削加工效 率的影響。 積體光學（integrated optics)之光導波（wave guide)元件具O: \ 91 \ 9I626.DOC 200538258 The present invention relates to a wire saw cutting machine, and more particularly to a wire saw cutting machine capable of cutting a curve. [Prior art] Referring to FIG. 1, a schematic diagram of a conventional wire saw cutting machine is shown. The wire saw cutting machine 1 includes a plurality of multi-groove pulleys 11, 12, 13, a steel wire 14 and a refining slurry (abrasive particles and liquid) 15 The multi-groove pulleys 11, 12, 13 are used to support the steel wire 14 in a state of tension, and the steel wire 14 drives the refining slurry 15 to saw a hard and brittle material (such as a silicon wafer rod) 16 Cutting process, and sawing the hard and brittle material 16 into many slices (such as a wafer) at the same time, and the thickness is almost the same. The research related to this type of wire saw cutting machine is as follows. Yamamoto [T. Yamamoto, Multi-wire slabbing of granite, Ind. Diam. Rev., 55 (567) (1995) 179-181.] Granite, get very high cutting efficiency. Contardi [G. L. Contardi, Wire saw beads economic production, Ind. Diam. Rev., 53 (558) (1993) 256-260 ·] Cutting precision ceramics with a wire saw is more economical than the traditional method of processing inner circle ore. Kojima [M. Kojima, Development of new wafer slicing equipment, Sumitomo Met ·, 42 (4) (1990) 218-224 ·] proposed a high-efficiency double-line ore cutting for research on the precise cutting of silica into flakes. Suwabe [H. Suwabe, KI Ishikawa, T. Miyashita, A study of the processing characteristics of a vibration multi-wire saw-regarding the effects of slurry composition, Int. Conf. Precis. Eng., Taipei, (1997) 253- 256.] et al. Proposed the effect of different abrasive particle combinations on the cutting efficiency of wire saws. Wave guide components for integrated optics
O:\91\91626DOC 200538258 南靈敏度’不受電磁波干擾的影響，目此能制在各種環 境中’降低人類工作環境的危險。―般光導波是在石夕晶片 上沈積—層二氧化#(與光纖同材質）’因此傳播損失小且折 射率相互匹配。又由於平面光波導的製作是以半導體製程 進行，使其具有敎性佳、可量產、可積體化的特點，因 此被公認為是高密度波長多卫通訊系統（dedm)，光通訊系 統產業中的明日之星。 進行直線式的切割，如圖#切割線22所示，無法對該晶圓 2〇進行曲線式的切割，這是因為晶圓20及精密陶曼等硬脆 材料其破裂㈣遠低於金屬，所以切削加卫時，不像金屬 切削會產生塑性變形，而是以細微裂縫延伸的破裂方式產 生新表面，造成加工精度及曲線切割難以控制。以圖2方式 切割時’晶圓20上光導波元件21將無法緊密的排列，因而 參考圖2，顯示光導波元件於⑪晶片中之切^意圖。於 上述切割製程後之晶圓2吐，再進行半導體製程以製成光 導波兀件21 ’該光導波元件21在封裝前須先於晶圓20中經 由機械刀具的切割（dlcing)成片塊（若使用雷射切割溫度將 破壞元件的光學性能）。習用之切割方法係利用鑽石刀具切 割^其缺點在於，—般光導波幻㈣依需求呈現各種曲線 的設計，但是在錯石刀具切割該晶圓的過程中，刀具只能 在光導波元件之間會浪費許多排列空間，因而降低每片 圓20的產能。 * 因此，有必要提供一創新且富進步性的可㈣出曲線之 線鋸切割機，以解決上述問題。O: \ 91 \ 91626DOC 200538258 South sensitivity ’is not affected by electromagnetic wave interference, so it can be controlled in various environments’ to reduce the danger of human working environment. ―General light-guided waves are deposited on Shixi wafers—layer dioxide # (same material as optical fiber) ’, so the propagation loss is small and the refractive indices match each other. Because the manufacture of planar optical waveguides is carried out by a semiconductor process, it has the characteristics of good flexibility, mass production, and integration. Therefore, it is recognized as a high-density wavelength multi-demon communication system (dedm) and optical communication system. The star of tomorrow in the industry. For straight-line cutting, as shown in #cut line 22, it is impossible to cut the wafer 20 in a curved manner. This is because hard and brittle materials such as wafer 20 and precision Taumann have cracks much lower than metal. Therefore, when cutting and defending, unlike metal cutting, plastic deformation will occur, but new surfaces will be generated in a rupture mode with fine cracks extending, which makes it difficult to control the machining accuracy and curve cutting. When dicing in the manner of FIG. 2, the optical waveguide elements 21 on the wafer 20 cannot be closely arranged. Therefore, referring to FIG. 2, the cut intention of the optical waveguide elements in the wafer is shown. After the wafer 2 is spit after the above dicing process, a semiconductor process is performed to make an optical waveguide element 21 'The optical waveguide element 21 must be dlcing into wafers by mechanical tools in the wafer 20 before packaging ( If laser cutting temperature is used, the optical performance of the device will be destroyed). The conventional cutting method is to use a diamond cutter to cut ^ The disadvantage is that-the light guide wave is designed to show various curves according to requirements, but in the process of cutting the wafer by the wrong stone tool, the tool can only be between the light guide wave components. A lot of arrangement space will be wasted, thus reducing the productivity of each circle. * Therefore, it is necessary to provide an innovative and progressive wire saw cutting machine capable of drawing curves to solve the above problems.
O:\91\9t626DOC 200538258 【發明内容】 本發明之主要目 做曲線式之切割， 的係利用改良過後之線切割機來對工件 以符合設計上之需求。 . 本發明之另—Η & a & , t 的係k供一種可以於晶圓上切割出曲線 之線鋸切割機’以大量提昇每片晶圓的產㉟，降低生產成 本0 毛月之又目的係提供一種可切割出曲線之線鑛切割 機，包括：-機台主體、—滾輪系統、—夾具組、一移動 機構及一搖擺式機構。 边機台主體係用以作為本線鋸切割機整體之主要支撐結 構。該滾輪系統包括複數個滾輪，用以支撐一鋸線成一張 力狀態°該夾具組係用以炎持且旋轉-卫件。該移動機構 係用以支撐該夾具組，且可於該機台主體上做水平及垂直 方向之移動，以帶動工件移動。該搖擺式機構係與該機台 本體樞接，且具有二導引頭，該二導引頭係分別位於該工 件之二側，其係用以支撐且導引該鋸線，當該搖擺式機構 搖擺動作時，可使該鋸線接觸且切割該工件。 【實施方式】 參考圖3，顯示本發明較佳實施例之線鋸切割機之立體示 意圖，在本實施例中所切割之工件50係為一晶圓，該線鑛 切割機3包括：一機台主體31、一滾輪系統32、一夾具組33、 移動機構34、一搖擺式機構35、一磨渡提供裝置36、一 微細放電裝置（圖中未示）、一第一動力提供裝置37、一驅 動軸38、一搖擺驅動裝置39及一控制裝置4〇。O: \ 91 \ 9t626DOC 200538258 [Summary of the invention] The main purpose of the present invention is to perform curved cutting, which uses a modified wire cutting machine to meet the design requirements of the workpiece. Another aspect of the present invention—Η & a & t is a wire saw cutting machine that can cut curves on wafers to greatly increase the yield of each wafer and reduce production costs. 0 gross month Another object is to provide a wire ore cutting machine that can cut curves, including:-the machine body,-the roller system,-the fixture set, a moving mechanism and a swinging mechanism. The main system of the side table is used as the main supporting structure of the whole wire saw cutting machine. The roller system includes a plurality of rollers for supporting a saw wire into a force state. The clamp system is used to hold and rotate the guard. The moving mechanism is used to support the fixture group, and can move in the horizontal and vertical directions on the machine body to drive the workpiece to move. The swing mechanism is pivotally connected to the machine body, and has two guide heads, which are respectively located on two sides of the workpiece, and are used to support and guide the saw wire. When the mechanism swings, the saw wire can contact and cut the workpiece. [Embodiment] Referring to FIG. 3, a three-dimensional schematic diagram of a wire saw cutting machine according to a preferred embodiment of the present invention is shown. In this embodiment, the workpiece 50 to be cut is a wafer. The wire mine cutting machine 3 includes: a machine The table main body 31, a roller system 32, a clamp group 33, a moving mechanism 34, a swing mechanism 35, a grinding mechanism providing device 36, a micro discharge device (not shown in the figure), a first power providing device 37, A driving shaft 38, a swing driving device 39 and a control device 40.
O:\91\91626.DOC 200538258 忒機台主體3 1係用以作為該線鋸切割機3整體之主要支 撐結構。該滾輪系統32包括斗滾輪321、—收料滾輪 322、複數個被動滾輪323, 324, 325, 326及複數個張力調整 滾輪，其中該出料滾輪32丨係用以纏繞該鋸線6〇 (例如一鋼 線）’孩等被動滾輪323, 324, 325, 326係位於該搖擺式機構 35上，用以支撐泫鋸線6〇，該收料滾輪322係用以捲收已切 割後之鋸線60。 參考圖4,顯示圖！中該等張力調整滾輪、出料滾輪及收 料滾輪之立體不意圖。該等張力調整滾輪係用以調整該鋸 線60之張力，其依序包括一第一調整滾輪327、一第二調整 滾輪328及一第三調整滾輪329，其中該第一調整滾輪327及 第二凋整滾輪329係固設於該機台主體31上，該第二調整滾 輪328係透過一調整機構與該機台主體31相樞接。該調整機 構包括一移動桿3 11、一彈性體3 12 (例如一彈簧）及一固 疋座313，該固定座313係固設於機台主體31，該移動桿311 之一端係固设该第二調整滾輪328，另一端係透過該彈性體 3 12而頂抵该固定座3 1 3，移動桿3 11上固設有一螺桿3 1丨i， 透過調整該螺桿3 111之位置可以調整至所需之張力。 泫第一動力提供裝置37 (例如一步進馬達）係用以驅動 該驅動軸38 ,在本實施例中，該出料滾輪321及該收料滾輪 3 22係皆位於該驅動軸38上，且同時接受該第一動力提供裝 置3 7之驅動。 參考圖5及圖6,顯示圖1中該夹具組及該移動機構之立體 示意圖。該夾具組33包括一失持具331、二壓克力板332,O: \ 91 \ 91626.DOC 200538258 The machine body 3 1 is used as the main supporting structure of the wire saw cutting machine 3 as a whole. The roller system 32 includes a bucket roller 321, a receiving roller 322, a plurality of passive rollers 323, 324, 325, 326, and a plurality of tension adjusting rollers, wherein the discharging roller 32 is used to wind the saw wire 60. For example, a steel wire) The passive rollers 323, 324, 325, and 326 are located on the swing mechanism 35 to support the sawing wire 60, and the receiving roller 322 is used to wind the saw after cutting. Line 60. Refer to Figure 4, the display! These three-dimensional tension adjusting rollers, discharge rollers and receiving rollers are not intended to be three-dimensional. The tension adjusting rollers are used to adjust the tension of the saw wire 60, and include a first adjusting roller 327, a second adjusting roller 328, and a third adjusting roller 329 in this order. The first adjusting roller 327 and the first adjusting roller 327 Two withering rollers 329 are fixed on the machine body 31, and the second adjusting roller 328 is pivotally connected to the machine body 31 through an adjusting mechanism. The adjusting mechanism includes a moving rod 3 11, an elastic body 3 12 (for example, a spring), and a fixed base 313. The fixed base 313 is fixed to the machine body 31, and one end of the moving rod 311 is fixed to the The second adjustment roller 328, the other end of which is against the fixed base 3 1 3 through the elastic body 3 12, a screw 3 1 丨 i is fixed on the moving rod 3 11, and the position of the screw 3 111 can be adjusted to Required tension.泫 The first power supply device 37 (for example, a stepping motor) is used to drive the driving shaft 38. In this embodiment, the discharging roller 321 and the receiving roller 3 22 are both located on the driving shaft 38, and At the same time, it is driven by the first power supply device 37. Referring to Figs. 5 and 6, three-dimensional schematic diagrams of the fixture group and the moving mechanism in Fig. 1 are shown. The fixture group 33 includes a misalignment 331, two acrylic plates 332,
O:\9t\91626.DOC 200538258 333、複數個夾片334(圖6中僅以一個夾片示意）、一旋轉台 335、一基座336、二樞接軸33 7，338及一移動座339。該工 件50係先夾在於該二壓克力板332, 333之間，之後再以該等 夾片334將該二壓克力板332, 333扣緊，然後再利用該夾持 具331夾持該二壓克力板332, 333之下端。該夹持具331係固 設於該一旋轉台335上，而該旋轉台335係利用該二樞接軸 3 3 7, 338與該基座336相樞接。該二樞接轴337, 338係與該晶 圓同心，且其係利用一步進馬達（圖中未示）帶動而轉動， 因而可使該工件50以該二樞接軸337，338為中心而左右轉 動。該基座336係固設於該移動座339上，可隨著該移動座 339之移動而移動。 該移動機構34包括一水平平台341及一垂直平台342，該 水平平台341具有一執道以供該移動座339於其上做水平方 向之直線移動，該水平平台341係為一柱狀結構，其一端為 自由端，另一端於該垂直平台342上做垂直方向之直線移 動。 參考圖7，顯示圖1中搖擺式機構之立體示意圖。該搖擺 式機構35係為一框架外型，其包括二導引桿35丨，352及一轉 動桿353，該等導引桿351，352之前端分別具有導引頭354, 355，該二導引頭354，355係分別位於該工件50之二側，其 係用以支撐且導引該鋸線60。該轉動桿353係位於該等導引 桿351，352中間，且可轉動地設於該機台本體31之二支樓检 314, 315 上。 該導引桿352之上方固設一前固定桿356，該前固定桿356 O:\91\91626.DOC -9- 200538258 之二端分別固設-被動滾輪323, 324。該導引桿⑸之上方 固設-後固定桿357，該後固定桿357之二端分別固設一被 動滾輪325, 326。 該搖擺驅動裝置39包括一連桿391、一偏心塊州及一第 二動力提供裝置393，該連桿391之_端係樞接該搖擺裝置 35之該導引桿352，另一端係樞接該偏心塊392，該偏心塊 392係固定於該第二動力提供裝置393。該第二動力提供裝 置393轉動時，該連桿391拉動該導引桿352，可使該搖擺裝 置3 5以該轉動桿3 5 3為中心而前後擺動，如圖8所示。當該 搖擺式機構35搖擺動作動，可使該二導引頭354, 355間之鋸 線60接觸且切割該工件5〇。 再參考圖3，該磨漿提供裝置36係固設於該機台主體3 ! 上’其係用以提供磨衆（磨粒及液體）至該鑛線與該工 件50接觸處。該微細放電裝置係用以對該鋸線6〇於進入與 該工件5 0接觸處之前做微細放電，如此造成鋸線6〇產生變質 層’增加鑛線60抗磨耗能力，並由於微細放電所產生的微細孔 洞正好提供磨粒的施力空間，可進一步提昇切削效率。該 控制裝置40係電氣連接該滾輪系統32、該夾具組33、該移 動機構34及該第二動力提供裝置393，以控制該鋸線60之速 度及該工件50之進給。 本發明之作動過程如下，首先，將成捲之鋸線60從該出 料滾輪321拉出，依序穿過該二被動滾輪323,324、該二導 引頭354,355、該二被動滾輪325,326、該第一調整滾輪327、 該第二調整滾輪328及該第三調整滾輪329，最後由該收料 O:\91\91626.DOC -10- 200538258 滾輪322所捲收。 之後、，二由搖擺式機構35之二導引頭354,355之引導，及 配合該夹具組33及該移動機構34之相對移動，使該鋸線6〇 與。亥工件50接觸。接著，利用磨聚提供裝置％提供磨料及 液體，同時驅動該驅動軸38以帶動該出料滾輪321及該收料 滾輪322，且同時驅動該第二動力提供裝置393以帶動該搖 擺式機構35 ’藉此’帶動磨製中的磨料，對該工件50進行 搖擺式切割。 由於當鋸線6G進行搖擺切割時其張力會產生變化（即忽 緊心氣）使得切割無法進行，因此必需增設該等張力調整 滾輪（即.亥第一凋整滾輪327、第二調整滾輪328及第三調 整滾輪329 )及該調整機構（即該移動桿3ιι、彈性體⑴及 固定座313)以做為補正該鋸線6〇張力變化之用，使鋸線的 維持張緊的狀態，如此才有切割效用。 接著運用。玄第-動力提供裝置37的作動，提供鋼線進 給，而該驅動軸38與該第-動力提供裝置37間係以一比一 之時規齒輪帶動’使該驅動轴38產生往復轉動，進而提供 鑛線6〇往復切割的動力。該第-動力提供裝置37由該控制 裝置40所控制’其可設定切割衝程、鑛線進給及鑛線速度 等。 在切割過程中，該控制裝置4〇還需控制水平平台341及垂 直平。342以控制該工件5〇之位置，同時該控制裝置控制 該夾具組33以旋轉該工件5G ’使得該工件％與鑛線6〇於切 割時成正交接觸，且保持切削路徑於鋸線6〇之正下方（如此O: \ 9t \ 91626.DOC 200538258 333, a plurality of clips 334 (only one clip is shown in FIG. 6), a rotating table 335, a base 336, two pivot shafts 33 7, 338, and a moving seat 339. The workpiece 50 is clamped between the two acrylic plates 332 and 333, and then the two acrylic plates 332 and 333 are fastened by the clips 334, and then clamped by the clamp 331 The lower ends of the two acrylic plates 332, 333. The holder 331 is fixed on the rotary table 335, and the rotary table 335 is pivotally connected to the base 336 by the two pivot shafts 3 3 7, 338. The two pivot axes 337, 338 are concentric with the wafer, and they are rotated by a stepping motor (not shown), so that the workpiece 50 can be centered on the two pivot axes 337, 338. Turn left and right. The base 336 is fixed on the moving base 339 and can move with the movement of the moving base 339. The moving mechanism 34 includes a horizontal platform 341 and a vertical platform 342. The horizontal platform 341 has a guide for the moving base 339 to move linearly in the horizontal direction. The horizontal platform 341 is a columnar structure. One end is a free end, and the other end moves linearly in a vertical direction on the vertical platform 342. Referring to FIG. 7, a schematic perspective view of the swing mechanism in FIG. 1 is shown. The swing mechanism 35 has a frame shape and includes two guide rods 35 丨, 352 and a rotating rod 353. The front ends of the guide rods 351, 352 have guide heads 354, 355, respectively. Leads 354 and 355 are respectively located on two sides of the workpiece 50 and are used to support and guide the saw wire 60. The rotating rod 353 is located between the guide rods 351, 352, and is rotatably provided on the two inspections 314, 315 of the machine body 31. A front fixing rod 356 is fixed above the guide rod 352, and two ends of the front fixing rod 356 O: \ 91 \ 91626.DOC -9- 200538258 are fixed-passive rollers 323 and 324, respectively. Above the guide rod ⑸, a rear fixing rod 357 is fixed, and two ends of the rear fixing rod 357 are fixed with driven rollers 325 and 326, respectively. The swing driving device 39 includes a connecting rod 391, an eccentric block, and a second power supply device 393. The _ end of the connecting rod 391 is pivotally connected to the guide rod 352 of the swinging device 35, and the other end is pivoted. The eccentric block 392 is fixed to the second power supply device 393. When the second power providing device 393 rotates, the link 391 pulls the guide rod 352, so that the swinging device 35 can swing back and forth with the rotating rod 3 5 3 as the center, as shown in FIG. 8. When the rocking mechanism 35 moves, the saw wire 60 between the two guides 354, 355 can contact and cut the workpiece 50. Referring again to FIG. 3, the refining providing device 36 is fixed on the main body 3! Of the machine. It is used to provide mills (abrasive particles and liquid) to the contact point of the ore line and the workpiece 50. The micro-discharge device is used to perform micro-discharge on the saw wire 60 before entering the contact with the workpiece 50. This causes the saw wire 60 to produce a deterioration layer, which increases the wear resistance of the mine wire 60, and due to the micro discharge The micro-holes created just provide the space for the abrasive particles to exert force, which can further improve the cutting efficiency. The control device 40 is electrically connected to the roller system 32, the clamp group 33, the moving mechanism 34, and the second power supply device 393 to control the speed of the saw wire 60 and the feed of the workpiece 50. The operation process of the present invention is as follows. First, the coiled saw wire 60 is pulled out from the discharge roller 321 and sequentially passes through the two passive rollers 323, 324, the two guides 354, 355, the two passive rollers 325, 326, the first An adjustment roller 327, the second adjustment roller 328, and the third adjustment roller 329 are finally rolled up by the reel O: \ 91 \ 91626.DOC -10- 200538258 roller 322. After that, the two are guided by the two guide heads 354, 355 of the swinging mechanism 35, and the relative movement of the clamp group 33 and the moving mechanism 34 is made to make the saw wire 60 and. The workpiece 50 is in contact. Next, the abrasive and liquid supply device is used to provide abrasive and liquid, and the driving shaft 38 is driven to drive the discharge roller 321 and the take-up roller 322, and the second power supply device 393 is also driven to drive the swing mechanism 35 'This' drives the abrasive during grinding to perform a swing-type cutting of the workpiece 50. Since the tension of the saw wire 6G is changed when it is swinging (that is, it is suddenly strained) and the cutting cannot be performed, it is necessary to add such tension adjusting rollers (ie, the first adjusting roller 327, the second adjusting roller 328, and The third adjustment roller 329) and the adjustment mechanism (that is, the moving rod 3m, the elastic body ⑴ and the fixed seat 313) are used to correct the tension change of the saw wire 60, so that the saw wire is maintained in a tensioned state. Only cutting effect. Then use it. The operation of the mysterious power supply device 37 provides steel wire feed, and the driving shaft 38 and the first power supply device 37 are driven by a one-to-one time gauge gear to cause the driving shaft 38 to reciprocate, In addition, it provides motive power for reciprocating cutting of the ore line 60. The first power supply device 37 is controlled by the control device 40, and it can set cutting strokes, line feed, line speed, and the like. During the cutting process, the control device 40 also needs to control the horizontal platform 341 and the vertical plane. 342 to control the position of the workpiece 50, and the control device controls the clamp group 33 to rotate the workpiece 5G 'so that the workpiece% makes orthogonal contact with the mining line 60 while cutting, and keeps the cutting path at the saw line 6 Right below 〇 (So
O:\9l\9l626 DOC • 11 - 200538258 才具有切削能力），以完成工件50上複雜曲線之切割。 上述實施例僅為說明本發明之原理及其功效，並非限制 本發明。因此習於此技術之人士對上述實施例進行修改及 變化仍不脫本發明之精神。本發明之權利範圍應如後述之 申請專利範圍所列。 【圖式簡單說明】 圖1顯示習用線鋸切割機之示意圖； 圖2顯示光導波元件於矽晶片中之切割示意圖； 圖3顯示本發明較佳實施例之線鋸切割機之立體示意圖； 圖4顯示圖3中張力調整滾輪、出料滾輪及收料滾輪之立 體示意圖； 圖5顯示圖3中夾具組及移動機構之立體示意圖； 圖6顯示圖3中夾具組之立體示意圖； 圖7顯示圖3中搖擺式機構之立體示意圖；及 圖8顯示圖7之搖擺式機構之作動示意圖。 【圖式元件符號說明】 1 習用線鋸切割機 本發明線鑛切割機 U’12，13 多溝滑輪 14 鋼線 15 磨漿 16 硬脆材料 20 晶圓 21 光導波元件 O:\9l\9l626.DOC . _ 200538258 22 31 32 33 34 35 36 37 38 39 40 50 60 311 3111 312 313 314,315 321 322 323,324,325,326 327 328 329 切割線 機台主體 滾輪系統 夹具組 移動機構 搖擺式機構 磨漿提供裝置 第一動力提供裝置 驅動轴 搖擺驅動裝置 控制裝置 工件 鋸線 移動桿 螺桿 彈性體 固定座 支撐柱 出料滾輪 收料滾輪 被動滾輪 第一調整滾輪 第二調整滾輪 第三調整滾輪 O:\91\9I626.DOC -13 - 200538258 331 夾持具 332,333 壓克力板 334 夾片 335 旋轉台 336 基座 337,338 才區接轴 339 移動座 341 水平平台 342 垂直平台 35 1,352 導引桿 353 轉動桿 354,355 導引頭 356 前固定桿 357 後固定桿 391 連桿 392 偏心塊 393 第二動力提供裝置 O:\91\91626.DOC - 14 -O: \ 9l \ 9l626 DOC • 11-200538258 only has cutting ability) to complete the cutting of complex curves on the workpiece 50. The above embodiments are only for explaining the principle of the present invention and its effects, but not for limiting the present invention. Therefore, those skilled in the art can still modify and change the above embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be as listed in the patent application scope mentioned later. [Brief description of the drawings] FIG. 1 shows a schematic diagram of a conventional wire saw cutting machine; FIG. 2 shows a schematic diagram of cutting a light guide element in a silicon wafer; 4 shows the three-dimensional schematic diagram of the tension adjusting roller, the discharge roller and the receiving roller in FIG. 3; FIG. 5 shows the three-dimensional schematic diagram of the clamp group and the moving mechanism in FIG. 3; FIG. 6 shows the three-dimensional schematic diagram of the clamp group in FIG. 3; 3 is a schematic perspective view of the swinging mechanism in FIG. 3; and FIG. 8 is a schematic view showing the operation of the swinging mechanism in FIG. [Illustration of Symbols of Schematic Elements] 1 Conventional wire saw cutting machine The wire ore cutting machine of the present invention U'12, 13 Multi-groove pulley 14 Steel wire 15 Refining 16 Hard and brittle material 20 Wafer 21 Optical waveguide device O: \ 9l \ 9l626 .DOC. _ 200538258 22 31 32 33 34 35 36 37 38 39 40 50 60 311 3111 312 313 314,315 321 322 323,324,325,326 327 328 329 Thread cutting machine main body roller system fixture group moving mechanism swinging mechanism refining device first power Provide device drive shaft swing drive device control device workpiece saw wire moving rod screw elastomer fixed seat support column discharge roller receiving roller passive roller first adjustment roller second adjustment roller third adjustment roller O: \ 91 \ 9I626.DOC- 13-200538258 331 Clamps 332,333 Acrylic plates 334 Clips 335 Rotary table 336 Base 337, 338 Column joints 339 Moving base 341 Horizontal platform 342 Vertical platform 35 1,352 Guide rod 353 Rotation rod 354,355 Guide head 356 Front fixing Rod 357 Rear fixing rod 391 Connecting rod 392 Eccentric block 393 Second power supply device O: \ 91 \ 91626.DOC-14-